PADS逻辑类型说明

中英文大意ANABGAballgridarray球栅阵列封装BPFBQFCAPCAPACITOR电容器CFPCFP陶瓷扁平封装CLCCMOCONCONIN连接器CQFDIODIODE二极管DIPDualIn-linePackage双列直插式组件ECLEDGFUSFUSE保险丝HMOHOLINDINDUCTANCE电感LCCLeadlesschipcarrier无引脚片式载体MOSMetalOxideSemiconductor金属氧化物半导体OSCOpenSourceCommerce振荡器PFPPGAbuttjointpingridarray碰焊(pingridarray)PLCPOTPOTENTIOMETER可变电阻器PQFPSOQFJCLCC(ceramicleadedchipcarrier)也称QFJ,QFJ-GQFPquadflatpackage四侧引脚扁平封装QSORESResistor电阻器RLYRLY继电器SCRSiliconControlledRectifier可控硅SKTSOIsmallout-lineI-leadedpackageI形引脚小外型封装SOJSmallOut-LineJ-LeadedPackage(J形引脚小外型封装)SOPsmallOut-Linepackage(小外形封装)SSOSWISWITCH开关TQFTRXTransistor(三极管TSOTTLTransistor-TransistorLogic(BJT-BJT逻辑门VSOXFRXFMR变压器ZENZENER齐纳二极管UND增加SIPsinglein-linepackage直插式组件photoelectriccoupler(光电耦合器LEDLightEmittingDiode发光二极管TVSTransientVoltageSuppressor(瞬态电压抑制二极管)FBFerritebead(磁珠)TPTESTPOINT(测试点MICMICROPHONE(麦克风)BQFPBQFP(quadflatpackagewithbumper)带缓冲垫的四侧引脚扁平封装CLCCceramicleadedchipcarrier(带引脚的陶瓷芯片载体)COBchiponboard(板上芯片封装)DFPdualflatpackage(双侧引脚扁平封装)(是SOP的别称)FPflatpackage(扁平封装)FQFPfinepitchquadflatpackage(小引脚中心距QFP)CQFPquadfiatpackagewithguardring(带保护环的四侧引脚扁平封装)HSOPH-(withheatsink)HSOP表示带散热器的SOPLQFPlowprofilequadflatpackage(薄型QFP)SMDsurfacemountdevices(表面贴装器件)CPGACeramicPinGridArrayZIPZig-ZagInlinePackage之字型直插式封装TSOPThinSmallOutlinePackageTSSOPTSOPIIThinShrinkOutlinePackage