LED封装中热沉及热电制冷器材料的研究进展作者:钟达亮,秦红,王长宏,肖泽成作者单位:广东工业大学材料与能源学院,广东,广州,510006刊名:材料研究与应用英文刊名:MATERIALSRESEARCHANDAPPLICATION年,卷(期):2010,04(4)参考文献(18条)1.LIUShu-ping;XUTie-junTheradiationschemedesignofsolarenergyLEDlightingsystembasedsemiconductorrefrigerationtechnology20082.LIUChun-kai;DAIMing-ji;YUChih-kuangHighefficiencysilicon-basedhighpowerLEDpackageintegratedwithmicro-thermoelectricdevice20073.ARIKM;PETROSKIJ;WEAVERSThermalChallengesinthefuturegenerationsolidstatelightingapplications:LightEmittingDiode20024.ARIKM;BECKERC;WEAVERSThermalmanagementofLEDs:packagetosystem[外文期刊]20045.NARENDRANN;GUYLifeofLED-basedwhitelightsources[外文期刊]2005(1)6.PETROSKIJSpacingofhigh-brightnessLEDsonmetalsubstratePCB'sforproperthermalperformance[外文会议]20047.LIUChun-kai;DAIMing-Ji;YUChih-kuangHighefficiencysilicon-basedhighpowerLEDpackageintegratedwithmicoro-thermoelectricdevice20078.YUJian-zu;GAOHong-xia;XIEYong-qiThermaldesignandanalysistechniquesofelectronicequipment20089.JAMESM.F;RODRIGUEZPComputationalfluiddynamicandheattransferanalysisofanAl/SicIGBTpowerhybridpackage[外文会议]199710.FARHADS;WhalleyDCThermaldesignofhighpowersemiconductorpackagesforaircraftelectronicsystems[外文会议]199911.HOLAHANMFFin,Fan,andForm:VolumetricLimitstoAir-sideHeatsinkPerformance2005(02)12.NINGPu-qi;LEIGuang-yin;WANGFSelectionofheatsinkandfanforhigh-temperaturepowermodulesunderweightconstraint200813.SHAHA;SAMMAKIABG;SRIHARIHAnumericalstudyofthethermalperformanceofanimpingementheatsink-Finshapeoptimization[外文期刊]2004(04)14.KIMSK;KIMSY;CHOIYDThermalperformanceofcoolingsystemforred,greenandblueLEDlightsourceforrearprojectionTV200615.WANGChang-hong;ZHUDong-shengResearchprogressonthermoelectriccoolingtechnologyappliedinelectronicpackagingthermalmanagement[期刊论文]-ElectricComponents&Materials2008(11)16.CHENGJen-hau;LIUChun-kai;CHAOYu-linCoolingPerformanceofsilicon-basedthermoelectricdeviceonhighpowerLED[外文会议]200517.BORRAGOJMCarrierconcentrationoptimizationinsemiconductorthermoelements[外文期刊]1963(02)18.DASHEVSKYZ;GELBSTEINY;EDRYIOptimizationofthermoelectricefficiencyingradedmaterials[外文会议]2003本文读者也读过(1条)1.熊礼威.汪建华.满卫东.谢鹏.孙蕾.吴斌.刘长林.XIONGLi-we.WANGJian-hua.MANWei-dong.XIEPeng.SUNLei.WUBin.LIUChang-lin微波CVD金刚石热沉片的制备研究[期刊论文]-真空与低温2009,15(1)引用本文格式:钟达亮.秦红.王长宏.肖泽成LED封装中热沉及热电制冷器材料的研究进展[期刊论文]-材料研究与应用2010(4)