EIA-364-52-A

EIASTANDARDANSI/€IA364-52A-2003Approved:January8,2003IITP-52AISOLDERABILITYOFCONTACT~TERMINATIONSTESTIPROCEDUREFORELECTRICALCONNECTORSANDSOCKETSEIA-364-52A(RevisionofEIA-364-52)March2003CopyrightElectronicComponents,Assemblies&MaterialsAssociationReproducedbyIHSunderlicensewithECANotforResaleNoreproductionornetworkingpermittedwithoutlicensefromIHS--`,`-`-`,,`,,`,`,,`---NOTICEEIAEngineeringStandardsandPublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforhisparticularneed.ExistenceofsuchStandardsandPublicationsshallnotinanyrespectprecludeanymemberornonmemberofEIAfrommanufacturingorsellingproductsnotconformingtosuchStandardsandPublications,norshalltheexistenceofsuchStandardsandPublicationsprecludetheirvoluntaryusebythoseotherthanEIAmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.StandardsandPublicationsareadoptedbyEIAinaccordancewiththeAmericanNationalStandardsInstitute(ANSI)patentpolicy.Bysuchaction,EIAdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheStandardorPublication.ThisstandardisbaseduponthemajortechnicalcontentofInternationalElectrotechnicalCommissionstandard512-6,test12a,solderability,wetting,solderbathmethod,1984.ItconformsinallessentialrespectswiththisIECstandard.ThisStandarddoesnotpurporttoaddressallsafetyproblemsassociatedwithitsuseorallapplicableregulatoryrequirements.ItistheresponsibilityoftheuserofthisStandardtoestablishappropriatesafetyandhealthpracticesandtodeterminetheapplicabilityofregulatorylimitationsbeforeitsuse.Publishedby@ELECTRONICINDUSTRIESALLIANCE2003EngineeringDepartment2500WilsonBoulevardArlington,VA22201CopyrightElectronicComponents,Assemblies&MaterialsAssociationReproducedbyIHSunderlicensewithECANotforResaleNoreproductionornetworkingpermittedwithoutlicensefromIHS--`,`-`-`,,`,,`,`,,`---PLEASE!DON'TVIOLATETHELAW!ThisdocumentiscopyrightedbytheEUandmaynotbereproducedwithoutpermission.Organizationsmayobtainpermissiontoreproducealimitednumberofcopiesthroughenteringintoalicenseagreement.Forinformation,contact:GlobalEngineeringDocuments15InvernessWayEastEnglewood,CO80112-5704orcallUSAandCanada(1-800-854-7179),International(303-397-7956)CopyrightElectronicComponents,Assemblies&MaterialsAssociationReproducedbyIHSunderlicensewithECANotforResaleNoreproductionornetworkingpermittedwithoutlicensefromIHS--`,`-`-`,,`,,`,`,,`---CONTENTSClausePage11.11.21.322.12.233.13.244.14.24.34.456Table12Introduction...............................................................................................................Scope.........................................................................................................................Referencedocument..................................................................................................Object........................................................................................................................Testresources............................................................................................................Equipment.................................................................................................................Material.....................................................................................................................Testspecimen............................................................................................................Description................................................................................................................Preparation................................................................................................................Testprocedure...........................................................................................................Steamaging...............................................................................................................Diptest......................................................................................................................Examination..............................................................................................................Recommendedpass/failcriteria................................................................................Detailstobespecified...............................................................................................Testdocumentation...................................................................................................Contaminationlevel..................................................................................................Steamtemperaturerequirements...............................................................................111233346624AnnexANonnative...................................................................................