单片机控制温度加热系统设计

长春工业大学毕业设计、毕业论文题目单片机控制温度加热系统设计学院电气与电子工程学院专业班级指导教师姓名年月日长春工业大学本科毕业设计（论文）I摘要在日常生活及工业生产过程中，经常要用到温度的检测及控制，温度是生产过程和科学实验中普遍而且重要的物理参数之一。在生产过程中，为了高效地进行生产，必须对它的主要参数，如温度、压力、流量等进行有效的控制。温度控制在生产过程中占有相当大的比例。温度测量是温度控制的基础，技术已经比较成熟。该设计介绍了一种利用单片机AT89C51组成的高精度温度控制系统，从硬件和软件两方面介绍了单片机温度控制系统的设计思路。着重介绍了硬件原理图和程序框图。阐述了系统的工作原理、设计及实现。由DS18B20温度传感器芯片测量当前的温度，并将结果送入单片机。然后通过AT89S51单片机对送来的温度进行计算和转换，并将此结果送入液晶显示模块。最后，由1602液晶显示器将温度显示出来。它可以实时的显示和设定温度，实现对温度的自动控制，当温度值超出上、下限时自动报警，实现了系统结构简单、性能可靠、控制精度高。同时系统具有扩展性好，分辨率高，测量范围宽，抗干扰性强等特点。关键词：51单片机传感器DS18B20长春工业大学本科毕业设计（论文）IIABSTRACTThedetectionandcontroloftemperatureisoftenusedindailylifeandindustrialproductionprocess,temperatureisoneoftheimportantphysicalparametersoftheproductionprocessandscientificexperimentsgenerally.Duringtheproductionprocess,inordertocarryouttheproductionefficiently,wemustcontrolitsmainparameterswell,suchastemperature,pressureandsoon.Temperaturecontrolintheproductionprocessesalargeproportion.Temperaturemeasurementisthebasisoftemperature-controllingandamorematuretechnology.AprecisiontemperaturecontrolsystemusedAT89C51SCMandthehardwarecircuitandsoftwareofthissystemareintroduced.Schematicdiagramofthehardwareandproceduresisrelatedinemphasis.Workingprinciple,designandimplementationiselaborated.ThecurrenttemperatureismeasuredbyDS18b20temperaturesensorandtheresultsistransportedintoSCM.Then,thetemperatureiscalculatedandtheconversionresultsistransportedintotheliquidcrystaldisplaymodules1602onshow.Itcandisplaycurrenttemperaturewhichissetrandomlyandcontrolledflexibility,andthetemperaturecontrol.Whenthetemperatureisbeyondtheupperandlowerlimitsoftemperature,thealarmsystemstartsautomatically.Whatisrealizedinthissystemissimplestructure,reliableperformanceandhighprecisioncontrol.Thesystemisingoodscalability，high-resolution，widerange，anti-interferenceperformanceandsoon．KeyWords:51-seriesmicrocomputerSensorDS18B20长春工业大学本科毕业设计（论文）III目录第一章绪论.........................................................11.1课题的意义......................................................11.2国内外研究状况和发展趋势........................................11.2.1温度检测技术简介...........................................11.2.2温度检测技术的发展.........................................31.3课题的研究方案..................................................41.3.1课题的主要研究的内容......................................41.3.2用单片机实现其具体控制功能...............................4第二章方案论证........................................................52.1题目分析........................................................52.2总体方案选择....................................................52.2.1方案一热敏电阻加A/D......................................52.2.2方案二数字传感器..........................................52.3硬件电路方案的选择..............................................62.3.1显示器的选择...............................................62.3.2温度传感器的选择...........................................62.3.3单片机的选择...............................................72.3.4按键电路的设计.............................................72.3.5固态继电器的选择..........................................82.4软件方案选择...................................................10第三章硬件电路设计...................................................103.1硬件系统框图...................................................113.2AT89C51功能简述..............................................113.2.1主要特性.................................................113.2.2特性概述..................................................123.2.3芯片擦除.................................................123.2.489C51管脚说明...........................................123.3EPROM2764功能简述.............................................153.4RAM6264功能简述...............................................163.574LS373功能简述...............................................173.6温度传感器DS18B20的工作原理...................................173.6.1DS18B20的概述............................................183.6.2DS18B20的主要特性........................................18长春工业大学本科毕业设计（论文）IV3.6.3DS18B20的工作过程........................................183.6.4DS18B20的测温原理........................................203.6.5温度检测电路设计..........................................223.7时钟电路.......................................................223.8复位电路.......................................................233.9显示电路.......................................................253.9.1移位寄存器芯片74LS164....................................253.9.2七段LED数码管...........................................263.10加热主电路....................................................273.11系统电源......................................................283.12报警电路......................................................28第四章PID控制算法....................................................304.1控制算法PID的原理和特点.......................................304.2控制算法PID的优点.............................................314.3控制算法PID的参数整定.........................................33第五章软件系统流程图.................................................335.1主程序流程.....................................................345.2DS18B20的度温度子程序流程.....................................345.3PID算法子程序.........................................