搜索
IPC标准中英名称对照(76个)IPC-M-105RigidPrintedBoardManual刚性印制板设计手册IPC-D-325ADocumentationRequirementsforPrintedBoards印制板设计文件图册要求IPC-PE-740ATroubleshootingforPrintedBoardManufactureandAssembly印制板制造和组装的故障排除IPC-6010SeriesIPC-6010QualificationandPerformanceSeriesIPC-6010印制电路板质量标准和性能规范系列手册IPC-6011GenericPerformanceSpecificationforPrintedBoards印制板通用性能规范IPC-6013AQualification&PerformanceSpecificationforFlexiblePrintedBoards(IncludesAmendment1)挠性印制板的鉴定与性能规范（包括修改单1）IPC-6016Qualification&PerformanceSpecificationforHighDensityInterconnect(HDI)LayersorBoards高密度互连(HDI)层或印制板的鉴定与性能规范IPC-6012A-AMQualificationandPerformanceSpecificationforRigidPrintedBoards,IncludesAmendment1刚性印制板的鉴定与性能规范(包括修改单1)IPC-6018AMicrowaveEndProductBoardInspectionandTech微波成品印制板的检验和测试IPC-6015Qualification&PerformanceSpecificationforOrganicMultichipModule(MCM-L)MountingandInterconnections有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范IPC-A-600FAcceptabilityofPrintedBoards印制板验收条件IPC-QE-605APrintedBoardQualityEvaluationHandbook印制板质量评价IPC-QE-605A-KITHardCopyandCD印制板质量评价书和光盘(CD)IPC-HM-860SpecificationforMultilayerHybridCircuits多层混合电路规范IPC-TF-870QualificationandPerformanceofPolymerThickFilmPrintedBoards聚合物厚膜印制板的鉴定与性能IPC-ML-960QualificationandPerformanceSpecificationforMassLaminationPanelsforMultilayerprintedBoards多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范IPC-TR-481ResultsofMultilayerTestsProgramRoundRobin多层印制板联合试验计划结果IPC-TR-551QualityAssessmentofPrintedBoardsUsedforMountingandInterconnectingElectronicComponents用于电子元件安装与互连的印制板质量评价IPC-TR-579RoundRobinReliabilityEvaluationofSmallDiameterPlatedThroughHolesinPCBs印制板中小直径镀覆孔可靠性评价联合试验IPC-4552SpecificationforElectrolessNickel/ImmersionGold(ENIG)PlatingforPrintedCircuitBoards印制电路板表面非电镀镍/沉金规范IPC-DR-572DrillingGuidelinesforPrintedBoards印制板钻孔导则IT-95080Improvements/AlternativestoMechanicalDrillingofPCBVias印制板通孔机加工方案的改进和优选手册IPC-NC-349ComputerNumericalControlFormattingforDrillersandRouters钻床和铣床用计算机数字控制格式IPC-SM-839Pre&PostSolderMaskApplicationCleaningGuidelines施加阻焊前及施加后清洗导则IPC-HDI-1HighDensityInterconnectMicroviaTechnologyCompendium高密度(HDI)互连微通孔技术纲要IPC/JPCA-4104SpecificationforHighDensityInterconnect(HDI)andMicroviaMaterials高密度互连(HDI)及微导通孔材料规范IPC-6016Qualification&PerformanceSpecificationforHighDensityInterconnect(HDI)LayersorBoards高密度互连(HDI)层或印制板的鉴定与性能规范IPC/JPCA-6801IPC/JPCATerms&Definitions,TestMethods,andDesignExamplesforBuild-Up/HighDensityInterconnection积层/高密度互连的术语和定义、试验方法与设计例IPC-DD-135QualificationTestingforDepositedOrganicInterlayerDielectricMaterialsforMultichipModules多芯片组件内层有机绝缘材料的鉴定试验IT-96060HighDensityPCBMicroviaEvaluation(OctoberProject),PhaseI,Round1高密度印制板微通孔评价指标手册,第一期第一版IT-97071HighDensityPCBMicroviaEvaluation,PhaseI,Round2高密度印制板微通孔评价指标手册,第一期第二版IT-30101HighDensityPCBMicroviaEvaluation,PhaseI,Round3高密度印制板微通孔评价指标手册,第一期第三版IT-98123MicroviaManufacturingTechnologyCostAnalysisReport微通孔制作技术成本核算报告IPC-2141ControlledImpedanceCircuitBoards&HighSpeedLogicDesign控制阻抗电路板与高速逻辑设计IPC-2252DesignGuideforRF/MicrowaveCircuitBoards射频/微波电路板设计指南IPC-4103SpecificationforBaseMaterialsforHighSpeed/HighFrequencyApplications高速高频用基材规范IPC-6018AMicrowaveEndProductBoardInspectionandTest微波成品印制板的检验和测试IPC-D-317ADesignGuidelinesforElectronicPackagingUtilizingHighSpeedTechniques采用高速技术电子封装设计导则IPC-M-102FlexibleCircuitsCompendium挠性电路纲要IPC-4202FlexibleBaseDielectricsforUseinFlexiblePrintedCircuitry挠性印制线路用挠性绝缘基底材料IPC-4203AdhesiveCoatedDielectricFilmsforUseasCoverSheetsforFlexiblePrintedCircuitryandFlexibleAdhesiveBondingFilms挠性印制线路覆盖层用涂粘接剂绝缘薄膜IPC-4204FlexibleMetal-CladDielectricsforUseinFabricationofFlexiblePrintedCircuitry挠性金属箔去电应用于柔性电路组装IPC-6013-KQualification&PerformanceSpecificationforFlexiblePrintedBoards&Amendment1挠性印制板的鉴定与性能规范（包括修改单1）IPC/JPCA-6202IPC/JPCAPerformanceGuideManualforSingle-andDouble-SidedFlexiblePrintedWiringBoardsIPC/JPCA单双面挠性印制板性能手册IPC-FA-251GuidelinesforAssemblyofSingle-andDouble-SidedFlexCircuits单面和双面挠性电路组装导则IPC-FC-234CompositeMetallicMaterialsSpecificationforPrintedWiringBoards印制线路板复合金属材料规范IPC-MB-380GuidelinesforMoldedInterconnectionDevices模压互连器件导则IPC-M-107StandardsforPrintedBoardMaterialsManual印制板材料标准手册IPC-MI-660IncomingInspectionofRawMaterialsManual原材料接收检验手册IPC-4101ASpecificationsforBaseMaterialsforRigidandMultilayerPrintedBoards刚性及多层印制板用基材规范IPC-4121GuidelinesforSelectingCoreConstructionforMultilayerPrintedWiringBoardApplications多层印制板用芯板结构选择导则IPC-4562MetalFoilforPrintedWiringApplications印制线路用金属箔IPC-CF-148AResinCoatedMetalforPrintedBoards印制板用涂树脂金属箔IPC-CF-152BCompositeMetallicMaterialsSpecificationforPrintedWiringBoards印制线路板复合金属材料规范IPC-TR-482NewDevelopmentsinThinCopperFoils薄铜箔的新发展IPC-TR-484ResultsofIPCCopperFoilDuctilityRoundRobinStudyIPC铜箔延展性联合研究结果IPC-TR-485ResultsofCopperFoilRuptureStrengthTestRoundRobinStudy铜箔断裂强度试验联合研究结果IPC-4412SpecificationforFinishedFabricWovenfrom”E”GlassforPrintedBoards“E”类精纺玻璃纤维层印制板技术规范IPC-4130Specification&CharacterizationMethodsforNonwovenEGlassMaterialsE玻璃纤维非织布材料规范及性能确定方法IPC-4110SpecificationandCharacterizationMethodsforNonwovenCelluloseBasedPaperforPrintedBoards印制板用纤维纸规范及性能确定方法IPC-4411-KSpecificationandCharacterizationMethodsforNon-WovenPa