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環形2.SpecialShapePowderCore/特殊形裝CORE3.EllipseCoreDesign/ELCORE設計4.Q&A環形SoftMagneticMaterialsFerrite/鐵氧體Metals/金屬Powder/粉末Strip/帶材MPP(Ni-Fe-Mo)Fe-Si/硅鋼HighFlux(Ni-Fe)Amorphous/非晶SENDUST(Fe-Si-Al)Permalloy/破莫合金MegaFlux(Fe-Si)Iron(Fe)1.SoftMagneticMaterials/軟磁材料磁粉芯介紹1.ToroidalCore/環形磁粉渦流絕緣層&GAP生產流程Material/材料Composition/合金成份HighFlux:CHNi+FeAlloy/鎳鐵合金Sendust:CSFe+Si+AlAlloy/鐵硅鋁合金MegaFlux:CKFe+SiAlloy/鐵硅MPP:CMNi+Fe+MoAlloy/鐵鎳鉬制粉壓制絕緣處理燒制完成性能測試制粉3.Manufacturingprocess/生產流程材料Perm./磁導率(I)Bs/飽合磁感應強度(kG)CoreLoss/磁損DCBias/加載電流RelativeCost/成本Temp.Stability/溫度特性CurieTemp[℃]/居里溫度MPP26-2007LowerBetterHighBest450HighFlux26-16015LowBestMediumBetter500Sendust26-12510LowGoodLowGood500MegaFlux26-9016MediumBestLowBetter700Iron10-10010HighPoorLowestPoor770Fe-SiStrip(Gap)20HighBetterLowestGood740Amorphous(Gap)15LowBetterMediumGood399Ferrite(Gap)3-5LowestPoorLowestPoor100~3004.MaterialComparison/材料比對表1.ToroidalCore材料電氣特性60μ125μDCB%@100OeCoreLoss@50kHz,1000GDCB%@50OeCoreLoss@50kHz,1000GCSCHighFlux201079%24078%300201182%18081%2602012Plan84%16082%250Market/其它HighFlux78%40074%340MPP60%15051%210※MainApplication:HighEfficiencyServerPower,SolarInverterTelecomPower,HighPowerPersonalComputer1.ToroidalCore設計需求資料(1)Inductance[μHormH],Current[A]/電感量及電流ForCalculatingLI2,CoreLoss,WireSize,CopperLoss用來計算LI2,磁損,線徑,銅損(2)CurrentDensity(A/cm2orA/mm2)/電流密度ForCalculatingWireSize,CopperLoss用來計算線徑,銅損(3)RippleRate(%)/紋波範圍ForCalculatingΔI,CoreLoss為計算增量電流,及磁損(4)SwitchingFrequency(kHz)/開關頻率ForCalculatingCoreLoss用來計算磁損CoreDesign材料的選用•Whenyoudesignandselecttherightmaterial,corecostisthemostimportantfactorbutthereneedmanyotherconsideration設計時除考量成本為主外還要考量到實際應用需求CoreDesign電感(2)HeightChange&Stack/高度變化及堆疊•EnergyStorageCapacity:LI2[L=Inductance(mH),I=Current(A)]/功率容量•IncreaseEnergyStorageCapacitywithsameOD,IDsizeàHeightIncreaseorStacking增加功率在相同的OD.ID的情況下,可通過增加高度及疊加方式增加5061x2=122mH10.67mmX2CH3300602Stack42103mH18.0mmCH330060E183280mH14.0mmCH330060E142561mH10.67mmCH330060StorageCapacityALValueB.FHTPartNo.CoreDesign繞線工藝(1)WindingLayer/層數•SingleLayerWinding:LowWindingCapacitanceàGoodHighFreq.ResponseWindingisEasybutNeedmoreLargeSizeCoreforSameL•MultiLayerWinding:SmallSizeCoreforSameLbutWindingisHardHighWindingCapacitanceàNeedSpecialWindingMethodCoreDesign(2)SplitWinding/分開繞線•Purpose:MinimizeStrayCapacitance&GoodHighFreq.Response/高頻響應•TwoLayerWinding&TwoSplitWinding,ThreeLayerWinding&ThreeSplitWindingCoreDesign(3)WindingMethodvsImpedance/繞線方法與阻抗CoreDesign溫升CoreDesign(3)CoreLoss/磁損CoreDesign(Toroidal)/選擇曲線•EnergyStorageCapacity:LI2[L=Inductance(mH),I=Current(A)]1.ToroidalCore7.Inductance•Afterselectingmaterial,coresizeandpermeabilityshouldbeselected選材質,尺寸,磁導率,電感設計工具1.ToroidalCoreμ○○○○○○○○○40μ○○○○○○○○○60μ○○○○○○○○○Sendust26μ○○○○○○40μ○○○○○○60μ○○○○HighFlux26μ○○○○○○40μ○○○○○○60μ○○○○○○MoldSize4106665755DesignTool○○○○△○2.SpecialShapePowderCore(1)Features/特性•OutDiameter100,132,165mm/外徑•MPP,HighFlux,Sendust,MegaFlux/材質•ElectricalCharacteristicsareSamewithSmalltoroidcores/特性同我們常見的SIZE(2)Application/應用•UninterruptiblePowerSupply(UPS)•SolarInverter•HighPowerSystem(3)ProductIdentification/產品標示CKPermeability:60μHeight:25mmODSize:130mmAvailableSize:100~165mmMegaFluxCoreCH:HighFlux,CS:Sendust1325060AvailablePerm:26,50,60,125μ