SPC各月月报

列表日期:02/12/02序號站別項目擔當單位規格單位12月管制範圍CPK值1OSP膜厚終檢課0.2~0.5u0.397~0.4512.642微蝕量終檢課10~30u20.7~25.89NA3成型站成型尺寸鑽孔課+5mil-1.145~1.2652.044成品清潔度IPQC6.4ug/in20.59~1.836.525成品板厚OQC+6mil-0.28~3.241.546#1金厚度加工課2~6u3.282~4.3562.267#1鎳厚度加工課150~300u199.6~241.83.468#2金厚度加工課0.05~0.15um0.063~0.0752.529#2鎳厚度加工課3~6um4.146~4.9185.3210S/M厚度IPQC0.4~1.2u0.482~0.6361.8211油墨黏度防焊課60~80Sec.67.2~73.4NA12半成品清潔度IPQC6.4ug/in21~1.714NA13PTH孔銅IPQC0.5mil0.718~0.924.5614PTH孔銅IPQC0.7mil0.878~1.1533.9815面銅IPQC0.3mil0.08~0.182.1016E-lessCuWeightGain電鍍課0.4~0.6um0.46~0.552.1417DesmearEtchRate電鍍課15~40mg/dm218.9~24.71.4218內層前處理微蝕液濃度微影課40~60g/l43.99~54.331.4219外層前處理微蝕液濃度微影課40~60g/l45.33~52.271.3920內層線寬公差微影課+1mil0.112~0.5342.3521外層線寬公差微影課+1mil0.221~0.5252.2122鑽孔課孔壁粗糙度IPQC1.2mil0.137~0.8032.1923壓合板厚壓合課+5um-0.352~2.2942.4424EtchMount壓合課30~60u''38.1~48.12.6925WeightGain壓合課0.27~0.37mg/cm20.289~0.3551.60審核:列表人:彭峰防焊課電鍍課微影課壓合課11月SPC月報終檢課OQC加工課列表日期:03/01/02序號站別項目擔當單位規格單位1月管制範圍CPK值1OSP膜厚終檢課0.2~0.5u0.397~0.4512.642微蝕量終檢課10~30u20.7~25.89NA3成型站成型尺寸鑽孔課+5mil-1.147~1.2892.174成品清潔度IPQC6.4ug/in20.558~1.8546.815成品板厚OQC+6mil-0.071~2.91.976#1金厚度加工課2~6u3.288~4.372.347#1鎳厚度加工課150~300u201.56~240.63.488#2金厚度加工課0.05~0.15um0.063~0.0752.529#2鎳厚度加工課3~6um4.153~4.8895.5610S/M厚度IPQC0.4~1.2u0.496~0.6361.9111油墨黏度防焊課60~80Sec.67.9~72.32.0412半成品清潔度IPQC6.4ug/in20.965~1.6753.7413PTH孔銅IPQC0.5mil0.703~0.9352.5414PTH孔銅IPQC0.7mil0.873~1.1333.8715面銅IPQC0.3mil0.089~0.1881.8216E-lessCuWeightGain電鍍課0.4~0.6um0.46~0.55NA17DesmearEtchRate電鍍課15~40mg/dm218.9~24.7NA18內層前處理微蝕液濃度微影課40~60g/l43.9~53.11.4219外層前處理微蝕液濃度微影課40~60g/l44.82~53.081.3720內層線寬公差微影課+1mil0.136~0.5142.4221外層線寬公差微影課+1mil0.209~0.4972.2422鑽孔課孔壁粗糙度IPQC1.2mil0.172~0.7882.2123壓合板厚壓合課+5um-0.422~2.4061.9724EtchMount壓合課30~60u''37.9~48.32.1825WeightGain壓合課0.27~0.37mg/cm20.29~0.351.72審核:列表人:彭峰防焊課電鍍課微影課壓合課12月SPC月報終檢課OQC加工課列表日期:03/02/05序號站別項目擔當單位規格單位2月管制範圍CPK值1OSP膜厚終檢課0.2~0.5u0.397~0.4492.652微蝕量終檢課10~30u20.67~25.832.443成型站成型尺寸鑽孔課+5mil-1.202~1.2901.944成品清潔度IPQC6.4ug/in20.619~1.7695.855成品板厚OQC+6mil-0.064~3.031.816#1金厚度加工課2~6u3.31~4.3362.467#1鎳厚度加工課150~300u202~239.63.418#2金厚度加工課0.05~0.15um0.055~0.0831.929#2鎳厚度加工課3~6um4.072~4.9064.4310S/M厚度IPQC0.4~1.2mil0.496~0.6361.9111油墨黏度防焊課60~80Sec.67.1~73.71.8312半成品清潔度IPQC6.4ug/in20.965~1.6753.7413PTH孔銅IPQC0.5mil0.7~0.962.2414PTH孔銅IPQC0.7mil0.89~1.133.9415面銅IPQC0.3mil0.079~0.1951.7316E-lessCuWeightGain電鍍課0.4~0.6um0.46~0.55NA17DesmearEtchRate電鍍課15~40mg/dm218.9~24.7NA18內層前處理微蝕液濃度微影課40~60g/l44.62~52.721.5819外層前處理微蝕液濃度微影課40~60g/l43.93~53.231.3520內層線寬公差微影課+1mil0.142~0.4962.5321外層線寬公差微影課+1mil0.132~0.5462.0522鑽孔課孔壁粗糙度IPQC1.2mil0.217~0.8482.0023壓合板厚壓合課+5um-0.348~2.471.8224EtchMount壓合課30~60u''38.4~47.22.3425WeightGain壓合課0.27~0.37mg/cm20.3~0.341.91審核:列表人:彭峰微影課壓合課1月SPC月報終檢課OQC加工課防焊課電鍍課列表日期:03/03/02序號站別項目擔當單位規格單位3月管制範圍CPK值1OSP膜厚終檢課0.2~0.5u0.408~0.4622.432微蝕量終檢課10~30u20.67~25.83NA4成型站成型尺寸鑽孔課+5mil-1.085~1.362.045成品清潔度IPQC6.4ug/in20.515~1.8694.617成品板厚OQC+6mil0.195~2.9772.348#1金厚度加工課2~6u2.71~4.821.949#1鎳厚度加工課150~300u178~261.62.5610#2金厚度加工課0.05~0.15um0.058~0.082.0411#2鎳厚度加工課3~6um3.59~5.372.1512S/M厚度IPQC0.4~1.2mil0.484~0.6581.8313油墨黏度防焊課60~80Sec.66.5~73.51.7714半成品清潔度IPQC6.4ug/in20.935~1.6464.2115PTH孔銅IPQC0.5mil0.685~0.9512.36PTH孔銅IPQC0.7mil0.903~1.1454.0317面銅IPQC0.3mil0.086~0.191.8118E-lessCuWeightGain電鍍課0.4~0.6um0.423~0.5941.8319DesmearEtchRate電鍍課15~40mg/dm218.68~24.661.4620內層前處理微蝕液濃度微影課40~60g/l44.2~53.61.4622外層前處理微蝕液濃度微影課40~60g/l43.93~53.911.3523內層線寬公差微影課+1mil0.132~0.5122.3424外層線寬公差微影課+1mil0.138~0.5581.9225鑽孔課孔壁粗糙度IPQC1.2mil0.221~0.8571.8326壓合板厚壓合課+5um-0.358~2.2842.1927EtchMount壓合課30~60u''38.82~46.882.5528WeightGain壓合課0.27~0.37mg/cm20.297~0.3431.89審核:列表人:彭峰2月SPC月報終檢課OQC壓合課加工課防焊課電鍍課微影課列表日期:03/04/02序號站別項目擔當單位規格單位4月管制範圍CPK值1OSP膜厚終檢課0.2~0.5um0.408~0.4622.162微蝕量終檢課10~30um4成型站成型尺寸鑽孔課+5mil-1.318~1.582.03+8mil-2.167~2.0255成品清潔度IPQC6.4ug/in20.515~1.8693.717成品板厚OQC+6mil-0.11~1.2382.218#1金厚度加工課2~6u3.236~4.3182.019#1鎳厚度加工課150~300u196.829~245.6232.6910#2金厚度加工課0.05~0.15um0.063~0.0752.0811#2鎳厚度加工課3~6um3.88~4.9182.2812S/M厚度IPQC0.4~1.2mil0.484~0.6581.8313油墨黏度防焊課60~80Sec.64.2~75.81.7514半成品清潔度IPQC6.4ug/in20.935~1.6464.2115PTH孔銅IPQC0.5mil0.742~0.9122.49PTH孔銅IPQC0.7mil0.876~1.13.7417面銅IPQC0.3mil0.09~0.1641.8618E-lessCuWeightGain電鍍課0.4~0.6um0.423~0.5941.4619DesmearEtchRate電鍍課15~40mg/dm218.68~24.661.8320內層前處理微蝕液濃度微影課40~60g/l1.4522外層前處理微蝕液濃度微影課40~60g/l1.5123內層線寬公差微影課+1mil0.157~4952.1124外層線寬公差微影課+1mil0.15~0.5461.9725鑽孔課孔壁粗糙度IPQC1.2mil0.27~0.6641.9326壓合板厚壓合課+5um-0.094~2.1022.2527EtchMount壓合課30~60u''39.784~46.1062.4728WeightGain壓合課0.27~0.37mg/cm20.297~0.3431.9審核:列表人:彭峰微影課壓合課3月SPC月報終檢課OQC加工課防焊課電鍍課列表日期:03/05/02序號站別項目擔當單位規格單位5月管制範圍CPK值1終檢課OSP膜厚終檢課0.2~0.5um0.4~0.461.032微蝕量終檢課10~30um20.27~25.931.544成型站成型尺寸鑽孔課+5mil-1.329~1.6131.47+8mil-1.776~1.8061.975OQC成品清潔度IPQC6.4ug/in20.752~1.6025.557成品板厚OQC+6mil2.41~0.8337.978加工課#1金厚度加工課2~6u3.236~4.3181.669#1鎳厚度加工課150~300u196.829~245.6231.3910#2金厚度加工課0.05~0.15um0.063~0.0751.4711#2鎳厚度加工課3~6um3.926~4.9341.312防焊課S/M厚度IPQC0.4~1.2mil0.46~0.6860.8513油墨黏度防焊課60~80Sec.64.2~75.81.0814半成品清潔度IPQC6.4ug/in20.98