Power-Integrity-Modeling-and-Design-for--Semicondu

目录Chapter3.SimultaneousSwitchingNoise...............................................................................................................13.1.Introduction.............................................................................................................................................23.1.1.MethodsforModelingSSN..........................................................................................................23.2.SimpleModels.........................................................................................................................................33.2.1.ModelingofOutputBuffers.........................................................................................................53.3.ModelingofTransmissionLinesandPlanes............................................................................................93.3.1.MicrostripConfiguration................................................................................................................93.3.2.StriplineConfiguration...............................................................................................................123.3.3.Conductor-BackedCoplanarWaveguideConfiguration.........................................................253.3.4.SummaryofModalDecompositionMethods..........................................................................283.4.ApplicationofModelsinTime-DomainAnalysis.................................................................................293.4.1.PlaneBouncefromReturnCurrents............................................................................................293.4.2.Microstrip-to-MicrostripViaTransition...................................................................................343.4.3.SplitPlanes..................................................................................................................................383.5.ApplicationofModelsinFrequency-DomainAnalysis.......................................................................413.5.1.StriplinebetweenaPowerandaGroundPlane......................................................................413.5.2.Microstrip-to-StriplineViaTransition.......................................................................................423.5.3.ReductionofNoiseCouplingUsingThinDielectrics................................................................443.6.ExtensionofM-FDMtoIncorporateTransmissionLines....................................................................453.6.1.AnalysisofaComplexBoardDesign.........................................................................................473.7.Summary................................................................................................................................................48Chapter3.SimultaneousSwitchingNoiseIntroductionSimpleModelsModelingofTransmissionLinesandPlanesApplicationofModelsinTime-DomainAnalysisApplicationofModelsinFrequency-DomainAnalysisExtensionofM-FDMtoIncorporateTransmissionLinesSummaryReferences3.1.IntroductionTheinclusionofsignalintegrity(SI)aspectsinanearlystageofthedesignflowisessentialforthesuccessfuldesignofhigh-speeddigitaldevices.VariousSIproblemsmayariseduringthetransmissionofsignalsbetweenintegratedcircuits(ICs)throughtheinput/output(I/O)lines,causingmalfunctioningofthedevice.Usingpropermodels,theseproblemscanbeidentifiedandeliminatedsothatcostlytests,measurements,andredesignscanbeavoided.Noisegeneratedinthepowerdeliverynetwork(PDN)duetoI/Oswitchingisoftenreferredtoassimultaneousswitchingnoise(SSN).SincetheI/Osaredriverorreceivercircuitsconnectedtointerconnectionsinthepackageandboard,theinteractionsbetweentheinterconnectionsandthePDNgenerateSSN.Withanincreaseinsignalfrequencies,theinterconnectionsorsignallinesbehaveastransmissionlines.AsdiscussedinChapter2,high-frequencypackagescontainpowerandgroundplanes.Thecavityformedbetweentheplanesbehavesalsoasadistributedcircuitandresonatesathighfrequencies.Thesourcesthatexcitethecavitycomefromthereturncurrentsgeneratedbytheinterconnections.Hence,modelingtheinteractionbetweenthesignallinesandPDNisextremelyimportantforsimulatingSSNaccurately.3.1.1.MethodsforModelingSSNAproperelectricalmodelingofinterconnectsandchippackagestoestimateSSNmustincorporatethepowerandgroundpathsinadditiontothesignalpath.Actualcurrent-returnpathscanbecapturedinthisway,whichinturnimprovestheaccuracyoftheSIsimulationandgivesvaluableinsightregardingtheelectromagneticinterference(EMI).Becauseofdecreasingrisetimes,evenshortstructureslikepackageleadsbecomeelectricallylongandshouldbemodeledasdistributednetworks.Moreover,evensolidpower/groundplanescanneitherprovideastablesupplyvoltagenorberegardedasequipotentialsurfaces.Anappropriatemodelforinterconnectsandchippackagesshouldtakeintoaccountthenonidealbehaviorofpower/groundplanes,preservingthedistributednatureoftheinterconnectsathighfrequencies.Conventionally,lumpedmodelshavebeenusedtomodelchippackagesunderthequasi-staticassumption(i.e.,thestructuresareassum