PCB制程能力尺寸公差设计规范-相互

項次製程類別備註樣品階段4u(min)/8u(min)/12u(min)/16u(min)8u(min)/12u(min)/16u(min)//20u(min)8u(min)/12u(min)/16u(min)//20u(min)/30u(min)黑色0.022mm,銀色0.032mm銀色銀箔較優但較厚黑色銀箔較薄但較易括傷---因少了保護膜厚度0.0277/0.0377/0.05/0.06/0.11……..限制:盲孔縱橫比0.5/1(介層厚度+銅厚/孔徑需0.5)FPCBRigid-FlexAllTypes限制:孔徑需=或板厚(否則:易斷針)13Air-GapFPCB&Rigid-FlexMin.1.5mmMin.1.0mm(成本較高)軟硬結合板Min.0.35mm/硬板Min.0.45mm以上V-cut線長度須大於10mm(避免斷裂)依客戶要求依客戶要求避免Laser孔偏移,需增加管制站做技術管控0.1mmAllTypes底銅AnnularRing(最佳值)0.15mm以上(附件9.1)12橢圓孔鑽孔AllTypes孔徑長寬比限制18Laser孔之底銅要求底銅AnnularRing(Min)是否有能力製作埋孔孔徑Min.0.15mm孔徑成品孔徑公差線寬至少0.15mm線距至少0.1mm(線寬小於0.15大於0.1者須增加成本改L/Q製程)線寬/線距Min.0.1mm雷射切割YES是否提供複合板脖子硬板剝板硬-軟-軟-硬YES硬-硬-軟-軟YES是否有能力製作埋孔YES(但疊構有限制)YES(但疊構有限制)是否有能力製作盲孔硬-軟-硬-硬或硬-硬-軟-硬YES厚度Min.0.5mil(0.013mm)YES貼附公差+/-0.3mm厚度依客戶要求銀鉑貼附公差+/-0.3mm厚度0.022mm/0.032mmYES銀漿鋪刷公差+/-0.25mm3mil文字大小2.5*2.5mm厚度依客戶要求YES一般8u電解電鍍軟金一般12u防焊漆厚度Min.0.4mil電解電鍍硬金一般12u文字線寬0.15mm偏移量公差0.2mm是否提供鋼板貼附YES鋼板貼附公差+/-0.2mm限制:客戶原稿設計至少線寬線距5mil/5mil---如COB面有盲孔設計者客戶原稿設計至少線寬線距5.5mil/5.5mil左列僅供參考---實際依客戶設計為主依相互PCB尺寸公差規範表軟硬結合板盲埋孔限制:依相互軟硬板設計規範--(12)(13)規定設計YES依相互PCB尺寸公差規範表+/-0.15mmMin.0.15mm長度需或=寬度之兩倍(低於兩倍容易歪斜)依相互最薄板厚限制公差表一般2~5u項目能力是否有FR4製作能力YESYES是否有BT製作能力YES是否有陶瓷基板製作能力NOFPCB&Rigid-Flex軟硬板疊構方式Rigid-Flex是否有FR5製作能力一般化金化學軟金(厚化金)偏移量公差是否提供銀鉑貼附是否提供銀漿鋪刷是否提供PI貼附456盲埋孔鋼板貼附印文字銀鉑貼附PI貼附(Coverlay)10123板材材質AllTypes鍍金防焊漆相互PCB製程能力表(PCBincludeHDI&FPC&RigidFlex)789FPCB&Rigid-Flex鋪刷銀漿FPCB&Rigid-FlexFPCBAllTypesAllTypesMin.0.8mm孔徑11PCB鑽孔孔徑一般硬板軟硬結合板YESYES是否有能力製作盲孔是否有能力製作Air-GapV-CUT刀角角度V-CUT尺寸偏移公差外型及其它尺寸公差V-CUT板厚依相互PCB尺寸公差規範表成品孔徑公差AllTypesAllTypesMax厚度AllTypesV-CUT殘厚要求微連結點撈槽槽寬依相互V-CUT規範表COBCOB金線拉力保證厚度外型1415Min.厚度最佳值3.0mm最佳值1.5mmMin.0.45mmYES17BGAPADpitch(min)0.5mmAllTypes16限制1:蝕刻銅厚1oz以下之產品,限制2:當pitch=0.5mm其線路pad只能設0.32,mask0.37故成品BGA之pad為0.24mm(min)--需告知客戶PAD大小+/-20%Min.0.2mm限制1:通孔綜橫比5/1(板厚/孔徑需或=5.0)限制2:盲孔(介層厚度+銅厚/孔徑需0.5)5g以上Max.3.2mm厚度公差依相互PCB尺寸公差規範表30度+/-5度第1頁，共13頁項次製程類別備註一般硬板軟硬板軟板一般硬板軟硬板軟板及薄板(0.25以下)一般硬板軟硬板軟板一般硬板軟硬板軟板一般硬板軟硬板軟板一般硬板軟硬板軟板一般硬板軟硬板軟板一般硬板軟硬板軟板MinMinMinMinMinMinMinMinMin硬板開模:硬板成型邊緣會有毛邊現象軟板或PI補強板使用CNC成型會有嚴重毛邊李素貞版序:BAnnularRing(Min)單邊0.1mmAnnularRing(Min)單邊0.15mm單邊0.065mmMin單邊0.065mmMin單邊0.1mm20線路PAD大孔AnnularRing(Min)單邊0.1mmE成型邊至成型邊27黑漆防焊距線Min黑漆防焊大PADMinA金手指線寬C手指中心至成型邊C手指中心至成型邊軟板E成型邊至成型邊D手指中心至中心D手指中心至中心D手指中心至中心E成型邊至成型邊+/-0.03量產必需開鋼模+/-0.075D30mm公差+/-0.03(D30mm公差+/-0.1%)量產必需開鋼模　+/-0.07530A金手指線寬A金手指線寬B金手指PitchB金手指PitchB金手指Pitch0.1mm+/-0.03(限制:原稿線距至少0.12５)限制:原稿線路PAD與PAD之間距至少0.25mm(不足0.25時需建議客戶開天窗不作隔線下墨)0.08mm0.08mm0.1mmNPT孔邊-成型邊PTH孔邊-成型邊26MinMinMin黑漆防焊檔條(隔線)MinMinMin2425212223MinMin綠漆防焊大PAD當客戶原稿設計已無補線寬之補償空間時須另外協定規格(工程問題回饋單)當客戶原稿設計已無補線寬之補償空間時須反應客戶修改Layout(工程問題回饋單)+/-20%+/-10%+/-20%+/-20%1oz~2oz+/-20%19線寬/線距(蝕刻後)公差1oz~2oz阻抗板Hoz1oz~10ozHozHozMinMin項目能力線寬/線距(蝕刻後)規格一般硬板(含厚銅板)軟硬板軟板+/-20%+/-20%綠漆防焊距線綠漆防焊檔條(隔線)0.08mm0.08mm0.1mmMinMin線路距成型線MinMinAllTypes0.13限制:原稿線路PAD與PAD之間距至少0.3mm(不足0.3時需建議客戶開天窗不作隔線下墨)Min0.2mmPTH孔邊-軟硬板交接處0.125mm0.15mmNPT孔邊-NPT孔邊板厚1.0mmPTH孔邊-PTH孔邊板厚0.5~1.0mmPTH孔邊-PTH孔邊單邊0.075mm單邊0.075mm單邊0.1mm金手指規格與公差0.25mm0.5mm0.35mm0.3mm0.25mm相互PCB製程能力表(PCBincludeHDI&FPC&RigidFlex)C手指中心至成型邊+/-0.25mm+/-0.03(限制:原稿線距至少0.12５)CNC成型+/-0.1(開鋼模+/-0.075)+/-0.03+/-0.03CNC成型+/-0.1/開鋼模+/-0.075D30mm公差+/-0.03(D30mm公差+/-0.1%)+/-0.1+/-0.03(限制:原稿線距至少0.12５)D30mm公差+/-0.03(D30mm公差+/-0.1%)+/-0.2mm2007/11/29+/-0.1FR-4板補強板偏位公差一般硬板軟硬板29PI補強板(條貼)偏位公差補強板28孔邊與成型邊之安全距離板厚0.5mm以下PTH孔邊-PTH孔邊第2頁，共13頁(附件9.2)CL0.0277CL0.0377橘MASK0.025MASK0.025C面Cu0.33oz+0.6mil0.027Cu0.5oz+0.6mil0.033Cu0.5oz+0.7mil0.035Cu0.5oz+0.7mil0.035PI0.025PI0.025FPC40.08FR40.07S面Cu0.33oz+0.6mil0.027Cu0.5oz+0.6mil0.033Cu0.5oz+0.7mil0.035Cu0.5oz+0.7mil0.035CL0.0277CL0.0377橘MASK0.025MASK0.025總厚度0.13440.16640.20.19公差0.13+/-0.030.17+/-0.030.2+/-0.040.19+/-0.04CL0.0277CL0.0377MASK0.025MASK0.025L1Cu0.33oz+0.6mil0.027Cu0.5oz+0.8mil0.038Cu0.33oz+0.8mil0.032Cu0.5oz+1.0mil0.043PI0.025PI0.025FR40.055FR40.07L2Cu0.33oz0.012Cu0.5oz0.018Cu0.33oz0.012Cu0.5oz0.018CL0.0277CL0.0377純膠0.015純膠0.015L3Cu0.33oz+0.6mil0.027Cu0.5oz+0.8mil0.038Cu0.33oz+0.8mil0.032Cu0.5oz+1.0mil0.043CL0.0277CL0.0377MASK0.025MASK0.025總厚度0.18910.24710.2360.299公差0.19+/-0.030.25+/-0.030.24+/-0.050.3+/-0.05CL0.0377MASK0.025MASK0.025L1Cu0.33oz+0.6mil0.027Cu0.33oz+1.0mil0.037Cu0.5oz+1.0mil0.043純膠0.015CL0.0277L2Cu0.33oz0.012Cu0.33oz0.012Cu0.5oz0.018PI0.025FR41060.055FR410800.07L3Cu0.33oz0.012Cu0.33oz0.012Cu0.5oz0.018CL0.0277純膠0.015L4Cu0.33oz+0.6mil0.027Cu0.33oz+1.0mil0.037Cu0.5oz+1.0mil0.043CL0.0377MASK0.025MASK0.025總厚度0.26380.3130.392公差0.26+/-0.050.32+/-0.050.39+/-0.05CL0.0377MASK0.025MASK0.025L1Cu0.33oz+1.0mil0.037Cu0.33oz+1.0mil0.037Cu0.5oz+1.0mil0.043純膠0.015CL0.0277L2Cu0.33oz0.012Cu0.33oz0.012Cu0.018PI0.025FR41060.055FR40.07L3Cu0.33oz0.012Cu0.33oz0.012Cu0.018CL0.0277純膠0.015CL0.0277L4Cu0.33oz0.012Cu0.33oz0.012Cu0.018PI0.025FR41060.055FR40.07L5Cu0.33oz0.012Cu0.33oz0.012Cu0.018CL0.0277純膠0.015L6Cu0.33oz+1.0mil0.037Cu0.33oz+1.0mil0.037Cu0.5oz+1.0mil0.043CL0.0377MASK0.025MASK0.025總厚度0.40320.4720.628公差0.4+/-0.050.47+/-0.060.63+/-0.07注意:以上板厚設定為非盲埋孔設計---如設計盲埋孔需依設計調整及增加板厚度.以上板厚設定僅供參考--客戶GERBER之Layout設計及各層有無走線鋪銅,有無蓋MASK將影響總厚度之變化製表:李素貞2007/9/18版序:A0.075P.P2116HR0.130.055P.P10800.075P