垂直单向导电胶_

1.IsotropicConductiveAdhesivesICAs2.AnisotropicConductiveAdhesivesACAsTFTLiquidCrystalDisplayLCDIndiumTinOxideITOTCPInterconnectionConductiveAdhesiveflake20-35OrganicSolderHeatSinkGrounding2ALIVHBitElasticityStyreneAcrylicCompressionRepulsion0.05ACAsB-stageZAF3MACF2mil/2milFlipChipLCDACFSonyTorayHitachiChemicalSamsong3MLCDDriverICITOACFUnderfillACFAnisotropicConductiveFilmChiponGlassCOGChiponFlexCOFChipAdhesiveParticleBoardChipBoardAdhesiveParticle0Bondingtemperature:180CBondingtime:20sACFfilledwithAucoatedpolymerspheresBondingpressure(kgf/mm)Contactresistance(mW)Citcuit1Circuit2InductanceLeadsCellphonePDAPolypyrroleTgGlassTransitionTemperaturePVCPETgEpoxiesSiliconesCrosslinkingReversibleA-stageB-Stage30303.IntrinsicallyConductiveAdhesive1.ThermoplasticAdhesives2.ThermosettingAdhesivesNHNHNHNHNHNHNHNHNHNHNHNH2nHe2e(2n-1)e2HpP=DopingAnionseBrittlenessElastomericNetworkHybridsFR-4PolyestersPolyimides1948SilverElectromigrationVolumefractionsofconductingparticles(vol%)THERMOPLASTICTHERMOSET(3DNetwork)CROSS-LINKS5.(Crosslinks)(Thermoplastic)(Thermoset)InX-YplaneInZdirection0.5Resin0.5ACFElastomer,COFCOGACF2MHzAC20mAACF20Sony(Toray)CP1030CalculatorPressureSensitiveAdhesiveMemberSwitchesPitch800m32mil2000TP-1141150m2milBareChipFlipChipChiponBoardorDirectChipAttachSonyACF203.1ACF3.2LCDLiquidCrystalNematicLCD90ITOColorFitlerRGBDisplayLCDTNTwistedNematicLCDSTNSupperTwistedNematicLCDThinFilmTransistorTFT1521TFT-LCDMonitorLGSamsung47LCDITO10ohms31510248IC7683IC2000FR-4ACFTFF-LCDModuleFR-4TABTapeAutomaticBondingTCPTapeCarrierPackagingInnerLeadICILBOuterLeadACFITOACFENIGENIGTABICTABTABWUSLCDLCDpanelACFfilledwithNi/AucoatedpolymerspheresTABICchipMetalelectrodeACFfilledwithNiparticlesPCBITOelectrodePCBICchipICchipPCBPCBACF0.5-10%12%LCDACFFCFC1212atm100%RHPressureCokerTestPCTACFStyreneAcrylic12010080604020002468101214161820PercentageContactShortcircuitContentofconductiveparticles(vol-%)ACFHydrogenBondingIncompleteWettingACFShearStressTCEACFTgWettingCalculatorTNSTNPSAPressureSensitiveAdhesiveACFPSA/ThermosetACFACF3MZAFZAFThermocoupleZAFZAFPCBTackFreePlanarityHotBarPressure-indicatingFilmACFOffSpec.ACFACFTABPCBReflowENIGOSPSMTACFSpootParticlesAdhesiveReleaseLiner3mmwidthReleaseLiner(removedafteradhesiveapplication)CitcuitLines,TopCircuitHotBarAdhesiveX-Section1milor2milthicknessElectricalConductioninZDirectionNoShortCircuitinX-YDircetions(1)(3)(4)(5)(6)FCACFSubstrateACF60-902-3kg/cm3-5160-210250-600g/cm5-2024050ACFFCVoidICWireBondTABACFFCITOICI/OInput/OutputDCAFCACF(2)COFCOGNotebookACFPCBTABPCBACFENIGKnowledgeispower1.ConductiveAdhesivesforElectronicsPackaging(1999)ByJohanLiu;publishedbyElectrochemicalpublications.2.DevelopmentTendencyofACFforBare-ChipBondingByMotohideTakeichi,HDIMagazineApr.20013.UsingConductiveAdhesivesforGroundingApplications.ByStaleyTead,CircuitAssemblyMagazine,Fab.2000.4.PackagingofLiquidCrystalonSiliconMicrodisplays.ByJuliaGoldstein,AdvancedPackagingMagazine,May2001.5.Anisotropic(ZAF's)ConductiveAdhesivesforElectronicConnections.ByRobertRudman,IPC1999proceedingsS02-26.7.19988