微系统封装术语汇总表

微系统封装术语汇总表Aacceleratedstresstest加速应力测试accelerator促进剂activecomponents有源元件activetrimming有源修调additiveplating加成电镀additiveprocess加成工艺advancedstatisticalanalysisprogram（ASTAP）高级统计分析程序alloy合金alphaparticleα粒子analogcircuit模拟电路analog-to-digital（A/D）模拟到数字anisotropicadhesive各向异性导电胶applicationspecificintegratedcircuit（ASIC）专用集成电路areaarrayTAB面阵载带自动焊array阵列aspectratio深宽比assembly组装assembly/rework组装/返修Bbackbonding背面焊接back-end-of-the-line（BEOL）后道工序backplane背板backsidemetallurgy（BSM）背面合金化ballgridarray（BGA）球栅阵列balllimitingmetallurgy（BLM）球限金属化层bandwidth宽带baredie裸芯片BiCMOS双极互补金属—氧化物—半导体BIFET双极场效应晶体管binder粘合剂BiNMOS双极NMOSbipolarjunctiontransistor（BJT）双极结晶体管bipolartransistor双极晶体管blockcopolymer块状异分子聚合物built-inself-test（BIST）内建自测试blindvia盲孔board电路板boiling沸腾bondability可键和性brazing钎焊接BTAB凸点载带自动焊bumpedtape凸点载带buriedvia埋孔burn-in老化burn-off烧掉Ccachememory缓冲存储器camber弯度capacitance电容card插卡card-on-board板上插卡catalyst催化剂celldesign,standard（standardcelldesign）标准单元设计centralprocessor（CP）中央处理器ceramic陶瓷ceramicballgridarray（CBGA）陶瓷球栅阵列ceramiccolumngridarray（CCGA）陶瓷柱栅阵列ceramicdual-in-linepackage（CDIP）陶瓷双列直插式封装ceramicquadflatpack（CQFP）陶瓷四边引力脚扁平封装cermet陶瓷合金channels信道characteristicimpedance（Z0）特征阻抗chemicalvapordeposition（CVD）化学气相淀积chemorheology化学流变学chip芯片chipcarrier芯片载体chipdesign,depopulated（depopulatedchipdisign）非常规芯片设计chip-on-board（COB）板上芯片chip-on-chip（COC）叠层芯片chip-on-flex（COF）柔性基板上芯片cladding包层clockskew时钟偏移coated-metalcoresubstrate涂层金属芯基板coefficientofthermalexpansion（CTE）热膨胀系数Coffin-MasonequationCoffin-Mason方程cofiring共烧cofiredceramic共烧陶瓷colorant着色剂columngridarray（CGA）柱栅阵列compliantbond柔性粘接剂complimentarymetal-oxidesemiconductor（CMOS）互补金属—氧化物—半导体compressionseal压缩粘接conduction传导conductionadhesive导电粘接剂conductiveepoxy导电环氧树脂胶conductiveinktechnology导电涂料工艺conductor,electrical（electricalconductor）电导体conductor,thermal（thermalconductor）热导体conformalcoating保形涂层connections连接connectivity可连性contactangle接触角controlledcollapsechipconnection（C4）可控塌陷芯片连接controllingcollapse可控塌陷convection对流coplanarleads（flatleads）平面引脚copolymer异分子聚合物cordierite堇青石couplednoise耦合噪声（与串扰同义）coupler偶联剂couplingcapacitor耦合电容crazing微裂creep蠕变crossover跨接crosstalk串扰crystallization结晶化cumulativedistributionfunction（CDF）累积分布函数cure固化curingagent固化剂curingcycle固化循环currentcarryingcapacity电流输运能力currentdesign用户设计cyclesperinstruction单指令周期Ddecouplingcapacitor去耦电容deepsub-micron深亚微米delamination分层delayequation延迟方程delta-Inoise（∆I）∆I噪声designlimits设计约数devitrification除琉化dewpoint露点die芯片diebond芯片粘合diestacking芯片层叠dielectric绝缘介质dielectricconstant介质常数dielectriclayer绝缘层dielectricloss介电损耗differentialscanningcalorimetry（DSC）差分扫描热量计digital-to-analog（D/A）数字到模拟diode二极管directaccessstoragedevice（DASD）直接存取存储器件directchipattach（DCA）芯片直接安装discretecomponent分立元件discretedevice分立器件distancetoneutralpoint（DNP）到中性点的距离doctorblade刮浆刀double-sidedsubstrate双面基板dynamicRAM（DRAM）动态随机存储器driver驱动器dryfilmphotoresist干膜光刻胶drypressing干膜压dual-in-linepackage（DIP）双列直插式封装dynamicflex可动柔性电路dynamicrandomaccessmemory（DRAM）动态随机存储器Eeffectiveinductance（LEFF）有效电感electricallylongtransmissionline长传输线electricallyshorttransmissionline短传输线electrolessplating化学镀electromigration电迁移electronbeamlithography电子束光刻electroplating电镀electrostaticdischarge（ESD）静电放电elongation延伸率emitter-coupledlogic（ECL）发射极耦合逻辑enameling涂瓷漆encapsulation包封endoflife（EOL）可用期engineeringchange（EC）工程更改entity整体eutectic共晶etching腐蚀externalresistance外热阻Ffailure失效failurerate失效率fastwavepropagation快波传输fatigue疲劳ferroelectric铁电fieldeffecttransistor（FET）场效应晶体管fieldreplaceableunit（FRU）现场可置换单元filler填充剂finiteelementmodeling有限元建模first-incidentswitching初次关联开关flameretarder阻燃剂flatPAC扁平封装flexiblecircuitcarrier柔性电路载体flexiblecoating柔性涂层flexibleprintedcircuit（FPC）柔性印刷电路flexuralstrength弯曲强度flip-chip倒装floorplanning预决策flowregime,laminar（laminarflowregime）层流flowregime,turbulent（turbulentflorregime）湍流flux助焊剂footprint痕迹fracturetoughness断裂韧度free-spaceopticalinterconnect自由空间光互连frit玻璃料front-end-of-theline（FEOL）前道工序FR4functionaltest功能测试Ggalliumarsenide（GaAs）砷化镓gatearray门阵列gate,logic（logicgate）逻辑门gate,seaof（seaofgate）（参见门阵列）门海gate,structural（structuralgate）结构化门glass玻璃glass-ceramic玻璃—陶瓷glass+ceramic玻璃+陶瓷glassceramic玻璃陶瓷glassfabric玻璃纤维glasstransitiontemperature（Tg）玻璃转化温度glazedsubstrate玻璃基板glazing涂玻璃globtop封顶globalwiring总布线goldflash金飞边green生的greenceramic生陶瓷green-sheet生基片groundplane接地面guidedprobe定向探测guided-wave波导gullwing鸥翼式Hhardglass耐火玻璃heatflux热流量heatsink热沉hermetic气密high-levelnoisetolerance（NTH）高电平噪声容限homogenousmedium均匀介质hot-gasreflow热气回流hot-knifesoldering热刀焊接hybrid混合集成hybridmodule混合组件Iimpedance阻抗impregnation浸渍inductance电感inertatmosphere惰性气体infraredreflow（IR）红外气流inhomogeneousmedium非均匀介质injectionmoldedcard（IMC）注模成型卡input/outputterminal（I/O）输入/输出端insulationresistance（IR）绝缘电阻insulatormetalsubstratetechnology（IMST）绝缘体金属基板工艺insulators绝缘体integratedcircuit集成电路interchipwiring芯片之间互连线interconnection互连interface界面internalresistance内部热阻interpenetratingpolymernetwork（IPN）互穿聚合物网络invar镍铁合金ionimplantation离子注入ionmigration离子迁移isopak等高封装JJ-leadJ引线脚Josephsonsuperconductingdevice约瑟夫森超导器件Kkeeperbar,tab载带自动焊的定位器kirkendahlvoiding空洞knowngooddie（KGD）优质芯片kovar柯伐Llaminarflowregime层流lami