钢网开孔规范

GoldbullEngineerDepartment項次項目1鋼网的光學點型式a.黑色盲孔.光學點一律不貫穿.b.半蝕刻部份以黑色epoxy填滿2鋼板厚度=0.13mm/0.15mm(无额外要求时开0.13mm)3a.新的鋼板張力須=40N/cmb.鋼板張力=32N/cm須更換.c.量測位置於鋼板張網區域九個點.如圖4鋼板制作方法須用Laser切割,並拋光處理.5規範內提及的PCBPADLAYOUT尺寸皆以R&DGerberFile的圖面尺寸為依据,不以PCB板上的量測尺寸為依據.6鋼板需附檢驗報告及制作圖樣:a.鋼板厚度b.鋼板開孔位置精準度c.九點張力測試值d.開孔尺寸量測抽取同類零件之一量測e.附鋼板制作圖樣,核對開孔位置f.鋼板外觀標示方式,如右圖page:1鋼網開孔規範備注9H/2H廠商Mark區鋼板外框機種名稱,版本,製作日期高登布尔工程GoldbullEngineerDepartment項次項目PCBPADLAYOUT鋼板開孔尺寸備注1ChipR,L,C(0603),方形PAD,通常法一:Y=Y1=0.77方形:X=X1=0.77內距保持0.85mm(內D=0.66切)后再開1/3凹形D1=D+0.2=0.86φ=1/3*Y1=0.26面積1/2圓2ChipL,C(0603),橢圓形PAD,通常法一:Y=Y1=1.20X=0.98mm橢圓形:X1=X-0.1=0.97內距保持0.75mm(內D=0.6切)后再開1/3凹形D1=D+0.15=0.75φ=1/3*Y1=0.4面積1/2圓3ChipR(0603),橢圓形PAD,通常法二:Y=Y1=1.20X=X1=0.98D=0.6D1=D+0.15=0.84ChipR,L,C(0805),方形PAD,通常法一:Y=Y1=1.28X=1.1(0805)保持1.1內距X1=X-0.18=0.92(內切)D=0.77D1=D+0.36=1.13φ=1/3*Y1=0.42面積1/2圓5ChipL(0805),方形PAD,通常法一:Y=Y1=1.7X=1.78針對於PAD間距X1=X-0.25=1.53很小開孔=0.25D=0.25D1=D+0.5=0.75φ=1/3*Y1=0.56面積1/2圓6ChipR,L,C(0603)按实际PAD的形状1:1.1开孔無延伸腳類SMD零件鋼板基本規範Y=1.2X=1.1D=0.77Y=0.77X=0.7D=0.66Y1=0.77X1=0.77φ=0.26D1=0.86Y1=1.28X1=0.92φ=0.42D1=1.13D1=0.75Y1=1.2X1=0.97D=0.6Y=1.2X=0.98D1=0.75Y1=1.2X1=0.97φ=0.4D=0.6Y=1.2X=0.98Y1=1.7X1=1.53φ=0.56D1=0.75D=0.25Y=1.7X=1.78高登布尔工程GoldbullEngineerDepartment項次項目PCBPADLAYOUT鋼板開孔尺寸備注7ChipR,L,C(1206),橢圓形PAD,通常法一:Y=Y1=1.8開1/3凹形X=X1=1.03D=D1=2.0φ=1/3*Y1=0.6面積1/2圓8FUSE(1206),通常法一:Y=Y1=2.181/3梯形Y2=1/3*Y1=0.73X=X1=1.43D=D=1.529FUSE(1206),通常法二:Y=Y1=2.18X=X1=1.43D=D1=1.52X2=1/2*X=0.72Y2=0.3Y3=1.110鋁質電容與鉭質電容共用PAD:Y=Y1=2.54X1=X-0.1=2.58D1=D+0.2=0.97φ=1/3*Y1=0.84面積1/2圓11鉭質電容(1210),法一Y=Y1=1.88X=2.6X1=X-0.1=2.5D=1.0D1=D+0.2=1.2φ=1/3*Y1=0.62面積1/2圓page:3無延伸腳類SMD零件鋼板基本規範D=2.0Y=1.8X=1.03Y1=1.88X1=2.5φ=0.62D1=1.2Y1=2.18X2=0.72D1=1.52Y2=0.3Y3=1.1X=1.43D=1.52X=1.43Y=2.18X=2.68Y=2.54D=0.77φ=0.84Y1=2.54X1=2.58D1=0.97D1=2.0Y1=1.8X1=1.03φ=0.6D=1.52Y=2.18X=1.43X1Y1=2.18Y2=0.73X1=1.43D1=1.52X=2.6D=1.0Y=1.88高登布尔工程GoldbullEngineerDepartment項次項目PCBPADLAYOUT鋼板開孔尺寸備注12SOT252大顆及小顆功率晶體大PAD分成網格狀開孔分成網格狀開孔,中X=5.87Y=6.02D=2.3間架橋0.4mm.,邊緣X1=2.25Y1=2.3距離0.5mm,如果PADW=0.5W1=0.4更大則均分D1=D+1.0=3.3如圖所示13CN(1206)排容,通常法一:Y=Y1=1.28mm向外移0.1mmX=X1=0.57mmD=0.2mmD'=0.5mmX2=X1-0.12=0.45mm縮孔且外移0.1mmD1=D+0.2=0.7mm14RN(0704)排阻,通常法一:Y=0.6X=0.5D=0.2X'=0.3Y1=0.6X1=X+0.05=0.55D1=D+0.05=0.25Y2=Y+0.1=0.7X2=X'-0.05=0.25縮孔如圖所示,角落四角倒圓角15RN,CN(1206),法一:Y=Y1=1.02X1=X-0.23=0.54D=0.5D1=D+0.2=0.7角落四角倒圓角.中間四腳1:1開孔16RN(0704整體特殊PAD)法一:Y=Y1=0.58X=0.52X1=X+0.05=0.57D1=D=0.2D'=0.45D2=D+0.05=0.25Y3=Y+0.1=0.68X1'=X1=X=0.3D3=D'+0.1=0.55角落四角導圓角page:4無延伸腳類SMD零件鋼板基本規範Y=1.02X=0.77D=0.5Y=6.02X=5.87D=2.3X1=2.25Y1=2.3W=0.5W1=0.4D1=3.3Y1=1.02X1=0.54D1=0.7Y1=1.28X1=0.57X2=0.45D1=0.7Y=0.6X=0.5D=0.2X'=0.3X1=0.55Y1=0.6D1=0.25Y2=0.7X2=0.25Y=0.58X=0.52D=0.2D'=0.45X'=0.3D2=0.25Y1=0.58X1=0.57D1=0.2Y3=0.68D3=0.55X1'=0.3Y=1.28X=0.57D'=0.5D=0.2高登布尔工程GoldbullEngineerDepartment項次項目PCBPADLAYOUT鋼板開孔尺寸備注17CN(1206整體特殊PAD)法一:Y=Y1=1.28,X=X1=0.57Y2=Y+0.1=1.38X2=X-0.12=0.45D=0.2D1=D+0.25=0.45長寬開孔1:1,間距外移0.1角落四角導圓角18SOT223大顆及小顆功率晶體,通常法一:Y1=Y=8.35X1=X=3.8D1=D=0.78開孔1:119晶振,法一L1=L=5.44W1=W=1.7D=2.75D1=D+0.2=2.9520晶振,法二X=X1=1.3Y=Y2=1.9開孔1:121三极管Y=Y1=1.28X=X1=1.28D=D1=1.1D'=D1'=0.65開孔均1:1page:5無延伸腳類SMD零件鋼板基本規範Y=1.28X=0.57D=0.2L=5.44W=1.7D=2.75L1=5.44W1=1.7D1=2.95Y1=1.28X1=1.28D1'=0.65D1=1.1Y=1.28X=1.28D'=0.65D=1.1Y=8.35X=3.8D=0.78X'=1.55Y1=8.35X1=3.8D1=0.78X1'=1.55X=1.3Y=1.9X=1.3Y=1.9Y1=1.28X1=0.57X2=0.45Y2=1.38D1=0.45高登布尔工程GoldbullEngineerDepartment項次項目PCBPADLAYOUT鋼板開孔尺寸備注22Pitch=0.5mm(QFP)L=1.9W=0.348PinQFPL1=1.0L2=0.7D=0.2W1=W-0.1=0.2中間架橋0.2mm,寬0.2mm,且倒圓角,L1:L2=1:0.7L1引腳部分,L1接近本體部分23Pitch=0.5mm(OFP)L=2.0W=0.3128PinQFPL1=1.0L2=0.8D=0.2W1=W-0.1=0.2中間架橋0.2mm,寬0.2mm,且倒圓角,L1:L2=1:0.8L1引腳部分,L1接近本體部分24Pitch0.65mm(SOJSOPPLCC)L=L1=1.9SOJ,SOP,PLCCW=W1=0.65開孔1:125Pitch=0.65mm(SOP,QFP)L=L1=2.3長度開孔1:148PinSOPW=0.4W1=W-0.12=0.28縮孔引腳倒圓角26PLCCY=Y1=0.44無延伸腳,引腳在零X=0.82件本體之下,與零件X1=X-0.1=0.72本體邊緣對齊中間PAD部分不開孔page:6有延伸腳類SMD零件鋼板基本規範L=1.9W=0.3D=0.W1=0.L1=1.0L2=0.L=2.0W=0.3D=0.W1=0.L1=1.0L2=0.L=1.9W=0.65L1=1.9W1=0.6L1=2.3W1=0.28L=2.3W=0.4X1=0.72Y1=0.44X=0.8Y=0.4SOJSOP&QFPSOP&QFPSOP&QFP高登布尔工程GoldbullEngineerDepartment項次項目PCBPADLAYOUT鋼板開孔尺寸備注27Pitch=1.27mm的BGA(CPUSocket)CPUSOCKET原始焊盤的直徑φ=0.6760PIN鋼板開孔直徑φ1=φ-0.05=0.5528Pitch=1.27mm的BGA南橋原始焊盤的直徑φ=0.6鋼板開孔直徑φ1=φ-0.05=0.5529Pitch=1.0mm的BGA原始焊盤直徑φ=0.5北橋a.最外層排列不規則φ=0.42b.第二層Pitch=1.0鋼板開孔直徑φ1=0.42c.第三層Pitch=1.27但與ViaHole較近,鋼板開孔直徑φ2=0.42d.最里層Pitch=1.0鋼板開孔直徑φ1=0.4230Pitch=1.0mm的BGA(LANCHIP)LANCHIP原始焊盤的直徑φ=0.5鋼板開孔直徑φ1=φ-0.08=0.42說明:淺色為PCBLAYOUT,深色表示鋼板開孔,單位為mm,誤差值:±0.02mmpage:7BGA類鋼板基本規範D=1.27φ=0.6φ1=0.55Pitch=1.0Pitch=1.0Pitch=1.27φ1=0.4φ=0.5φ=0.55pitch=1.27高登布尔工程