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263Vol.26,No.319986JOURNALOFTHECHINESECERAMICSOCIETYJune,1998AlN/W梁彤翔朱钧国杨冰张秉忠彭新立()王英华李恒德()1850AlN/W,AlNW1850,:,W,W,W;W.,WAlN;WAlN.,AlN,AlN.,,,,.-,;,,;.:,,;,.[1,2].AlNW,[3]AlN/W,XAlN/W[4].AlN/W,AlNW,,AlNW,.,,.1,.AlN/W.1实验材料及工艺AlN43,1.0m.W1.7m.AlN/W.AlN150m,W25m.AlN4%()Y2O3,199763..:,,32,,,,102201.1AlN/WFig.1DefectsinAlN/Wcofiredsubstrate1850.1850AlNW.2AlN/WFig.2ModelofAlN/Wcofiredstructure3Fig.3SchematicillustratingthechangeofshrinkageratesandstressstatesbetweenAandBlayer2应力分析AlN/W2,AlNWW,.WAlN,AlN(2a);W,W(0.10.2mm)(1020mm),,,AlN/W2b.,3a,,.3b.AB,AB,3c.,AB:A287263:AlN/WB,B.,A,.AlN,,,2750.AlN,Y2O3,Y2O3AlNAl2O3AlN,Y2O3-Al2O31700.1850AlNW1.1850W,AlN.W,AlN,[5]AlN.1AlNWTable1EffectofsoakingtimeondensityofAlNandW/(gcm-3)0.5h1h2h3h4hW19.0319.0319.0719.0819.08AlN3.023.133.203.273.27(a)Freefired(b)Cofired4WFig.4StressanalyzeofcofiredandfreefiredWfilm,AlNW1850:,WAlN;,AlNW.,,WAlN.2.1WAlNWAlN,WAlN,W,2,W.W4,-P0,-P0+23.W,,,W.5W.P0=2/(1):W,(W50%60%,W).W,.W0.51Jm-2,1.70m,(1)600kPa.[6],W=0.24kEd2a/dw(2)2881998(a)(b)5W(a)(b)Fig.5SEMmicrographsofthefree(a)andcofired(b)Wfilm:EAlN(345GPa),dadWAlNW(150m(a)Freefired(b)Cofired6Fig.6Schematicshowingthediffusionmechanismofcofiredandfreesintering25m),k(0.004),W310kPa.Wx-yAlN,23,208kPa,30%.W.W,,,,,..,.,[7],6..,AlNW,AlNW,3c,AlN.,,AlN.,.2.2WAlNWAlN2b,WAlN,7a,RWAlN.R[4]R=P0{1+2.25/[1-(r/R)3]}-1(3):P0W;rRWAlN;289263:AlN/W(a)Stage(b)Stage7WAlNFig.7SchematicofstressstatesattheinterfaceofWlineandAlN[7],0.01.(3)RP0.Wr,R.,,R,WAlN.AlNW,AlN7b.[1]/Pa=(4V+2)/(4V+9)-1(4):PaAlN,VWAlN.=0.01,(4)Pa,AlN,AlN.8W/AlNAlN.,,.8W/AlNAlNFig.8SEMmicrographsofAlNparticlesattheAlN/Winterface6,,;,,,,,,.AlNW/AlN.3结论W/AlN,,.AlNW1850.,WAlN,W,W2901998,W;W,WAlN.,AlNW.WAlN.,,AlN.,;WAlN.AlN,AlN.1HsuehCH,EvansAG.Residualstressesinmetalceramicbondedstrips.JAmCeramSoc,1985;68(5):2412YuHsingYung.Residualstressesinceramicinterlayerjoints.JAmCeramSoc,1994;76(7):16613,..,1996;5:504.WAlN/W:[].:,19965.!∀#∃.,1994;31(4):1526OhringM.TheMaterialScienceofThinFilm.SanDiego,CA:AcademicPressInc,1992:4167ChengT.Co_sinteringbehaviorofceramic-metalandglass-metalmultilayerfilms:[PhDThesis].NY:CornellUniversity,1989SINTERINGSTRESSESINCO_SINTEREDAlN/WMULTILAYERSUBSTRATESLiangTongxiangZhuJunguoYangBingZhangBingzhongPengXinli(InstituteofNuclearEnergyTechnology,TsinghuaUniversity)WangYinghuaLiHengde(DepartmentofMaterialsScience&Engineering,TsinghuaUniversity)ABSTRACTThestatesandthecausesofsinteringstressproducedinAlN/Wco_sinteredmultilayersubstrateswerestudied.Stressstatesaredifferentintwostages:inthesinteringstage,in_planestressesaredevelopedinWfilmwhichleadstohighporosityandreducationofsinteringrate;inthesoakingstage,radialstressesaredevelopedinAlNneartheAlN/Winterface,whichreducestheshrinkagerateanddensityofAlNceramic.KEYWORDSstress,multilayersubstrates,electronicpackaging,AlNceramic,sinteringReceived:June3,1997.Correspondent:LiangTongxiang,InstituteofNuclearEnergyTechnology,TsinghuaUniversity,Beijing102201.291263:AlN/W