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红外成像阵列器件ROIC设计与发展院、系：机电工程学院学科专业：机械工程学生：王默学号：201001017指导教师：郑刚2011年4月I目录中文摘要·····································································································I英文摘要····································································································II1.绪论····································································································11.1引言·································································································11.2红外焦平面的工作原理·····································································11.3红外焦平面的分类············································································21.3.1按制冷方式分类······································································21.3.2按结构分类·············································································31.3.3按读出方式分类······································································32.时序驱动电路的设计··········································································52.1红外焦平面读出电路概述··································································52.2基于FPGA的时序驱动电路设计····················································72.2.1FPGA概述···············································································72.2.2VerilogHDL简介···································································92.2.3时序要求···············································································102.2.4时序驱动设计流程··································································122.2.5时序设计核心思想··································································122.2.6小结·····················································································193.波形调试·······························································································203.1FPGA器件编程与配置······································································203.2波形调试与数据计算·········································································223.3小结································································································254.总结········································································································26致谢·················································································错误!未定义书签。参考文献···································································································28I红外成像阵列器件ROIC驱动时序设计摘要高密度、低成本的非致冷红外焦平面阵列的出现使红外热成像技术发生了第三次变革。由于其无需机械扫描机构，室温工作，从而使非致冷红外热像仪实现了小型化、便携化，并具有可靠性高和使用寿命长的特点，系统成本比致冷型热像仪降低近一个数量级。由于非致冷红外焦平面技术的突破性进展，使得业内提出了将商用和军用的红外系统集成以满足经济和国防的双重需要的复用技术概念。目前，我国在这一领域的研究尚处于起步阶段，因此研制具有自主知识产权的非制冷红外焦平面阵列探测器是十分必要的，同时这也将产生巨大的经济和社会效益。本文阐述了红外焦平面阵列的工作原理及分类，针对本实验室研制的160×120非制冷红外焦平面阵列，实现了基于FPGA的时序驱动电路设计研制。是用VerilogHDL语言在QUARTUSII软件上编程实现的。关键词：红外焦平面；FPGA；时序驱动电路；VerilogHDLIIThedesignforinfraredUFPAROICtimingdrivecircuitAbstractThetechnologyofstaringuncooledinfraredfocalplanearrays(UFPA)withhigh-densityandlow-costisthethirdbreakthroughinthedevelopingofinfraredimagingtechnology.Theinfraredthermalimagingsystemcouldbemademoresmall,moreflexible,higherreliability,andlongerlifetimeincomparisonwithcooledinfraredFPA,becauseitdoesnotuseamechanismscanpartanddoesn’trequirecryogeniccooling.Andthecostisonly10%ofthecooledthermalimagers’.WiththegreatprogressofthetechnologyoftheinfraredUFPA,adual-usetechnologyconcepthasbeenproposedwhichemphasizestheintegrationofcommercialandmilitaryinfraredimagingsystemstomeettheneedofeconomyanddefense.NowtheresearchofUFPAisstillabeginninginourcountry,soitisnecessarytodevelopUFPAwithownintellectualproperty,meanwhileitcanbringmucheconomicandsocialbenefit.ThethesisexpatiatedclassifyingandprincipleoftheinfraredUFPA.Acompletetestandanalysissolutionfor160×120infraredUFPAdevelopedbyownlabwaspresented.Timingdrivecircuitbased-onFPGAwasfulfilled.ThatisuseVerilogHDLlanguagemakeprogramtoachieve,whichbasedonQUARTUSIIsoftware.KeyWords:InfraredUFPA;FPGA;Timingdrivecircuit;VerilogHDL1绪论11绪论1.1引言自然界中的一切物体，只要它的温度高于绝对零度（0K），就总是在不断地发射辐射能。因此，从原理上讲，只要能收集并探测这些辐射能，就可以通过重新排列来自探测器的信号形成与景物辐射分布相对应的热图像。这种热图像再现了景物各部分的辐射起伏，因而能显示出景物的特征。红外探测器从根本上决定着红外系统的发展水平。过去的红外探测系统基本上是将单个的红外探测器放在红外光学系统的焦点位置上，从而被动的接收、探测来自人、物、地球表面等目标的红外辐射信号。若要获得目标的红外图像，则需要用光机等方法扫描目标，这就严重影响探测的灵敏度和分辨力。于是，人们开始通过增加探测器数目从而延长探测器积分时间的方法来提高探测器响应的信噪比。在20世纪70年代，借助于成熟的LSI和VLSI工艺技术，工作于可见光谱区的硅CCD摄像器件取得了飞速的进展。采用类似的技术研制出具有多种读出功能的集成二维探测器列阵，即红外焦平面列阵（IRFPA），这是二十多年来光电子领域最为显著的成就之一。所谓红外焦平面阵列（IRFPA），就是把大量探测器单元按照一定规则用先进的微电子工艺高密度地集成到一块对红外透明的材料芯片上，同时将其它必要的信号读出及处理电路(如前放)集成到同一芯片或另一其他材料的芯片上，构成一个既接收光辐射又将光电信号转变为可用数据输出的整体焦平面阵列技术使得探测器在焦平面上的数目提高了若干个数量级。通过采用焦平面器件，凝视探测系统可以得到很高的灵敏度，信噪比在理论上是单元系统的N1/2倍；单元面积的减小使空间分辨率得以提高；以电子扫描代替光机扫描减小了系统的体积、重量、功耗和装配的复杂性；提供了更大的瞬时视场、更高的帧频、更强的抗干扰能力和目标识别能力。焦平面阵列已开始应用于制导、搜索、预警、夜视、空间技术、工业和医学等各个领域，正成为红外成像系统的核心器件。1.2红外焦平面的工作原理常见的红外焦平面阵列的工作原理是：焦平面上的红外探测器在接收到入射的红外辐射后，在红外辐射的入射位置上产生一个与入射红外辐射性能有关的局部电荷，通过扫描焦平面阵列的不同部位或按顺序将电荷传送到读出器件中来读出这些电荷。每一个局部称做一个像元。最常见的焦平面有光导器件(PC)、光伏器件(PV)、金属、绝缘体、半导体器件(MIS)和肖特基势垒器件。21.3红外焦平面的分类1.3.1按制冷方式分类(1)制冷型焦平面阵列目前所有工作于3~5μm和8~14μm波段制冷型焦平面阵列（FPA）都是基于光子探测原理，即依赖入射红外光子在探测器中激发的光生载流子，定向生产的光生电荷产生正比于入射红外辐射通量的信号。采用Hg