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中英制基本单位换算1kg=2.205lb(磅)1磅=0.454kg1英尺=12英寸1OZ(盎司)=28.3527g1g=0.03527OZ1英寸inch=1000密尔mil1ft(英尺)=0.3048m1m=3.281ft1mil=1000u”(uinmil)1码=0.914m1m=1.094码1OZ=28.35克/平方英尺=35微米1in(英寸)=25.4mm1mm=0.03937in1in=1000mil=25.4mm,1mil=25.4um1m2=10.76ft21ft2=0.0929m21ASD=1安培/平方分米=10.76安培/平方英尺1磅力=4.4484牛顿1N=0.2248磅力1加仑美制=3.785升1psi=0.06895bar1bar=14.5psi=1.013kg/cm21bar=100000Pa1马力=0.746千瓦1品脱=568ml1oC=1.8xoC+32oF1oF=(oF-32)/1.8oC1英尺=30.5cm基本英文词汇流程Boardcut开料Carbonprinting碳油印刷Innerdryfilm内层干膜Peelablebluemask蓝胶Inneretching内层蚀刻ENIG(Electrolessnickelimmersiongold)沉镍金Innerdryfilmstripping内层干膜退膜HAL(hotairleveling)喷锡AOI（AutomaticOpticalInspection）自动光学检测OSP（Organicsolderabilitypreservative）有机保焊Pressing压板Punching啤板Drilling钻孔Profiling外形加工Desmear除胶渣，去钻污E-Test电性测试PTH镀通孔，沉铜FQC(finalqualitycontrol)最终品质控制Panelplating整板电镀FQA(Finalqualityaudit)最终品质保证Outerdryfilm外层干膜Packing包装Etching蚀刻IPQA(In-processqualityaudit)流程QATinstripping退锡IPQC(In-processqualitycontrol)流程QCEQC（QCafteretching）蚀检QCIQC(Incomingqualitycontrol)来料检查Soldermask感阻MRB(materialreviewboard)材料评审委员会Componentmark字符QA(Qualityassurance)品质保证PhysicalLaboratory物理实验室QC(Qualitycontrol)品质控制ChemistryLaboratory化学实验室Documentcontrolcenter文件控制中心2ndDrilling二钻Routing锣板，铣板Brownoxidation棕化Wastewatertreatment污水处理V-cutV坑WIP（workinprocess）半成品Store/stock仓库F.G(Finishedgoods)成品概述PrintedCircuitBoard印制电路板FlexiblePrintedCircuit,FPC软板Double-SidePrintedBoard双面板IPC（TheInstituteforInterconnectingandPackingElectronicCircuits）电子电路互连与封装协会CPAR（Corrective&PreventiveActionRequest）要求纠正预防措施FlammabilityRate燃性等级Characteristicimpedance特性阻抗BUM（Build-upmultilayer）积层多层板DateCode周期代码CCL（Copper-cladlaminate）覆铜板Ioniccontamination离子性污染AcceptanceQualityLevel(AQL)允收水平HDI（Highdensityinterconnecting）高密度互连板BaseMaterial基材Radius半径Capacity生产能力Diameter直径Capability工艺能力PPM(PartsPerMillion)百万分之几CAM（computer-aidedmanufacturing)计算机辅助制造UnderwritersLaboratoriesInc.美国保险商实验所CAD(computer-aideddesign)计算机辅助设计StatisticalProcessControl统计过程控制Specification规格，规范Via导通孔Dimension尺寸Buried/blindvia埋/盲孔Tolerance公差Toolinghole定位孔Oven焗炉Output/throughput产量湿流程PTH（platedthroughhole）镀通孔（俗称沉铜）Acidcleaning酸性除油PP(PanelPlating)板电Aciddip酸洗Patternplating图电Pre-dip预浸Linewidth线宽Alkalinecleaning碱性除油Spacing线隙Flux松香Deburring去毛刺（沉铜前磨板）Hotairleveling喷锡Carbontreatment碳处理Skipplating跳镀，漏镀Track/conductor导线Undercut侧蚀Aspectratio深径比Waterrinsing水洗EtchFactor蚀刻因子Transportation行车BackLightTest背光测试Rack挂架Pinkring粉红圈Maintenance保养干流程Holelocation孔位Annularring孔环ImageTransfer图象转移ComponentSide(C/S)元件面Artwork底片SolderSide(S/S)焊接面Mylar胶片MatteSolderMask哑绿油Silkscreen/legend/ComponentMark文字Holebreakout破孔Fiducialmark基点，对光点Scrubbing磨板Expose曝光Developing显影内层制作Corematerial内层芯板Thermalpad散热PADPre-pregPP片Resincontent树脂含量KraftPaper牛皮纸Brownoxidation棕化Layup排版BlackOxidation黑化Registration对位Basematerial板材Delamination分层其它Wicking灯芯效应Holesize孔径(尺寸)Yield良品率TouchUp修理WarpandTwist板曲度SolventTest溶剂测试Peeloff剥离CompanyLogo公司标识TapeTest胶纸试验ULMarkUL标记Cosmetic外观Function功能Tin/LeadRatio锡/铅比例ReliabilityTests可靠性试验HoleWallRoughness孔壁粗糙度BaseCopperThickness底铜厚度PCB专业英语(PCBSPECIALENGLISH)1.PCB=PrintedCircuitBoard电路板2.CAM=Computeraidedmanufacture计算机辅助3.Pad焊盘4.Annularring焊环5.AOI=automaticopticalinspection自动光学检测6.Chargeoffree免费7.WIP=workinprocess在线板8.DCC=documentcontrolcenter文控中心9.Legend字符10.CS=ComponentSide=TopSide（顶层）元件面11.SS=SolderSide=BottomSide（底层）焊锡面12.GoldPlated电金，镀金13.NickelPlated电镍，镀镍14.ImmersionGold沉金=沉镍金15.CarbonInkPrint印碳油16.MicrosectionReport切片报告，横切面报告17.X-out=Cross-out打X报告18.Panel（客户称）拼板，（生产线称）工作板19.Marking标记，UL标记20.Datecode生产周期21.Unit单元，单位22.Profile外形，轮廓outline23.ProfileByRouting锣(铣)外形24.WetFilm湿菲林,湿绿油,湿膜25.Slot槽,方坑26.BaseMaterial=BaseLaminate基材,板料27.V-out=V-scoreV形槽28.Finished成品29.Marketing市场部30.GerberFileGERBER文件31.ULLOGOUL标记32.E-Test=ElectricOpen/ShortTest电子测试33.PO=PurchaseOrder订单34.Tolerance公差35.Rigid,FlexibleBoard刚性,软性板36.Boardcut开料37.Boardbaking焗板38.Drill钻孔39.PTH=PlatedThroughHole镀通孔,沉铜40.Panelplating板面电镀,全板电镀41.PhotoImage图象,线路图形42.Patternplating线路电镀43.Etching蚀板,蚀刻44.SM=SolderMask防焊,阻焊,绿油45.SR=SolderResist防焊,阻焊,绿油46.Goldfinger金手指47.Silkscreen丝印字符48.HAL=HASL=Hotair(Solder)leveling热风整平喷锡49.Routing锣板,铣板50.Punching冲板,啤板51.FOC=finalqualitychecking终检,最后检查52.FOA=finalqualityaudit最后稽查(抽查)53.Shippment出货54.Flux松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Leadfree无铅57.COC=complianceofcertificate材料证明书58.Microsection=crosssection微切片,横切片59.Chamicalgold沉镍金60.Mould=punchdie模具,啤模61.MI=manufactureinstruction制作批示62.QA=qualityassurance品质保证63.CAD=computeraideddesign计算机辅助设计64.Drillbitsize钻咀直径diameter65.Bowandtwist板弯和板曲66.Hit击打,孔数67.Bonding邦定,点焊68.Testcoupon测试模块(科邦)69.Thievingcopper抢电流铜皮70.Rail-web71.Break-uptab工艺边72.Breakawaytab工艺边73.GND=ground地线,大铜皮74.Holeedge孔边,孔内75.Stamphole邮票孔76.Template天坯,型板,钻孔样板(首板)77.Dryfilm干菲林,干膜78.LPI=liquidphotoimage液态感光=湿绿油79.Multilayer多层板80.SMD=surfacemouteddevice贴片,表面贴装器件81.SMT=surfacemoutedtechnology表面贴装技术82.Peelablemask=bluegel蓝胶83.Toolinghole工艺孔,管位,定位孔,工具孔84.Fiducialmask测光点,光学对位点,对光点,电眼85.Copperfoil铜箔86.Dimension尺寸87.Nagative负的,positive正的88.Flashgold闪镀金,镀薄金89.Engineeringdepartment工程部90.Deliverydate交货期91.Bevelling斜边92.Spac