手机照相模组生产流程介绍

3照相模块COB工艺流程2照相模块SMT工艺流程41照相模块基本结构数据内容照相模块产品类型照相模块基本结构1照相模块SMT工艺流程2SMT贴片流程送板机：连片送板。印刷机：印刷锡膏。贴片机：组件的贴装。回焊卢：固化组件。AOI：质量检测。成品：完成电子元器件贴片COB(Chiponboard)-芯片封装流程照相模块LHA工艺流程3DA着晶最终外观检查PCB板清洁PCB板贴载板WB焊线盖镜头（LHA)镜头检验Wafer清洗烘烤（PMC)SAW打包入库工单领料三目视检验镜头来料点数镜头转入载板吹气镜头转TraySNResolutionSensorTypeConnectorRemark1VGAOV7690OV7675FFBTBGoldenfingerSocket21.3MOV9665S5K6AAFFBTBGoldenfingerSocket32MOV2655FFBTBGoldenfingerSocket43MOV3640S5K5CAST-VD6803AFEDOFFFL/CBTBGoldenfingerSocket55MOV5647OV5642S5K4E2AFEDOFFFL/CBTBGoldenfinger68MOV8825AFBTBGoldenfinger713MSony091AFBTBGoldenfinger照相模組產品類型5EndThanks!