RoHS等环保法规简介

RoHSCooperDec.21,20042Outline‰WEEE&RoHSdirectives‰ImpactofLead-FreeProcess‰XRFOptions‰RoHSRequest&Schedule‰念‰3¾塞理量龍數殺聯鹿丹4•-WastefromElectricalandElectronicEquipment(WEEE)令TheWEEEdirectiverequiresmanufacturerstoassumesolefinancialresponsibilityforthecollection,sorting,treatmentandrecoveryofend-of-lifeelectronicequipment,including“historic”productssoldlongbeforetheissuanceoftheDirective.-RestrictiononHazardousSubstances(RoHS)-令TheROHSproposal,initscurrentform,banstheuseofcertaincriticalsubstances[1]inelectricalandelectronicproductsby2006.Note:Substancesincludelead(Pb),mercury(Hg),cadmium(Cd),hexavalentchromium(Cr+6),polybrominatedbiphenyls(PBB)andpolybrominateddiphenylether(PBDE).EUROPE:WEEE&RoHSdirectives5TakethebackgroundofdrivingforcefromAstro(June,2003)asthereference•TheEuropeanUnionrecentlyadoptedtheRestrictionofHazardousSubstancesDirective2002/95/EC(hereafterreferredtoasROHS)whichbanstheuseoflead(),Mercury(),cadmium(),hexavalentchromium(六),polybrominatedbiphenyls(PBB)-(聯,andpolybrominateddiphenylethers(PBDE)-(inelectronicproductsbyJuly1,2006.•Astrostronglysupportseffortstocreateenvironmentallyfriendlyandsustainableproducts.BecauseofproductlifetimesandthehighreliabilityrequirementsofAstroproducts,weneedtoprepareoursuppliersandourselveswellinadvancetoensureasuccessfultransitionto“lead-free”and“ROHScompliant”productsbyJuly1,2006.ROHSdirectives2002/95/EC6ImpactofRoHSProcessComponentComponentCurrentEquipmentcapabilityCurrentEquipmentcapabilitySolderabilitySolderabilityCostCostImpactReliabilityReliability7RoHS路SMDPVC老料PVCCRT度relaysandswitches療數理,料料PBDEPBB()路連RoHS8¾XRFOptionsApplytoRoHS(RestrictionoftheUseofCertainHazardousSubstancesinElectrical&ElectronicEquipment)48Cd82Pb80Hg24Cr6+35Br...AccurateandrepeatableforEEEsformedvariousorsmallshape,printedpoint.EasysetwithXRF.金12Mg20Ca17Cl...Unknowns,researchScreeningrapidly9量(金)¾CdPbHgCr+6PackingNiReferenceEU100100010001000---Microsoft7510051000100100H00594FApple550230060-069-0135-DSony51005-100-SS-00259Dell501005100100-6T-198Panasonic75---100-Ver.2.1Motorola100100100100100100GS2257BENQ59000100--TCO’035502---TCOD1023Foxconn510002100--10量類MicrosoftAppleSonyDellPanasoicMotorolaBENQFoxconn聯PBB/PBDE1000100005-10000聯PCB0005010000AZO30300-1000100000asbestos1000100000100010000dioxines00--0--蠟CP100010000100001000-0CFC000-010000O-tin10000-1000100000靈Mirix------0-奈PCN000---00Formaldehyde08005--00PVC--TBD---0-11•理83/264/EEC5.聯聯/聯類PBBs,PBDEsandPBBEsUSEPA3060A&7196A4.六Hexavalent-Chromium(Cr6+)CompoundsUSEPA30523.Mercury(Hg)itsCompoundsUSEPA3050B2.Lead(Pb)&itsCompoundsEN1122-2001,91/338/EEC1.Cadmium(Cd)&itsCompoundsMethodUsedTestingItem12RoHS2004Q12005Q12006Q1Q2Q3Q4Q2Q3Q4Q2Q4RoHSComplianceduedayPb-Freeprocessreadyforpilot-runFirstPb-Reducedproducttry-runIntelPb-FreecomponentsReadyforMPAllMFGsitesarereadyforPb-FreeProcessFirstPb-FreeProductMPAllnewprojectsarePb-Freedesign90%productsPb-FreeSupportPb-ReducedOEM/ODMforsystemproductsbycustomer’srequest50%productsPb-FreeAllPb-FreeToday13ROHSSupplyChainManagementMilestone2/13/200312/1/20031/E/20042/20/2004FirstsurveyingSupplyChainstatusWistronROHScriteriadefinedROHSpromotionIn2004vendorconferenceWEEE&RoHSDirectiveannounced10/31/2003Meetingwithvendorsforpreliminarydiscussion5/31/200410/31/200412/31/20041/1/2005ROHSdatabasefinishedSupplierofferDisuseCertificateSupplierrequestedtoofferMSDS,SGSreport7/31/2004ROHScomponentDatabasebuiltupROHSsupplier&componentReady3/15/2004IssueROHSQuestionnaire14Lessthan1000ppmPBDEsLessthan1000ppmPBBsLessthan1000ppmHexavalentchromium(Cr6+)Lessthan1000ppmMercury(Hg)Lessthan100ppm91/338/EECCadmium(Cd)Lessthan1000ppm.(Pbcontentofotheralloys:2002/95/ECSteel:3500ppm;Alalloy:4000ppm;Cualloy:40000ppm)Lead(Pb)RoHSRequirementsConceptionofGreenPartnerG.P.念Cooper16綠綠理念理念度來類臨諾力來17WhensearchingforcomponentpartsCompositionTableorMSDSGreenPartnerChainSubmittingdocumentsRawmaterialsupplier料MeasurementDataPartssupplier零ManufacturerCustomerCompositionTableorMSDSMeasurementDataApplicablepartslistMeasurementDataCertificateofNon-use(forpartsapproval/authorization)WhenstartingmassproductionWhenmakingachangeCertificateofNon-use(forpartsproductionofparts)ChangeNoticeSheetandAlldocumentsdescribedabove)ChangeNoticeSheetandAlldocumentsdescribedabove)ChangeNoticeSheetandAlldocumentsdescribedabove)CertificateofNon-use(forproduction)ByRequestMSDS:MaterialSafetyDataSheet18力立金綠來理料19力力立立力諾綠料綠理20力諾*不綠料量數立内立料料不力21P7力力“”金菉類類類類類類參說22料料料料红綠例來律連P823P924料念不不行断料來行量了••25Sectro料料26不3.數不列料*别4.料没不没料不P1327理•理•理理行理–立–列不零料–量零料量•–理()–理()–料理()28ComponentRequirementforLead-FreeProcessCooper29年識零立年不量Lead-Free(Pb1000ppm)綠年良率來力30ComponentSelectionPbContentandProcessCompatibility•Pbcontent*–LeadinSolderwith1000ppmleadimpurity.量•Processcompatibility–BGAballs:RequireSnAgCu.–Othercomponentterminationselections:•Fornon-BGAcomponents,useonlyPb-freefinishesthatarecompatiblewithbothSnPbandPb-freeprocesses.•SnZnandSnBifinishesarenotused.•Otherfinishesareaccepted,iftheypasssolderjointreliabilitytesting.–Moisturesensitiveparts31ForSMTtypecomponent:MustSurvivethree15~2