ANSYS-12.1help文档

ANSYS,Inc.ReleaseNotesRelease12.1ANSYS,Inc.November2009Southpointe275TechnologyDrive002825Canonsburg,PA15317ANSYS,Inc.iscertifiedtoISO9001:[e-mail](T)724-746-3304(F)724-514-9494CopyrightandTrademarkInformation©2009SASIP,Inc.Allrightsreserved.Unauthorizeduse,distributionorduplicationisprohib-ited.ANSYS,ANSYSWorkbench,Ansoft,AUTODYN,EKM,EngineeringKnowledgeManager,CFX,FLUENT,HFSSandanyandallANSYS,Inc.brand,product,serviceandfeaturenames,logosandslogansareregisteredtrademarksortrademarksofANSYS,Inc.oritssubsidiariesintheUnitedStatesorothercountries.ICEMCFDisatrademarkusedbyANSYS,Inc.underlicense.CFXisatrademarkofSonyCorporationinJapan.Allotherbrand,product,serviceandfeaturenamesortrademarksarethepropertyoftheirrespectiveowners.DisclaimerNoticeTHISANSYSSOFTWAREPRODUCTANDPROGRAMDOCUMENTATIONINCLUDETRADESECRETSANDARECONFIDENTIALANDPROPRIETARYPRODUCTSOFANSYS,INC.,ITSSUBSIDIARIES,ORLICENSORS.ThesoftwareproductsanddocumentationarefurnishedbyANSYS,Inc.,itssubsidiaries,oraffiliatesunderasoftwarelicenseagreementthatcontainsprovisionsconcern-ingnon-disclosure,copying,lengthandnatureofuse,compliancewithexportinglaws,war-ranties,disclaimers,limitationsofliability,andremedies,andotherprovisions.Thesoftwareproductsanddocumentationmaybeused,disclosed,transferred,orcopiedonlyinaccordancewiththetermsandconditionsofthatsoftwarelicenseagreement.ANSYS,Inc.iscertifiedtoISO9001:2008.U.S.GovernmentRightsForU.S.Governmentusers,exceptasspecificallygrantedbytheANSYS,Inc.softwarelicenseagreement,theuse,duplication,ordisclosurebytheUnitedStatesGovernmentissubjecttorestrictionsstatedintheANSYS,Inc.softwarelicenseagreementandFAR12.212(fornon-DODlicenses).Third-PartySoftwareSeethelegalinformationintheproducthelpfilesforthecompleteLegalNoticeforANSYSproprietarysoftwareandthird-partysoftware.IfyouareunabletoaccesstheLegalNotice,pleasecontactANSYS,Inc.PublishedintheU.S.A.TableofContents1.Global..................................................................................................................11.1.Installation...................................................................................................11.2.Licensing......................................................................................................22.ANSYSMechanicalAPDL.....................................................................................32.1.Structural.....................................................................................................32.1.1.LinearDynamics..................................................................................32.1.1.1.ModalAssuranceCriterionPerformanceEnhancements...............32.1.1.2.AnimatedSequenceSupportEnhancements...............................42.1.1.3.SimplorerInterface......................................................................42.1.1.4.CMOMEGA,CMDOMEGA,andCMACELMaximumComponentEnhancements.......................................................................................42.2.Low-FrequencyElectromagnetics.................................................................42.2.1.NewElementforModelingPlanarandAxisymmetricMagneticFields...........................................................................................................42.3.Thermal........................................................................................................52.3.1.ConvectionAnalysis.............................................................................52.4.Solvers.........................................................................................................62.4.1.HighPerformanceComputingEnhancements......................................62.4.2.DistributedANSYSSupportsIntelMPI...................................................62.4.3.DistributedANSYSSupportsPrestressedModalCyclicSymmetry..........62.4.4.PCGLanczos(LANPCG)SolverEnhancements.......................................62.4.5.DistributedSparse(DSPARSE)SolverEnhancements.............................62.5.Commands...................................................................................................72.5.1.NewCommands..................................................................................72.5.2.ModifiedCommands............................................................................72.6.Elements......................................................................................................72.6.1.NewElements......................................................................................82.6.2.ModifiedElements...............................................................................82.7.Documentation............................................................................................82.7.1.NewTechnologyDemonstrationGuide...................................................82.7.2.SpinSofteningDocumentationUpdates.............................................132.7.3.DocumentationUpdatesforProgrammers..........................................13