高端服务器发展趋势对PCB的机遇和挑战-黄建忠-舒明

2014No.2-16-MarketDevelopmentThedevelopmenttrendsofHi-EndseveranditsopportunitiesandchallengestoPCBHUANGJian-zhongSHUMingAbstractWiththewideapplicationofclustercomputing,moreandmorereorganizationandconsolidationofisomericsystem,constructionofdatacentreandwideapplicationformulti-coretechnologies,itrequiresever-higherlevelsoftheservers.SoitwillbringhigherrequirementforPCB’stechnologiescapability,includingmaterial,signaltransmissionandhigherreliabilityandsoon.ThisarticlewillelaboratethePCB’sdesignfeaturesforhigh-endsever,signaltransmissionrequirementofPCBprocessdesignandcontrol,forcommunityfellowreference.KeywordsHigh-EndSever;SignalTransmission;ProcessControlSeverCCID2012~2013x862012x86119.20217.40201117.8%18.6%201270%1-17-2014No.2MarketDevelopmentIBMSystemx3850X5Systemx3850X5464DIMMMAX596DIMMSystemx3850X58eXFlash16SSDEmulex10GbHPProLiantDL580G7E7-480032DIMM64DIMMHP4S2TB10Gb11I/ODellPowerEdgeR91044UE764DIMM2TB162.5SFF6Gbps3GbpsSASSASSATASSDRAID6R91042IT3PCBPCB1U2USever4684U8USever16L20LPCBPCB41linecards20L4.0mm14:1x-cedepressfitholebackdrill2LC16L2.4mm0.25mmviahole0.1mm/0.1mm3LC10L1.6mmGFHDI+POFV4Memorycard10LPlus3HDI+IVH0.1mm/0.1mmPCBHDIGFFPCBPCBDxxx2014No.2-18-MarketDevelopment24LIT-150DAbackdrillstub0.1mm3.5mm5PCB6tightstub60%1stackupdummypadborderresinchanneldesign2coupon31/PanelAOIcouponX-RaycouponPCB810LPlus2HDIPCIcard(GF),18Lplus3HDImemorycardset2dil18Lmemorycard9-19-2014No.2MarketDevelopmentThermalpad68.6mPP1112PP34stackupspreadglassfibreHDIVSHDI1PPViaPTHFA2VSVSVSannularring34VS:mainboardsLowDk/DfPCBICDPullawayICDICDICDpullaway10ICDpullawayPTHpullaway2014No.2-20-MarketDevelopmentIntelSET2DILciscoVNAIBMSPP12PCBstackupPP0.125mm2116*11078*21086*2PP1037106710781086spreadglassfibre1061080profileSTDTHERTFVLPPCBRTFVLPloss30L6.0mm8.0mm18:1D2M0.175mmBackdrillStub0.125mm8%SMTpadBGA20L3.2mm4.0mm14:1TightregistrationD2M0.125mmZBC0.05mmviaBackdrillStub0.125mm8%0.075mm/0.075mmfinelineBGAPitch0.8mm0.65mm0.5mm1.0mmBGA0.8mm&0.65mmBGAPCBskipvia2stepstakedviaPCBPCBFR4+Lowloss8U16U13PCB-21-2014No.2MarketDevelopmentPCBtighttoleranceregistrationLowersignallossAssemblyPCBPCBPCBPCBPCB10PCB15PCBPCBIbidenPanasonicCMKNOKSONYChemicalSamsungE-MLGPCBPCBHDIPCB2012PCBHDI5GAAGR7.7%PCBPCBPCB2%PCBPCB~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~PCIPCI