六西格玛案例R2_Measure_v2008a

V2008R2-1MeasureOutlineIdentifyInput,ProcessandOutputIndicatorsFishboneCEmetricsCollectDataDataCollectionPlanandOperationDefinitionMSAMSAPlanMSAConclusionProcessCapabilityDPPM,Cpk,Yield,ZvalueIDIPOIndicatorsCollectDataMSAProcessCapabilityV2008R2-2FishboneDiagramIDIPOIndicatorsCollectDataMSAProcessCapabilityDeterminethemajorcategories(Input&/orProcessIndicators)oftheeffect(CTQ/CTP)CTQ/CTPWhyGap?Manpower(GenericCategory)Machine(GenericCategory)Material(GenericCategory)Method(GenericCategory)Measurement(GenericCategory)InputIndicatorsProcessIndicatorsProcessIndicatorsProcessIndicatorsInputIndicatorsV2008R2-3Cause&EffectMatrix1234567空焊缺件浮件站立移位錯件零件不良客戶優先度評比9333322主流程步驟次流程步驟流程/輸入(X's)總分outlookinspected300000945Bodymarkinspected000009018PCBinspected300110033Stencilaperturedesign9009100111Stencilthickness900300089Carriercoplanrity330390072Carrierholdingtype333330063Solder-pasteparticle300300036Solder-pastetype300900054Solder-pasteviscosity300900054Squeegespeed300900054Squeegepressure300900054Cleaningfrquency9009000108Printingaligment9309300126supportingpin100030018Supportingblock100030018Carriersupporting109030045PreparationSolderprintingCarrierSolder-pasteSupportingStencilparametersettingRawmaterialinspectedIDIPOIndicatorsCollectDataMSAProcessCapabilityScale:0=None,1=Low,3=Moderate,9=StrongX4X5X6V2008R2-4IDIPOIndicatorsCollectDataMSAProcessCapabilityOperationaldefinitionOperationaldefinitionX20....X4X3X2X1SourceofX’sInput/ProcessIndicator(X)Sl.No.Y4Y3Y2FishboneorCEMatrixY1SourceofY’sOutputIndicator(Y)Sl.No.Remarks:WhilewritingoperationaldefinitionkeepinmindthedatatobecollectedforeachY&X.DataCollectionPlan-1FishboneorCEMatrixKeyIndicatorOperationDefinition&SummaryV2008R2-5DataCollectionPlan-2IDIPOIndicatorsCollectDataMSAProcessCapabilityRemarks:Otherdatareferstoadditionalinformationfromstratificationperspective.Performancemeasure(Y)OperationaldefinitionDatasourceandlocationSamplesizeWhowillcollectthedataWhenwilldatabecollectedHowwilldatabecollectedOtherdatathatshouldbecollectedatthesametimeY1客戶退貨率#退貨Qty//#出貨Qty品保1QA/AndyChenbyLot1.CustomercomplainX1-X15MSAProcess/Input(X)OperationaldefinitionDatasourceandlocationSamplesizeWhowillcollectthedataWhenwilldatabecollectedHowwilldatabecollectedOtherdatathatshouldbecollectedatthesametimeV2008R2-6MSAPlan(forallY’s)IDIPOIndicatorsCollectDataMSAProcessCapability外觀離散型特性Y1:污點Y2:刮傷Y3:印刷位置測試人員3person3person3person測試設備目視目視目視進行方法編號1~30給3位進行判定，循環2次編號1~30給3位進行判定，循環2次編號1~30給3位進行判定，循環2次判定方法共取得180個資料,依GageR&R計算之數值判定共取得180個資料,依GageR&R計算之數值判定共取得180個資料,依GageR&R計算之數值判定Sampling10good,10NG,10grey10good,10NG,10grey10good,10NG,10greyMesurementMethods卡尺厚薄規溫度計CCD投影機CalibrationPlanGRRPlanV2008R2-7MSAPlans(forKeyX’s)IDIPOIndicatorsCollectDataMSAProcessCapability數據型態離散型特性焊錫品質錫膏厚度偏移量檢測測試人員3persons2SPI2AOI測試設備目視CyberOptics/SE300Orbotech與x相關性x2~x5x1,x8x3進行方法利用3片報廢板製作標準件,每件標準板上,打上30顆元件,排定為10顆OK之焊錫結果,20顆NG之焊錫結果.編號1~30,隨機抽取1片標準板給3位目檢人員進行判定，循環3次從BS1線印刷10片MB,每片MB擷取固定一點進行量測,LoadandUn-load循環3次後,再交由另一台SPI進行量測.定義預量測的位置,進入AOI機台進行偏移測量三次判定方法共取得270個資料,依GageR&R計算之數值kappa指數判定(=90%)共取得60個資料,依GageR&R計算之數值%R&R判定共取得60個資料,依GageR&R計算之數值%R&R判定備註標準件缺點類別:短路*3,空焊*3,損件*2,缺件*2,偏移*4,墓碑*3,錫尖*2,錫過多*1量測系統分析進行計畫連續型V2008R2-8IDIPOIndicatorsCollectDataMSAProcessCapability%ConP/TV(SV/Proc)P/SV(%SV)P/T(SV/Toler)DistinctCategoriesAcceptable1%10%10%10%5MaybeAccept1–9%10–30%10–30%10–30%3-4NotAcceptable9%30%30%30%3MSAConclusion&RecommendationsGagePerformanceAnalysisSheet1.Keeporiginalsystem2.Extendorshortencalibrationtiming3.Changenewequipments4.Training5.Others…ContinueR&RResultsV2008R2-9AttributeR&RResultsIDIPOIndicatorsCollectDataMSAProcessCapability-GageR&RinqualitativedataAppraiserResponseKappaSEKappaZP(vs0)1OK0.857730.1290996.6440.0000空銲0.498270.1290993.85960.0001站立0.944340.1290997.31480.0000短路1.00000.1290997.7460.0000錫少0.384740.1290992.98020.0014Overall0.748070.06534911.44730.00002OK0.944340.1290997.31480.0000空銲0.666370.1290995.16160.0000站立10.1290997.7460.0000短路10.1290997.7460.0000錫少0.551670.1290994.27320.0000Overall0.833040.06471912.87170.00003OK0.90180.1290996.98530.0000空銲0.591440.1290994.58130.0000站立0.944340.1290997.31480.0000短路10.1290997.7460.0000錫少0.327310.1290992.53530.0056Overall0.769330.065211.79960.0000ActionPlanOwnerDuedateAssignSMTinspectorstoattendtheIPC-A-610Ctrainingcourseandgetthecertification.SMT/Ray7/ESMTinspectorsmustbecertifiedbyQAevery3monthstoensuretheircapability.SMT/RayFromnowon1.ReliabilityofSMTinspectorneedtobeimproved.2.ThedetectionsensitivityofsolderopenandsolderinsufficiencyneedtoclarifyandtraintheSMTinspectors.Remark:AgreementAnalysis,算出Kappa值要大於90%,若Kappa70%,表示人員需要重新訓練後,重作Attributegauge實驗.KeyFindingsandConclusion:V2008R2-10Baseline–Y1(ContinueData)IDIPOIndicatorsCollectDataMSAProcessCapabilityObservationIndividualValue9181716151413121111706050403020100_X=34.05UCL=66.59LCL=1.52IChartofAvgNo.oforderspermoCurrentBaselinePerformance:Mean:7.28StandardDeviation:s=2.36DistributionShap：TooWidlyConclusion:varianceisbigandshiftmean,bothofMeanandvarianceneedtobeimprovedV2008R2-11Baseline–Y2(DiscreteData)