EPworks-3D-2.5D-TSV-Interposer

©2012•1NotforuseordisclosurewithoutexpressedwrittenconsentfromEPworksCo.Ltd..Allinformationsubjecttochangewithoutnotice.3D/2.5DTSVInterposer–ProcessandApplication2012.10.24SematechSymposiumKoreaGu-SungKim,Ph.D,Th.M.EPWorksCo.,Ltd.KoreaPreparedbyEPworksCo.,Ltd.Korea.Semiconductor3DTSVIC/WLPFoundryandSolutionProvidertotheIndustryCopyrights2012AllRightReserved©2012•2NotforuseordisclosurewithoutexpressedwrittenconsentfromEPworksCo.Ltd..Allinformationsubjecttochangewithoutnotice.Thispresentationcontains“Forwardlookingstatements”withinthePrivateSecuritiesLitigationReformActof2007,IncludingstatementregardingKangnamUniversityandCenterforElectropackageSystemandInterconnectProductofEPworksCo.,Ltd.’sfutureactivities,andotherresultsofoperations.Ouractualresultsmaydiffermateriallyfromresultsdiscussedintheseforwardlookingstatementsforavarietyofreasons,includingrisksassociatedwithcyclicallyandmarketconditioninthesemiconductorindustry,demandfortheoutsourcedsemiconductormanufacturingservicesweofferandforsuchoutsourcesgenerally,ourabilitytomaintainahighcapacityutilizationraterelativetoourfixedcosts,competitioninourIndustryandotherreasons.InAddition,ThisPresentationcontainsseveralphotosandtableswithoutnotifyseveralauthorsonvariousWebsites.Therefore,presentationmaterialshouldonlyuseat2012ICEP-IAAC,Tokyo,inJapan.Donotdistributeandcopyofthismaterialwithoutpermitting!.OverviewInterposerApplicationProcessandProductivityContentsContents©2012•3NotforuseordisclosurewithoutexpressedwrittenconsentfromEPworksCo.Ltd..Allinformationsubjecttochangewithoutnotice.EPworksEPworksCompany was founded to provide advanced Company was founded to provide advanced semiconductor package solution at a high level semiconductor package solution at a high level TSV TSV (Through(Through‐‐SiSi‐‐Via) Via) process and structure.process and structure.In 6 years, EPworks has expanded from its beginning 3D In 6 years, EPworks has expanded from its beginning 3D TSV research activities into providing stateTSV research activities into providing state‐‐ofof‐‐thethe‐‐art 3D art 3D interposer and stacked IC solution in a variety of TSV interposer and stacked IC solution in a variety of TSV application to meet the customers' needs.application to meet the customers' needs.We focuses on developing intelligent designs of interposer We focuses on developing intelligent designs of interposer with logic, memory, LED, and image sensor that solve with logic, memory, LED, and image sensor that solve customer packaging issues through intuitive, easy to use customer packaging issues through intuitive, easy to use means while providing excellent service.means while providing excellent service.We have set 12 inch TSV process facility for production of We have set 12 inch TSV process facility for production of interposer interposer at 2011.at 2011.EPWorks means ElectroEPWorks means Electro‐‐Package Workers for advanced  Package Workers for advanced  semiconductor packaging solution. semiconductor packaging solution. AddressB‐106 Seoul Techno Park , 138 Gongrunggil, Nowon‐Gu, Seoul, Korea (139‐743)AboutEPworksEPworks©2012•4NotforuseordisclosurewithoutexpressedwrittenconsentfromEPworksCo.Ltd..Allinformationsubjecttochangewithoutnotice.EquipmentsWafer Size8”12”LithographyMask Aligner√√CD Track√MLVia etchingDeep SiEtcher√√Wet (KOH/TMAH)√√Via IsolationFurnace (Oxide/Nitride)√√PE‐CVD/SA‐CVD√‐MetallizationHAR PVD√√Electroplating√√ElectrolessPlating√√EtchingICP Etcher/Ashing√√Spin Etch System√√SRD√√BondingWafer Aligner /Bonder√MLWafer‐levelback‐EndDicing (Saw/Laser)√√Grinding/Cu CMP√√FluxlessReflow√‐Bump / Metal Finish√√200‐300 inch Process–3D TSV Process–Wafer Bond and Thin Process–Redistribution Process–Wafer Level Process–Bump Process (Sn/Ag, Cu, Sn)TSVRDL / WLPBump200mm      300mm         Units200mm      300mm         Units1,500             1,000           wafers/M2,500             1,500           wafers/M3,000             2,000           wafers/MCapacity @ 2012. 2Q EPWorks TSV LineEPWorks TSV Line‐‐UpUp©2012•5NotforuseordisclosurewithoutexpressedwrittenconsentfromEPworksCo.Ltd..Allinformationsubjecttochangewithoutnotice.Enlarge Capacity and Panel Size  processing capability availableEnlarge Capacity and Panel Size  processing capability availableon 2012on 2012Wet SolventAlignerCD‐TrackDeep SiEtcherCVDICP EtcherElectro PlatingWet ProcessingSRDBall PrinterDicing SawWhite BayWet ProcessingElectrolessPlating CoaterOvenFurnace88‐‐12inch TSV Line at EPW12inch TSV Line at EPW©2012•6NotforuseordisclosurewithoutexpressedwrittenconsentfromEPworksCo.Ltd..Allinformationsubjecttochangewithoutnotice.FoundedbyElectro-packageEngineersat2006Worldfirst12inchTSVInfrastructureforinterposerPilotProductionandProto-TypeServiceforinterposerandTSVproductsLowCostSolutionEPWdesignedProcessandEquipmentDevelopmentforMassProductionHistory of  EPWHistory of  EPW©2012•7NotforuseordisclosurewithoutexpressedwrittenconsentfromEPworksCo.Ltd..Allinformationsubjecttochangewithoutnotice.WiringGapWiringGapRF RF SiPSiPTr