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I摘要微组装工艺技术是一个电子行业公司必须具备的工艺技术。本课题从公司实际需求出发，进行毫米波产品生产中急需的微组装关键工艺技术的开发，微组装关键工艺技术主要是粘接/烧结工艺技术和微型焊接工艺技术，它是微组装工艺技术中的重要和基础技术。本论文在查阅大量相关技术资料和结合相关工作经验的情况下，首先从技术角度研究和探讨了粘接/烧结工艺技术和微型焊接工艺技术的原理，关键因素，失效模式，不良现象及其解决方法，检验技术要求及方法等。粘接/烧结工艺技术是指将去除工艺线后的电路基板、陶瓷基板，通过导电胶粘接或者通过合金焊料烧结在器件的金属腔体上，从而实现对基板的物理支撑和散热。基板粘接/烧结工艺的重点是超声波清洗工艺和焊料烧结/导电胶固化工艺。微型焊接工艺技术包括芯片的粘接/共晶工艺技术，金丝楔/球键合工艺技术。芯片的粘接/共晶工艺技术是指半导体芯片与载体（封装壳体或基片）形成牢固的、传导性或绝缘性连接的方法。焊接层除了为器件提供机械连接和电连接外，还须为器件提供良好的散热通道。金丝楔/球键合工艺技术是指使用金属丝（金线等），利用热压或超声能源，完成微电子器件中固态电路内部互连接线的连接，即芯片与电路或引线框架之间的连接。金丝键合按照键合方式和焊点的不同分为球键合和楔键合。本论文结合多次功能性实验的结果和经验，设计了工艺流程，对具体工艺细则和操作步骤，设备参数设置等进行了开发，开发完毕后再通过实验对开发的工艺进行了验证，实验证明工艺流程合理，工艺方法可靠，工艺参数有效。本课题全面完成了微组装关键工艺技术的开发要求，项目组所制定的“毫米波微组装工艺细则”、“微组装关键工艺技术研制”、“毫米波T/R组件生产工艺流程卡片”已通过公司鉴定并归档，本人拟制的“毫米波批生产工艺能力建设方案”已经通过专家评审，并在《硅谷》国家级科技类学术期刊发表“浅谈混合微波集成电路的制作”技术论文一篇。本课题不但填补了公司在微组装技术方面的空白，解决了公司毫米波产品T/R组件生产问题。同时，在开发的过程中，积累了大量实验数据和技术经验，为公司全面发展微组装工艺技术的开发，奠定了一定的基础。关键词：微组装关键工艺技术，芯片粘结/共晶，金丝楔/球焊，工艺开发IIABSTRACTMicro-assemblyprocesstechnologyisamust-haveelectronicsindustry'stechnology。Thesubjectoftheactualneedsofdeparturefromthecompany's，Millimeter-waveproductsneededfortheproductionofkeytechnologyofmicro-assemblytechnologydevelopment。Micro-assemblytechnologyismainlythekeybonding/sinteringtechnologyandmicro-weldingtechnology，ItistheMicro-assemblytechnologytotheimportantandbasictechnology。Inthispaper,alargenumberofrelatedtechnologiesintheaccesstoinformationandintegrationofrelevantworkexperienceinthefirststudyandexplorefromatechnicalpointofviewofthebonding/sinteringtechnologyandtheprincipleofmicro-weldingtechnology,thekeyfactors,failuremodes,negativephenomenaandtheirsolutionsmethods,technicalrequirementsandtestingmethods。Bonding/sinteringprocesstechnologyreferstotheremovalofthecircuitsubstrateaftertheprocessingline,ceramicsubstrate,thenthroughtheconductiveadhesiveorbysolderalloysinteredmetalinthedevicecavity,therebyachievingthephysicalsupportofthesubstrateandheatdissipation。Substratebonding/sinteringprocessfocusedontheultrasoniccleaningprocessandsinteredsolder/conductiveadhesivecuringprocess。Micro-weldingtechnology,includingchipbonding/eutectictechnology,goldwedge/ballbondingtechnology。Chipbonding/eutectictechnologyreferstothesemiconductorchipandcarrier(packageshellorsubstrate)toformasolid，conductiveorinsulatingconnections。Inadditiontothedevicesolderlayerprovidesmechanicalconnectionandelectricalconnection,itmustbeforthedevicetoprovideagoodcoolingchannel。Goldwedge/ballbondingtechnologyistheuseofmetalwire(goldwire,etc),theuseofhot-pressingorultrasonicenergytocompletethesolid-statemicroelectronicdeviceswithintheinterconnectioncircuitwiringconnections,thatis,circuitorleadframechipandbetweentheconnections。Goldwirebondinginaccordancewithbondingandsolderjointsweredividedintoballbondingandwedgebonding。Inthispaper,experimentswithmultiplefunctionalresultsandexperiencetodesigntheprocess,specificrulesandprocesssteps,deviceparametersettingsweredevelopedaftercompletionofthedevelopmentprocessthroughexperimentscarriedoutontheIIIdevelopmentofvalidatedresultsshowrationalprocess,processmethodisreliableandeffectiveprocessparameters。Thesubjectscompletedacomprehensivekeytechnologyofmicro-assemblytechnologydevelopmentrequirements,theprojectteamdevelopedthe“Rulesofmillimeter-wavemicro-assemblyprocess,”“hybridintegrationofkeytechnologydevelopment”,“millimeterwaveT/Rmoduleproductionprocesscard”hasbeenfiledbythecompanyidentifiedand,Iamdrawingupa“millimeterwavesoundproductiontechnologycapacity-buildinggrantprogram”hasbeenthroughexpertassessment,andin“SiliconValley”NationalScienceandTechnologyAcademicJournalspublished“Ontheproductionofhybridmicrowaveintegratedcircuits”technologypaper1.Therealissueisnotonlytofillingapsinmicro-assemblytechnologytosolvethecompany'smillimeterwaveproductsT/Rcomponentsofproductionproblems。Atthesametime,inthedevelopmentprocess,heaccumulatedalargenumberofexperimentaldataandtechnologyexperienceforthecompanyoveralldevelopmentofmicro-assemblytechnologydevelopment,layingacertainfoundation。Keywords：Micro-assemblykeyprocesstechnology,chipbonded/eutectic,goldwedge/ballwelding,processdevelopmentVI目录第一章绪论..................................................................................................................11.1前言......................................................................................................................11.2研究范围及最终目标............................................................................................21.2.1研究范围..........................................................................................................21.2.2研究目标及成果形式......................................................................................31.3课题的实用价值和理论意义................................................................................31.4微组装工艺技术概况............................................................................................4第二章粘接/烧结工艺技术研究.................................................................................62.1基板粘接/烧结工艺技术分析......................................................