Cu-pillar-FC-bump-Technology-Overview

CupillarFCbumpingTechnologyoverview2Si-devicesPKGdesigntrendMoresmart&small2D2.5D3D-SiP3QualcommPKGroadmapSource:ELECTROIQApril1st20104Source:YoleDevelopmentApril20115STATS-ChipPACCuPillarstructureSource:ChipScaleReviewMay-June2011Source:I-MicronewsMar.3rd20116TI-AmkorTechnologyCuPillarstructureSource:AmkorTechnologyHP7TSMC/SPILCuPillarstructuresSource:ELECTROIQOct2010Source:I-MicronewsDec.10th2010Source:ELECTROIQJuly2011TSMCSPIL83D-assemblyInterposerexamplesSource:I-MicronewsMar.18th20119CuF/CBumpProcessSchemeDFRRemovalPI/PBOdev./cureUBMDepo./DFRLaminationDFRdev.UBMEtch.CuPlating/SnAgDepo.DryfilmPhotoresist2.38%TMAHHDMicroSystemsHD4100/HD8820Removedryfilm10FCCupillarbumpstructureideasa)PillaronUBMb)PillaronPIunderneathUBMc)PillaronRDLd)PillaronRDLwithUBM11SummaryforFCCupillarbumptechnology-Thereare2-differentCupillarstructureandapplicationse.g.1)FCbumpstructurewithlargerdiameterandpitch,typicallyφ20-25μm,40μmheight,40μmpitch.2)MicroCubumpstructurefor3Dchipstackingorinterconnection,typicallyφ10-15μm,5-15μmheight,25μmpitch.-ItisnoclearviewaboutnecessityofPIcoatingonCubumpapplication.Requiredcustomersurveywithattachedformatforbetterunderstandingaboutfunctionality.12