FMEA chart

ProcessPotentialPotentialSPotentialODRRecommendedDescriptionFailureEffect(s)ofeCause(s)ofcePAction(s)ProcessModeFailurevFailureccurrentcurrenttNPurposePreventdetectReceivingPartsstockedunderwrongpartnumber.Timedelaywhilekitsarecorrectedinotherstation.Wrongpartmaybeusedinproductifkitsarenotcorrected.6markedincorrectlywhenplacinginstock.2TheReceivingsystemcontrol.IQAsamplinginspection,SMTFirstArticle,QC/QAInspection,Audits560NoneMaterialStoragematerialdeteriorationfunctionfail5poorenviormentcontrol2T&Hcontrol,ESDcontrol,FIFOCyclecount550NoneOutofdatecodeornospecparts,failuremoisturesensitivepartspassedIQAPartsolderabilityispoor,highfailurerateonproductionlineandadditionalcost.6humanError1IQAwillcheckMFG,MPN,Package,Value(LCR),PCBdimension,DateCode.MSDisidentifiedinpickinglisttonoticeproductionto100%bakethemoisturesensitivepartandPCBbeforeuse;IPQCAudit,SMTFirstArticle530None6Wrongrevision;suppliercan'tcatchthelatestrevisionorfollowit.2SourcingengineerverifyAVLbeforeitisloadtoMRP,SourcingengineerupdateAVLaccordingtocustomerECOIQAwillcheckMFG,MPN,Package,Value(LCR),StagingAudit,SMTFirstArticle,QAAudits,560None6Suppliersmakemistakestoshipwrongpart2SourcingengineerverifyAVLbeforeitisloadtoMRP,SourcingengineerupdateAVLaccordingtocustomerECOIQAwillcheckMFG,MPN,Package,Value(LCR),StagingAudit,SMTFirstArticle,QAAudits,560NoneFeedersmisloadedormislabeled,wrongpartloadedTimedelay,potentialrework,potentiallossofproductfunction5HumanError3SetupfirstarticleCheckvalueandAVLSMTFirstArticle,QCandQAinspection575NoneMoisturesensitivecomponentoutoflimittimeexposedinairPotentiallossofproductfunction5Comp.isstoredincorrectly.Exposedtimeisoverthefloorlifeofthepart.2MSDcontrolprocedure,100%baking,exposetimetrackingSMTFirstArticle,550NoneLabelingLabelmissing&WronglabelorapplylabelnopersequenceCan'ttrackproductquality&information5HumanError2Defineeachoperator'sjobscopeandstrengthinspectiontrainingFQC,FQA660None5Stencilopeningblockedduetoimpropercleaningmethodorpaper.3AutocleanandmanualcleanthestencilaccordingtoworkinstructionPostprintinginspectionSolderpasteheightmeasurement(Automated)SPCchart;AOI,ICT(automated)345None5Stencilopeningtoosmall.2PEcheckopeningdimensionwhenstencilincoming.PostprintinginspectionAOI,ICT330NoneProcessControlIncomingqualitycontrolWrongmanufacturer,wrongMPNpartspassedIQAIncorrectpartspassedthroughtoenduser,FailedinFTProductFailureincustomerside.SMTSetupSolderPastePrintingInsufficientsolderpasteOpen/Insufficientsolder5Printingparametersetincorrectly3Printingparameterissetupafterqualrun.Checktheprintingparameterwithworkinstructioneveryshift.OnlyEngineerhastherighttomodifytheparameter.PostprintinginspectionSolderpasteheightmeasurement(Automated)SPCchartAOI,ICT345None5Stencilthicknessistoothin2PEfillthestencilchecklistafterstencilincomingPostprintinginspectionSolderpasteheightmeasurement(Automated)SPCchartAOI,ICT330None5Solderpasteisoutofshelflife3SMToperatorwillchecktheshelflifeofsolderpastebeforeusingit.FirstArticle.PostprintinginspectionSPCchartAOI,ICT460None5Stenciltensionforceistoosmall.3SMTtechniciancheckstenciltensionmonthly.PostprintinginspectionSolderpasteheightmeasurement(Automated)SPCchartAOI,ICT345None5Smearing.3AutocleanandmanuualcleanthestencilaccordingtoworkinstructionPostprintinginspectionSolderpasteheightmeasurement(Automated)SPCchartAOI,ICT345None5Stencilopeningtoobig.2Checknewstencilopeningaccordingtodesignaperture.Postprintinginspection,AOI,ICT440None5Stencilthicknessistoothick2PEfillthestencilchecklistafterstencilincomingPostprintinginspectionSolderpasteheightmeasurement(Automated)SPCchartAOI,ICT330None5Stencilcleanisnotenough.Operatorusethepasteusedoutofwarm-uptime.3Cleanthestencilfollowworkinstruction.Pasteheightmeasuredevery2hours.FirstArticle.PostprintinginspectionSolderpasteheightmeasurement(Automated)SPCchartAOI,ICT345None5Stencilopeningpositiondon'tmatchexactlywithPCBpad2Checkthestencilopeningwhenstencilincoming.PostprintinginspectionSolderpasteheightmeasurement(Automated)SPCchartAOI,ICT330None5Supportpinisplacednotevenlyorsupportpindeformation3SMTtechnicianchecksupportpinplacestatusandcheckifsupportpindeformbeforeproductionPostprintinginspectionSolderpasteheightmeasurement(Automated)SPCchartAOI,ICT345NoneSolderPastePrintingInsufficientsolderpasteOpen/InsufficientsolderExcesssolderpasteCircuitshortSolderballsMisalignmentofsolderpasteonpadCircuitshortCircuitopen5BentPCB3IQA.SMTwillcheckthefirstpieceofeachpackage.PrintingoperatorwillcheckthePCBbeforeload.PreprintinginspectionPre/postreflowinspection,firstarticle575NonePCBdamagedPCBscrap7PCBAdroppingforfalseoperation,2RejectthedroppingPCBAControloperationaccordingtoworkinstruction.Postprintinginspectionpre/postreflowinspection,QC/QA,AOI,ICT456None6Usewrongpartatreworkstation.2ReworkoperatordoublechecktheP/N,Reworkedboardmustbere-inspectedfromthe1ststationofPost-IRPostreflowinspection,QC/QA;AOI,ICT448None6Useawrongplacementprogram.2Checkprogramnamewithworkinstructioneveryshift.SMTmachinealarm(Automated);Firstarticle,pre/postreflowinspection