IT-180A-I板材说明

REV2.0-17IT-180AHighTg/LeadFree/HighReliabilityLaminate&PrepregExcellentCAFresistanceGoodthrough-holereliabilityLowCTEandhighthermalreliabilityForautomotive,highlayerPCB,networking,andheavycopperapplicationsLaminatepropertiesItemsIPCTM-650TypicalValueUnitPeelStrength,minimumA.LowprofilecopperfoilB.Standardprofilecopperfoil2.4.858lb/inchVolumeResistivity2.5.17.11x109M-cmSurfaceResistivity2.5.17.11x108MMoistureAbsorption,maximum2.6.2.10.10%Permittivity(Dk,50%resincontent)A.1GHzB.2GHzC.5GHzD.10GHz2.5.5.134.44.34.14.1--LossTangent(Df,50%resincontent)A.1GHzB.2GHzC.5GHzD.10GHz2.5.5.130.0150.0150.0160.016--FlexuralStrength,minimumA.LengthdirectionB.Crossdirection2.4.4500-530410-440N/mm2ThermalStress10sat288°CA.UnetchedB.Etched2.4.13.1PassPassRatingFlammabilityUL94V-0RatingGlassTransitionTemperature(DSC)2.4.25175˚CDecompositionTemperature2.4.24.6345˚CX/YAxisCTE(40℃to125℃)2.4.2411-13/13-15ppm/˚CZ-AxisCTEA.Alpha1B.Alpha2C.50to260DegreesC2.4.24452102.7ppm/˚Cppm/˚C%ThermalResistanceA.T260B.T2882.4.24.16020MinutesMinutes