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8.2.2.9.2ChipComponents–RectangularorSquareEndComponents–1,3or5SideTermination,TerminationVariations–MountingUpsideDownTarget-Class1,2,3•Elementofchipcomponentwithexposeddepositedelectricalelementismountedawayfromtheboard.Acceptable-Class1ProcessIndicator-Class2,3•Elementofchipcomponentwithexposeddepositedelectricalelementismountedtowardtheboard.ChipChip元件翻面元件翻面8.2.2.9.3ChipComponents–RectangularorSquareEndComponents–1,3or5SideTermination,TerminationVariations-StackingAcceptable-Class1,2,3•Whenpermittedbydrawing.•AllcomponentsmeetthecriteriaofTable8-2,featuresBthroughWfortheapplicableclassofacceptance.•Sideoverhangdoesnotprecludeformationofrequiredsolderfillets.Defect-Class1,2,3•Stackedpartswhennotrequiredbydrawing.•AllcomponentsdonotmeetthecriteriaofTable8-2,featuresBthroughW,fortheapplicableclassofacceptance.•Sideoverhangprecludesformationofrequiredsolderfillets.ChipChip元件堆叠元件堆叠8.2.2.9.4ChipComponents–RectangularorSquareEndComponents–1,3or5SideTermination,TerminationVariations–TombstoningDefect-Class1,2,3•Chipcomponentsstandingonaterminalend(tombstoning).ChipChip元件墓碑元件墓碑8.2.3CylindricalEndCap(MELF)Termination8.2.3.1CylindricalEndCapTermination,SideOverhang(A)TargetCondition-Class1,2,3•Nosideoverhang.Acceptable-Class1,2,3•Sideoverhang(A)islessthan25%diameterofcomponentwidth(W)orlandwidth(P),whicheverisless.Defect-Class1,2,3•Sideoverhang(A)isgreaterthan25%ofcomponentdiameter,(W),orlandwidth(P),whicheverisless.8.2.4CastellatedTerminations8.2.4CastellatedTerminations城堡形的无铅芯片载体城堡形的无铅芯片载体城堡形的8.2.5FlatRibbon,L,andGullWingLeads8.2.5.1FlatRibbon,L,andGullWingLeads,SideOverhang(A)Acceptable-Class1,2•Maximumoverhang(A)isnotgreaterthan50%leadwidth(W)or0.5mm[0.02in],whicheverisless.Acceptable-Class3•Maximumoverhang(A)isnotgreaterthan25%leadwidth(W)or0.5mm[0.02in],whicheverisless.TargetCondition-Class1,2,3•Nosideoverhang.Defect-Class1,2•Sideoverhang(A)isgreaterthan50%leadwidth(W)or0.5mm[0.02in],whicheverisless.Defect-Class3•Sideoverhang(A)isgreaterthan25%leadwidth(W)or0.5mm[0.02in],whicheverisless.8.2.5.2FlatRibbon,L,andGullWingLeads,ToeOverhang(B)8.2.5.2FlatRibbon,L,andGullWingLeads,ToeOverhang(B)Acceptable-Class1,2,3•Toeoverhangdoesnotviolateminimumelectricalclearance.Defect-Class1,2,3•Toeoverhangviolatesminimumelectricalclearance.TargetCondition-Class1,2,3•Endjointwidthisequaltoorgreaterthanleadwidth.Acceptable-Class1,2•Minimumendjointwidth(C)is50%leadwidth(W).Acceptable-Class3•Minimumendjointwidth(C)is75%leadwidth(W).Defect-Class1,2•Minimumendjointwidth(C)islessthan50%leadwidth(W).Defect-Class3•Minimumendjointwidth(C)islessthan75%leadwidth(W).8.2.5.4FlatRibbon,L,andGullWing8.2.5.4FlatRibbon,L,andGullWingLeads,MinimumSideJointLength(D)Leads,MinimumSideJointLength(D)Target-Class1,2,3•Evidenceofwettedfilletalongfulllengthoflead.Defect-Class1•Minimumsidejointlength(D)islessthantheleadwidth(W)or0.5mm[0.02in],whicheverisless.Defect-Class2,3•Whenfootlength(L)isgreaterthanthree(W),minimumsidejointlength(D)islessthanthreeleadwidths(W).•Whenfootlength(L)islessthanthree(W),(D)islessthan75%(L).Acceptable-Class1•Minimumsidejointlength(D)isequaltoleadwidth(W)or0.5mm[0.02in],whicheverisless(notshown).Acceptable-Class2,3•Whenfootlength(L)isgreaterthanthree(W),minimumsidejointlength(D)isequaltoorgreaterthanthreeleadwidths(W),Figure8-83.•Whenfootlength(L)islessthanthree(W),(D)isequalto75%(L),Figure8-84.8.2.5.5FlatRibbon,L,andGullWing8.2.5.5FlatRibbon,L,andGullWingLeads,MaximumHeelFilletHeight(E)Leads,MaximumHeelFilletHeight(E)Target-Class1,2,3•Heelfilletextendsaboveleadthicknessbutdoesnotfillupperleadbend.•Solderdoesnotcontactthecomponentbody.Acceptable-Class1,2,3•SoldertouchesaplasticSOICorSOTcomponent.•Solderdoesnottouchceramicormetalcomponent.Acceptable-Class1Defect-Class2,3•Soldertouchesthebodyofaplasticcomponent,exceptforSOICsandSOTs.•Soldertouchesthebodyofaceramicormetalcomponent.8.2.5.6FlatRibbon,L,andGullWingLeads,MinimumHeelFillet8.2.5.6FlatRibbon,L,andGullWingLeads,MinimumHeelFilletHeight(FHeight(FTarget-Class1,2,3•Heelfilletheight(F)isgreaterthansolderthickness(G)plusleadthickness(T)butdoesnotextendintokneebendradius.Acceptable-Class1•Awettedfilletisevident.Acceptable-Class2•Minimumheelfilletheight(F)isequaltosolderthickness(G)plus50%leadthickness(T)atconnectionside.Acceptable-Class3•Minimumheelfilletheight(F)isequaltosolderthickness(G)plusleadthickness(T)atconnectionside.Acceptable-Class1,2,3•Inthecaseofatoe-downconfiguration(notshown),theminimumheelfilletheight(F)extendsatleasttothemidpointoftheoutsideleadbend.Defect-Class1•Awettedfilletisnotevident.Defect-Class2•Minimumheelfilletheight(F)islessthansolderthickness(G)plus50%leadthickness(T)atconnectionside.Defect-Class3•Minimumheelfilletheight(F)islessthansolderthickness(G)plusleadthickness(T)atconnectionside.Defect-Class1,2,3•Inthecaseofatoe-downconfiguration,theminimumheelfilletheight(F)doesnotextendatleasttothemid-pointoftheoutsideleadbend.8.2.5.7FlatRibbon,L,andGull8.2.5.7FlatRibbon,L,andGullWingLeads,SolderThickness(G)WingLeads,SolderThickness(G)Acceptable-Class1,2,