德尔福-新能源汽车高压电气系统架构

PackardElectrical/ElectronicArchitectureHEV/EVElectricalSystemArchitecture混合动力/纯电动车高压电气系统架构PackardElectrical/ElectronicArchitectureAgenda目录
HEV/EVHVElectricalSystem:混合动力/纯电动车电气系统–HEV-EVHVSystemComparison:混合动力和纯电动车电气系统比较和电气特性–TechnicalRequirementstoHVSystem:高压电气系统的技术要求»Safety安全性要求»Sealing密封性要求»Shielding屏蔽性要求»ThermalRequirements耐温度性要求»ChargingSystem充电系统标准
Delphitechnicalsolution:德尔福的技术解决方案–HighPowerALCable大功率铝导线的使用–Safety安全性–EMC(Shielding)EMC(屏蔽)–ThermalEffect温度影响
DevelopmentTrend技术发展趋势–DelphiProductsStrategy德尔福产品发展计划–ChargingSystemDevelopment充电系统发展–ElectricallevelDevelopment功率变化引发得电气性能变化
Delphi–BeSystemDevelop&ServiceSupplierforHEV/EV为新能源汽车打造系统平台2PackardElectrical/ElectronicArchitecture3HVDCHVAC12V/42VDCHybrid/ElectricVehicleArchitectureComparison混合动力/纯电动车电气系统MILDHybrid中混Plug-InHybrid插电式混合动力EV纯电动汽车PackardElectrical/ElectronicArchitectureHEV/EVVoltagesandCurrents混合动力/纯电动车电气特性
DefineloadbyHEV/EVworkingcondition
根据车辆情况定义负载电气特性
Definecomponentslevelloadcondition
根据负载电气特性定义零件BatteryPackConnectionSystemMainPowerCircuitPowerDistributionSystemMotor/AC/InverterConnectionSystemChargingConnectionSystemPowerPDBHVACConnectionMSDMotor/AC/InverterConnectionSystemPowerPDBAPMarketCurrentVoltageTempCurrentVoltageTempBattery300A300V150C320A400V150CMotor(3PhaseACRMS)200A300V150C250A400V150CInverter(DCInput)250A300V125C300A400V125CDC/DC30A300V105C30A400V105CAC30A300V105C40A400V105CPTC30A300V105C40A400V105CCharger(ACInput)30A220V105C30A220V105CEVBClassVehicleCClassVehiclePackardElectrical/ElectronicArchitectureHighPowerRequirementsTrendforhighvoltage/current高功率下的电气要求变化PackardElectrical/ElectronicArchitectureSafetyRequirements高压电气系统的技术要求
TechnicalRequirement–Sealing:密封性要求6IP55IP67IP69Dustprotectionlevelatleast6防尘等级至少为6SafetyIssuecausedbysealing因密封失效导致的严重事故PackardElectrical/ElectronicArchitectureEMC/EMIRequirements高压电气系统的技术要求7
Shielding:屏蔽–VehicleLevelEMCRequirement:整车级EMC要求»EMC/EMI/EMS»ISO7637/ISO10605/ISO11452»SAEJ1113–ComponentsLevelEMCRequirement:零部件级EMC要求»BCI/TEM/ALSE»10KHZ~3.2GHZ–Development:发展趋势»Moresfocusonwirelessapplicationthanregularfrequency。面对越来越多无线网络的要求ShieldingComponentsShieldingRequirementsShieldingTestsPackardElectrical/ElectronicArchitectureTemperatureRequirements高压电气系统的技术要求
ThermalRequirements:温度要求–Vehicletemperatureareadefinition整车温度区»Differentworkingarearequirement»不同工作区的温度要求»Differentworkingconditionrequirement»不同工况下的温度要求–Componentsworkingtemperaturedefinition零部件温度要求»Basedongeneralvehicleworkingtemperature基本要求为车辆工作的环境温度»Shouldmatchdifferentworkingcondition.但应同时考虑同时再不同条件下工作的情况8SunshineWorkingTempAreaEngineRoomTempPackardElectrical/ElectronicArchitectureHighPowerALcable大功率铝导线的使用
ALCableincreaseusageinHEV/EVelectricalsystem:–Advantages:优点»CostReduction降低成本»WeightReduction降低重量–Shortage:不足»IncreaseGauge线径，体积增加»MFGdifficulty加工困难TOYOTAPrius3ALcableDELPHIWeldingSolutionWeightReductionComparewithCooperCableALCableUsagedevelopTrendPackardElectrical/ElectronicArchitectureDelphiSolution德尔福的技术解决方案
Safety:安全性–CreepDistance保证爬电距离»FollowIEC60664todesigncomponents»按照IEC60664设计零件–Sealing:密封性能»FromIP67toIP69保证IP67甚至IP69的防水等级–FingerProof防触摸保护–HVILCircuit高压互锁回路»KeeplooplinkinHVElectricalSystem»保证整车回路中得HVIL串联»IncludeineachHVConnector»在零件设计中融入HVIL回路的设计10DesignCreepDistancebasedonSpecFingerProofDesignDifferentSealingDesignHVILfordifferentcircuitpositionHVILPackardElectrical/ElectronicArchitectureDelphiSolution德尔福的技术解决方案
EMC(Shielding):EMC(屏蔽)–ShieldingType:屏蔽种类»SingleCoreshielding单芯屏蔽»BraidShielding屏蔽网屏蔽–FollowTestSpec:参照测试标准»SAEJ1113–AdvancedStudy:先进性尝试»NewMaterialtoImproveEMCquality»使用新材料已改善EMC性能11ExternalShieldingCan单芯屏蔽方案零件设计屏蔽网方案设计不同屏蔽方式电磁波形图增加磁环滤波以改进EMC性能PackardElectrical/ElectronicArchitectureDelphiSolution德尔福的技术解决方案
ThermalEffect:温度影响–Definetemplevel:–定义不同温度等级»65℃(PassengerRoom)»105℃(EngineRoom)»120℃(EngineRoom)»150℃/200℃(EngineRoom)–DefineMateriallevel:–根据温度定义不同材料»Cable:PVC/XLPE/Silicon»TerminalPlating:Zn/Ag/Au»Housing:PP/PF/PE–Analyzethermaleffectrootcause:–分析温升来源»Causebyambienttemp»由环境温度引起»CausebyCurrent»由电流引起»Causebyresistance»有电阻引起12乘客舱温度变化曲线发动机舱工况温度模拟改变零件设计适应电流温度要求改变零件设计适应电流温度要求改变零件设计适应电流温度要求改变零件设计适应电流温度要求先进工艺制造满足电流温度要求先进工艺制造满足电流温度要求先进工艺制造满足电流温度要求先进工艺制造满足电流温度要求PackardElectrical/ElectronicArchitectureDelphiSolution–Products德尔福产品发展计划
DelphiHVproductsdevelopStrategy德尔福高压产品发展规划13Design&Manufactory设计与制造Cable导线Complex(复杂）(HEV/EV)Components零部件Easy(简单）(RegularVehicle)ElectricalCenter电气盒WiringHarness高压线束Products产品高压屏蔽，带有控制逻辑和安全保护屏蔽，安全，高防水等级全新的设计，仿真，制造，质量控制体系大电流屏蔽导线以及相关的加工工艺更多品种，适用不同用电器优化的针对高压产品的生产系统针对客户特殊需要的产品PackardElectrical/ElectronicArchitectureDevelopmentTrend技术发展趋势
ChargingSystem:充电系统发展趋势–ChargingSystemDevelopment14更方便，更安全，更智能，更系统更大的充电电流，更快的充电时间普通家用充电，16A简易充电桩，16A/32A专用充电桩32A直流充电，80A~250A复合式充电接口无线充电技术智能小区能源网PackardElectrical/ElectronicArchitectureDesignSystem技术发展趋势
Voltage/Current:电压和电流的发展–HigherPowercausehigherVoltage–更高功率要求更高的电压»SafetyRequirement带来了更严格的安全性考虑–Biggerloadcausehighercurrent–更大的负载也要求更高的电流»HigherTemp温升更高»HigherFrequencyrequestEMCprotect可能因更高的频率要求更好的EMC保护15PackardElectrical/ElectronicArchitectureDelphiStrategyf