学术PPT模板

LowCostSilverAlloyWireBondingwithExcellentReliabilityPerformanceC.HCheng,H.LHsiao,S.IChu,Y.YShieh,C.YSun,C.PengGroup8LeiQingLinyangsenHuShaowei目录IntroductionExperimentResults&DiscussionConclusionIIIIIIIVPage3IIntroductionConventionalbondingwire——AuAugoodelectricalandmechanicalpropertiesalloyedeasilywithotherelementsnon-corrosivedoesn'tmigratetoothermaterialssurroundingitreliablethroughoutthelifeoftheproductCu,PdcoatedCuAl,Al-SiAg,PdcoatedAgAgalloyPage4IAlCuAgpooryieldsmallprocesswindowschipdamageelectricalconductivitythermalconductivitygoodmechanicalpropertyinterfaceoxidationissuescorrosionissuessilvermigrationelectromigrationtoosoftAlspikingIntroductionAl,Cu&AgMaterialρkAu71.6317Ag106429Cu100401Page5IIntroductionAgalloy——Ag-Au-PdAg-Au-Pd·Thecontactinterfacesofwireandpadafterbondingwillformareliableintermetalliclayer.·Thegrowthrateoftheinterfaceintermetalliccompoundwillbeveryslow.·Featuresexcellentresistancetooxidation.·SimilartoAuwiresinoperationparameters.Page6IIExperimentWirebondingprocessandanalysisWire:Ag-Au-Pdbondingwires(0.8milsdiameter)Pad:Almetallization(0.5%Cu,0.1%Si)ThermosonicballbondingwithnitrogenatmosphereAssemblyprocess:SiliconwarePrecisionIndustriesCo.Conditions·HNO3cateringtestwasusedtocheckICpaddamageissue·Measuretheoverallareaofintermetalliccompounds(IMC)MethodsPage7IIExperimentCrateringtestIMD:Inter-MetalDieletricmetal→visiblecrackfailureforceUseopticalmicroscopenocrackHNO3Page8IIExperimentIMCsformationcoverageAnothermethodtocomprehendthebondingreliabilitywastomeasuretheoverallareaofintermetalliccompounds(IMC).PresenceofIMCindicatesthatmicrobondinghappenedatthezone.Criterion:largerthan70%UseopticalmicroscopePage9IIExperimentReliabilitytestconditionandanalysisTestItemConditionpreconditionMSLIII192hoursat30°C/60%RHPCT600hoursat121°C/100%RH/2atmHAST600hoursat130°C/100%RHwith1.1VccbiasTCT2000cyclesat-65°C～150°C(airtoair)HTOL2000hoursat125°Cwith1.1*VccbiasMBT6000hrsatroomtemperatureToverifythecapabilityofAg-Au-Pdalloybondingwire,thebondedtestchipwastestedunderthefollowingconditions.PressureCookerTestHighlyAcceleratedTemperatureandHumidityStressTestTemperatureCycleTestHighlyTemperatureOperationLifeTestMotherBoardTestPage10IIExperimentReliabilitytestconditionandanalysisFIBtreatmentThecross-sectionalviewsofsampleswerepreparedbyusingFIBtreatment.ThentransfertoSTEMsystemforinterfacemicrostructuresandcompositioninvestigations.SelectedareaEDSspectraandelementalmappingwereusedtoobtainthecompositiondistribution.Page11IIIResults&DiscussionCateringtest&IMCsformationcoverageItisclearlydemonstratedthatnocrackorpeelingwasobserved.Craterion:nocrackTheIMCcoveragespectiondisplayover92%ofIMCswerefound.Cratering:largerthan70%Page12IIIResults&DiscussionThetestresultsVS.AuSampleCrateringTestIMCCoverageAuWireNocrack90%82%AgAlloyWireNocrack93%92%ThecrateringtestresultsandIMCsformationcoverageestimationofAgalloywireandAuwireshowssimilarresultsforbothwires.Page13IIIResults&DiscussionThereliabilitytestresultTheAg-Au-Pdbondingwiresamplespassallthesepackagingreliabilityandproductlifetesting.TheseresultsshowtheAg-Au-Pdalloybondingwirewithexcellentreliabilityperformance.ReliabilityTestSampleSizeResultPrecodition354PassHAST-600hrs32PassPCT-600hrs55PassTCT-2000cycles55PassHTSL-2000hrs77PassHTOL-2000hrs105PassMBT-6000hrs512PassPage14IIIResults&DiscussionSEMimagesofsamplesNocrackandpeelingwerefoundontheinterfaces.——Pd&AuPreconInitialPCTHASTTCTHTOLHTSLPage15IIIResults&DiscussionTEMimageofbondedinterfacefourlayersformedintheinterfaceTwointerfacelayersformedbetweenAgalloywireandAlpad.EDS:atomicweightratioAg:AL=2:1Ag2AlAg:AL=3:1Ag3AlBetweentwolayersexistssomeoxygen-richclusters.Page16Ag3AlIIIResults&DiscussionTwointermetalliccompoundsAg2AlmetastablecompounduncommonstructuralalloyhcpstructurehighlythermalstablecommonHighTAg2AlLowTAg3AlPage17IIIResults&DiscussionEDSelementalmappingimagesAgLALKPdLAuMTwointerfacelayers——Ag2AlandAg3AlPd:uniformlydistributedAu:notuniformlydistributedPdinAg3Al↘AudiffusionotherIMCsPage18IIIResults&DiscussionThefinaleffectTheTEMandEDSanalysesofthesamplesafterharshthermalandhumiditystressingpresentalmostthesameinterfacemicrostructuresandcompositiondistributionastheresultsobtainedfromtheas-bondedsamples.PbAuAu-AlandPd-AlrelatedIMCexcellentadhesionAg2AlAg3Alsuppressinterfacecorrosionadditionmulti-phaseresultPage19IVConclusionEffectivesuppressionofoxidationandinterfacecorrosionduetotheadditionofAuandPdelements.Passallharshenvironmentalstressingandhighstandardproductionlinetesting.Temperaturedifferencebetweenbondingwireandpadleadtotheformationoftwointermetalliclayers.Thecoexistenceofmulti-phaseIMCscansuppresstheinterfacecorrosionandprovideexcellentadhesion.ACBDThankYou