Dye-Pry-Report-Sample

DyeandPryTestReportPage1of10MSIComputer(Shenzhen)Co.LtdReportNo：V213-01SDP09120501Dye&PryReportSampleType：VGASampleMode:V213-01STestCategory:DyeandpryClient:QingtongReportby:SophiaxiaoDate:2009/12/05DyeandPryTestReportPage2of10MSIComputer(Shenzhen)Co.LtdCONTENTS1.CustomerBackgroundInformation……………..…...……31.1CustomerInformation……………………….…….…..…31.2TestingBoardBasicInformation……………………..…32.TestEquipments&InspectionMethods…………………..42.1EquipmentsDescription………………………………....42.2TestFlow…………………………………………………....42.3Dye&PryFailureClassification…………………….…..53.LocationDefinitionforInspectioncomponents……….…64.AnalysisResults……………………………………….…….64.1Dyeresultsmatrixchart…………………………….…….75.ImagesIndex…………………………………………………85.1BGAcomponentsolderwithlocationsoncorners…...8DyeandPryTestReportPage3of10MSIComputer(Shenzhen)Co.Ltd1.CustomerBackgroundInformation1.1CustomerinformationCustomernameQingtongDepartmentofcustomerVGAApplicationNo.EM-091130-4854898SamplenameVGAQuantity1DescriptionofsampleForsampleV213-01Sselect1pcsGPUcomponent.Datereceived2009.12.03NamereceivedSophiaxiaoTestrequestCheckthesolderjointTestmethodIPC-TM-650Testingtime2009.12.03NametestedSophiaxiao1.2TestingBoardBasicInformationTable2.TestEquipments&InspectionMethods2.1TestEquipmentsDescriptionItemDescriptionMaterialMachinist’sdyeFluxremoverVacuumpumpSubmergethecomponentusevacuumassistindyepenetrationOvenRisenRHDM-60HS:25℃~260℃OpticalmicroscopeVX-500F:20X~1000XBarcodeIDComponentQuantityRemarkPBCZRBXP1YA02U#1GPU1NADyeandPryTestReportPage4of10MSIComputer(Shenzhen)Co.Ltd2.2TestFlowStep1-CleanthesamplewithYC-336A,thenblowofftheresiduecompletelybywindgunStep2-SubmergethecomponentindyeStep3-UsevacuumtoassistinDyepenetrationStep4-AfterdyedplacethePCBAintheairforabout60minsStep5-Drysampleintheovenfor110℃with4hrs.Step6-RemovethetargetcomponentbypullmachineInjector,InspectthefracturesymptomonbothboardandcomponentsidesDyeandPryTestReportPage5of10MSIComputer(Shenzhen)Co.Ltd2.3.Dye&PryFailureModeClassificationDyeandPryTestReportPage6of10MSIComputer(Shenzhen)Co.Ltd3.LocationDefinitionforInspectionComponents4.AnalysisResultsBarcodeIDComponentFractureTypeCrackSizeRemarkPBCZRBXP1YA02U#1GPUNoFractureType0Detailrefertopage8-9GPUDyeandPryTestReportPage7of10MSIComputer(Shenzhen)Co.Ltd4.1DyeresultsmatrixchartID:#1,U1PWBSideComponentSideAAAJAJ112929DyeandPryTestReportPage8of10MSIComputer(Shenzhen)Co.Ltd5.ImageIndex5.1BGAcomponentsolderwithlocationsonthecornersID:#1,GPUPWBsideBGAsidePointA1~PointE6PointA29~PointAD24DyeandPryTestReportPage9of10MSIComputer(Shenzhen)Co.LtdPWBsideBGAsidePointAJ1~PointAD6PointAJ29~PointAV24DyeandPryTestReportPage10of10MSIComputer(Shenzhen)Co.LtdNOTICE1.Thereportwithoutthesealoftestingbodyisinvalid.2.Thereportisinvalidwithoutsignaturesofpersonswhoareinchargeoftestingandapproval3.Generally,thecommissiontestisonlyresponsiblefortheresultsofsubmittedsample.4.Thereportisinvalidofanychangeistakento.5.Ifyouhaveanyquestionabouttheresultofthetest,pleasecontactwithuswithintwoweekssincethereportisreceived.