JESD22-A113-E

JEDECSTANDARDPreconditioningofNonhermeticSurfaceMountDevicesPriortoReliabilityTestingJESD22A113E(RevisionofJESD22A113D,August2003)MARCH2006JEDECSOLIDSTATETECHNOLOGYASSOCIATIONNOTICEJEDECstandardsandpublicationscontainmaterialthathasbeenprepared,reviewed,andapprovedthroughtheJEDECBoardofDirectorslevelandsubsequentlyreviewedandapprovedbytheJEDEClegalcounsel.JEDECstandardsandpublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforusebythoseotherthanJEDECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.JEDECstandardsandpublicationsareadoptedwithoutregardtowhetherornottheiradoptionmayinvolvepatentsorarticles,materials,orprocesses.BysuchactionJEDECdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheJEDECstandardsorpublications.TheinformationincludedinJEDECstandardsandpublicationsrepresentsasoundapproachtoproductspecificationandapplication,principallyfromthesolidstatedevicemanufacturerviewpoint.WithintheJEDECorganizationthereareprocedureswherebyaJEDECstandardorpublicationmaybefurtherprocessedandultimatelybecomeanANSIstandard.Noclaimstobeinconformancewiththisstandardmaybemadeunlessallrequirementsstatedinthestandardaremet.Inquiries,comments,andsuggestionsrelativetothecontentofthisJEDECstandardorpublicationshouldbeaddressedtoJEDECattheaddressbelow,orcall(703)907-7559or©JEDECSolidStateTechnologyAssociation20062500WilsonBoulevardArlington,VA22201-3834Thisdocumentmaybedownloadedfreeofcharge;howeverJEDECretainsthecopyrightonthismaterial.Bydownloadingthisfiletheindividualagreesnottochargefororreselltheresultingmaterial.PRICE:PleaserefertothecurrentCatalogofJEDECEngineeringStandardsandPublicationsonlineat!DON’TVIOLATETHELAW!ThisdocumentiscopyrightedbyJEDECandmaynotbereproducedwithoutpermission.Organizationsmayobtainpermissiontoreproducealimitednumberofcopiesthroughenteringintoalicenseagreement.Forinformation,contact:JEDECSolidStateTechnologyAssociation2500WilsonBoulevardArlington,Virginia22201-3834orcall(703)907-7559JEDECStandardNo.22A113E-i-ForewordThisdocumentprovidesanindustrystandardtestmethodforpreconditioningcomponentsthatisrepresentativeofatypicalindustrymultiplesolderreflowoperation.IntroductionThetypicaluseofsurfacemountdevices(SMD)involvessubjectingtheSMDstoelevatedtemperaturesduringboardassembly,whichcombinedwithmoistureinthepackagecaninduceinternalpackagedamagethatcouldbeareliabilityconcern.PreconditioningofSMDpackagesisusedtosimulatetheeffectsofboardassemblyonmoisturizedpackages,priortoreliabilitytesting.Thisallowsreliabilitytestingatthecomponentlevelonasshippableproductswithaboardassemblysimulation.Duringpreconditioning,testsamplesaresubjectedtotemperaturecycling(optional),drybake,moisturesoaking,solderreflowsimulation,flux,rinse,dry,andelectricaltestbeforereliabilitytesting.JEDECStandardNo.22A113E-ii-JEDECStandardNo.22A113EPage1TestMethodA113E(RevisionofA113D)TESTMETHODA113EPRECONDITIONINGOFNONHERMETICSURFACEMOUNTDEVICESPRIORTORELIABILITYTESTING(FromJEDECBoardBallotJCB-06-21,formulatedunderthecognizanceoftheJC-14.1SubcommitteeonReliabilityTestmethodsforPackagedDevices.)1ScopeThisTestMethodestablishesanindustrystandardpreconditioningflowfornonhermeticsolidstateSMDsthatisrepresentativeofatypicalindustrymultiplesolderreflowoperation.TheseSMDsshouldbesubjectedtotheappropriatepreconditioningsequenceofthisdocumentbythesemiconductormanufacturerpriortobeingsubmittedtospecificin-housereliabilitytesting(qualificationandreliabilitymonitoring)toevaluatelongtermreliability(whichmightbeimpactedbysolderreflow).NOTECorrelationofmoisture-inducedstresssensitivity(perJ-STD-020andJESD22-A113)andactualreflowconditionsusedaredependentuponidenticaltemperaturemeasurementbyboththesemiconductormanufacturerandtheboardassembler.Therefore,itisrecommendedthatthepackagetemperatureatthetopcenterofpackagebedeterminedduringassemblyboardreflowprofilesetup,toensurethatitdoesnotexceedthetemperatureatwhichthecomponentsareevaluated,basedonpackagethicknessandvolumeasstatedinIPC/JEDECJ-STD-020.2NormativereferenceIPC/JEDECJ-STD-020,Moisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevicesJESD22-A104,TemperatureCyclingJESD625,RequirementsforHandlingElectrostaticDischargeSensitive(ESD)DevicesJEDECStandardNo.22A113EPage2TestMethodA113E(RevisionofA113D)3ApparatusThistestmethodrequiresuseofthefollowingequipment.3.1MoisturechambertemperatureMoisturechamber(s)capableofoperatingat85°C/85%RH,85°C/60%RH,and30°C/60%RH.Withinthechamberworkingarea,temperaturetolerancemustbe±2°CandtheRHtolerancemustbe±3%RH.Achamberwith60°C/60%RHcapabilityisoptionalforacceleratedsoakconditions(SeeJ-STD-020).3.2Solderreflowequipmenta)(Preferred)-FullConvectionreflowsystemcapableofmaintainingt