搜索
AdhesionAnnularRingAOIautomaticopticalinspectionAQLacceptablequalitylevelB²it(buriedbumpinterconnectiontechnology)BBH(buriedblindhole)BGA(ballgridarray)BlisterBoardEdgesBurr/BUM(Build-upmultilayer)BVHburied/blindviahole/CAD(computeraideddesign)CAM(computeraidedmanufacturing)CarbonoilCEM(compositeepoxymaterial)chamferCharacteristicimpedanceCNCcomputerizednumericalcontrolConductorCrackConductorSpacingconnectorCopperfoilCrazing()DelaminationDewetting()DFMdesignformanufacturingDIP(dualin-linepackage)DkdielectricconstantDRC(designrulechecking)drawingECN(engineeringchangenotice)ECO(engineeringchangeorder)EglassentekOSPEpoxyresinESD(electrostaticdischarge)EtchedMarkingFlatnessForeignInclusionFlameresistantFR-2(flame-retardant2)FR-3(flame-retardant3)FR-4(flame-retardant4)FR-5(flame-retardant5)groundHaloingHDI(highdensityinterconnection)HASL(hotairsolderleveling)IC(integratedcircuits)InkStampedMarkingInsulationresistanceIoncleanlinessIPC(theinstituteforinterconnectingandpackagingofelectroniccircuits)ISO(Internationalorganizationforstandardization)LaminateVoidslaserLDI(laserdirectimaging)legendLiftedLandslogoLPI(liquidphotoimageable)LPISM(liquidphotoimageablesoldermask)markingMeaslingMicrovoidsmilMIL-STD(militarystandard)NegativeEtchbackNicksNodulesNonwetting()openOSP(organicsolderabilitypreservatives)oxidespadpanelpatternPCB(printedcircuitboard)Pcs(pieces)PeelingpinholePinkRingPitspitchPlatingVoidsplugPositiveEtchbackpowerprepregPTFE(polytetrafluoroethylene)PTH(platedthrough-hole)PWB(printed-wiringboard)RegistrationQA(qualityassurance)QC(qualitycontrol)QE(qualityengineering)QFP(quadflatpackage)repairRCC(resincoatedcopper)ReferencedimensionregistrationresinrejectionrevisionRF(radiofrequency)RipplesroutscratchScreenedMarkingscoringshortsignalSilkscreenSkipCoverageslotSMD(surfacemountdevice)SMOBC(soldermaskoverbarecopper)SMT(surfacemounttechnology)smearsolderS/M(soldermask)solderabilitySodaStrawing()SPCstatisticalprocesscontrolspacingTapetestTCEthermalcoefficientofexpansionTDRtime-domainreflectometrytoleranceTentingTextureConditionTg(glasstransitiontemperature)THT(throughholetechnology)traceUL(underwriterslaboratories)NPTHUV(ultraviolet)v-cutVViaholevoidwarpWavesWeaveExposurewettingWickingWrinkles1conduction(track)2conductorwidth3conductorspacing4conductorlayer5/conductorline/space6conductorlayerno.17roundpad8squarepad9diamondpad10rectanglepad11bulletpad12teardroppad13snowmanpad14vv-shapedpad15annularpad16non-circularpad17isolationpad18monfunctionalpad19offsetland20back-bardland21anchoringspaur22landpattern23landgridarray24annularring25componenthole26mountinghole27supportedhole28unsupportedhole29via30platedthroughhole(pth)31accesshole32blindvia(hole)33buriedviahole34/buried/blindvia35anylayerinnerviahole(alivh)36alldrilledhole37toalinghole38landlesshole39interstitialhole40landlessviahole41pilothole42terminalclearomeehole43quasi-interfacingplated-throughhole44dimensionedhole45via-in-pad46holelocation47holedensity48holepattern49drilldrawing50assemblydrawing51printedboardassemblydrawing52datumreferance