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封装形式：封装形式是指安装半导体集成电路芯片用的外壳。它不仅起着安装、固定、密封、保护芯片及增强电热性能等方面的作用，而且还通过芯片上的接点用导线连接到封装外壳的引脚上，这些引脚又通过印刷电路板上的导线与其他器件相连接。衡量一个芯片封装技术先进与否的重要指标是芯片面积与封装面积之比，这个比值越接近1越好。封装大致经过了如下发展进程：结构方面：TO－DIP－LCC－QFP－BGA－CSP；材料方面：金属、陶瓷－陶瓷、塑料－塑料；引脚形状：长引线直插－短引线或无引线贴装－球状凸点；装配方式：通孔插装－表面组装－直接安装。英文简称英文全称中文解释DIPDoubleIn-linePackage双列直插式封装。插装型封装之一，引脚从封装两侧引出，封装材料有塑料和陶瓷两种。DIP是最普及的插装型封装，应用范围包括标准逻辑IC，存贮器LSI，微机电路等。PLCCPlasticLeadedChipCarrierPLCC封装方式，外形呈正方形，32脚封装，四周都有管脚，外形尺寸比DIP封装小得多。PLCC封装适合用SMT表面安装技术在PCB上安装布线，具有外形尺寸小、可靠性高的优点。PQFPPlasticQuadFlatPackagePQFP封装的芯片引脚之间距离很小，管脚很细，一般大规模或超大规模集成电路采用这种封装形式，其引脚数一般都在100以上。SOPSmallOutlinePackage1968～1969年菲为浦公司就开发出小外形封装（SOP）。以后逐渐派生出SOJ（J型引脚小外形封装）、TSOP（薄小外形封装）、VSOP（甚小外形封装）、SSOP（缩小型SOP）、TSSOP（薄的缩小型SOP）及SOT（小外形晶体管）、SOIC（小外形集成电路）等。常见英文缩写解释（按字母顺序排列）：ASICApplicationSpecificIntegratedCircuit专用ICCPLDComplexProgrammableLogicDevice复杂可编程逻辑器件EDAElectronicDesignAutomation电子设计自动化FPGAFieldProgrammableGateArray现场可编程门阵列GALGenericArrayLogic通用阵列逻辑HDLHardwareDescriptionLanguage硬件描述语言IPIntelligentProperty智能模块PALProgrammableArrayLogic可编程阵列逻辑RTLRegisterTransferLevel寄存器传输级描述SOCSystemOnaChip片上系统SLICSystemLevelIC系统级ICVHDLVeryhighspeedintegratedcircuitHardwareDescriptionLanguage超高速集成电路硬件描述语言英文全称英文简称中文名称ACROSecureACROSecure宏聚科技（深圳）有限公司8x8,Inc.8x88x8ACCMicroelectronicsCorp.ACCMicroACCMicroAcerLaboratories,Inc.AcerLaboratoriesAcerLaboratoriesActelCorporationActelActelAnalogDevicesInc.AD模拟器件Adaptec,Inc.AdaptecAdaptecAdvancedHardwareArchitectures,Inc.AdvancedHardwareAdvancedHardwareAdvancedMicroDevices,Inc.AdvancedMicro先进线性器件公司AeroflexCircuitTechnologyAeroflexAeroflexAgilentTechnologies,Ltd.AGILENT安捷伦AITechInternationalAITechIntlAITechIntlAKMSemiconductor,Inc.AKMSemiAKMSemiAllegroMicroSystems,Inc.ALLEGROALLEGROAllianceSemiconductorAllianceSemi联合半导体ALLTEKALLTEKALLTEKAlphaSemiconductorAlphaSemiAlphaSemiAlteraCorporationAlteraAlteraAdvancedMicroDevices,Inc.AMD先进微器件AmericanMicrosystems,Inc.AmericanMicro美国微系统公司AMIAMIAMIAMPIncorporatedAMP安普AMPHENOLAMPHENOLAMPHENOLAMTRONAMTRONAMTRONAnadigics,Inc.AnadigicsAnadigicsAnalogicCorporationAnalogicAnalogicApexMicrotechnologyCorporationApexMicroApexMicroAMCC(AppliedMicroCircuitsCorp)AppliedMicroCircuitsAppliedMicroCircuitsAptekWilliams,Inc.AptekWilliamsAptekWilliamsAptosSemiconductorCorporationAptosSemiAptosSemiArizonaMicrotek,Inc.ArizonaMicrotek亚利桑那ArrayMicrosystemsArrayMicroArrayMicroARTESYNARTESYNARTESYNASILIANTASILIANTASILIANTAstecSemiconductorAstecSemiAstecSemiAtmelCorporationATMEL爱特美尔AUCTORMAPLEAUCTORMAPLEAUCTORMAPLEAUDIOCODESAUDIOCODESAUDIOCODESAustinSemiconductor,Inc.AustinSemiAustinSemiAustriaMikroSystemeInternational,Inc.AustriaMikro奥地利微系统AverLogicTechnologies,Inc.AverlogicAverlogicAVXCorporation.AVXAVXBurr-BrownCorporationBB布尔布朗BelFuseIncorporatedBelFuseBelFuseBIBIBIBourns,Inc.BOURNS布尔BethelTronix,Inc.BTBTC&DTechnologiesC&DTechnologiesC&DTechnologiesCaliforniaMicroDevicesCorporationCaliforniaMicro加利福尼亚微器件CalogicCorporationCalogicCalogicCatalystSemiconductorCatalystSemiCatalystSemiCEACSZCEACSZ中国电子器材公司深圳公司CentonElectronics,Inc.CentonElctrnsCentonElctrnsCenturyMicroelectronics,Inc.CenturyMicro世纪微电子CermetekMicroelectronics,Inc.CermetekMicroCermetekMicroCherrySemiconductorCorporationCherrySemi安森美ChipExpressCorporationCHIPCHIPChrontelChrontelChrontelCirrusLogic,Inc.CirrusLogicCirrusLogicClearLogicClearLogicClearLogicCMDTechnology,Inc.CMDCMDCologneChipDesignsCologneChipDesignsCologneChipDesignsConexantSystems,Inc.ConexantConexantConsumerMicrocircuitsLimitedConsumerMicrocircuitsConsumerMicrocircuitsCOSELCOSELCOSELCyberneticMicroSystemsCyberneticMicroCyberneticMicroCypressSemiconductorCorp.CypressSemiCypressSemiCyrixCorporationCyrixCyrixDAEWOODaewooDaewooDallasSemiconductorDALLAS达拉斯DALSAIncorporatedDALSADALSADataDelayDevices,Inc.DataDelayDataDelayDatel,Inc.DatelDatelDavicomSemiconductorIncorporatedDavicomDavicomDense-PacMicrosystems,Inc.Dense-PacDense-PacDigitalSemiconductorDigitalSemiDigitalSemiDiiSemiconductorDiiSemiconductorDiiSemiconductorDionicsInc.DionicsDionicsDSPGroup,Inc.DSPGroupDSPGroupDVSIDVSIDVSIEdgeTechnology,Inc.EdgeTechnologyEdgeTechnologyEG&GICSensorsEG&GICSensorsEG&GICSensorsElantecSemiconductor,Inc.ElantecElantecElectronicTechnologyCorporationElectronicTechnology电磁科技公司EMMicroelectronicEMMicroEMMicroemersonEMERSONemersonEnhancedMemorySystems,Inc.EnhancedMemoryEnhancedMemoryEpsonElectronicsAmerica,Inc.EpsonAmerica爱普生EricssonEricssonEricssonESSTechnology,Inc.ESSTechnologyESSTechnologyExarCorporationEXAREXAREXELMicroelectronics,Inc.ExelExelFABLAFABLAFABLAFairchildSemiconductorCorporationFairchild仙童FCIFCIFCIFINEFINEFINEFSCFSCFSCFujitsuMicroelectronics,Inc.FUJIFUJGalileoTechnologyGalileoTechnologyGalileoTechnologyGalvantech,Inc.GalvantechGalvantechGateFieldCorporationGateFieldGateFieldGenesisMicrochipInc.GenesisMicrochipGenesisMicrochipGennumCorporationGennumGennumGIGAA/SGIGAA/SGIGAA/SG-LinkTechnologyCorporationG-LinkTechG-LinkTechGOLDSTARGOLDSTARGOLDSTARGalaxyPower,Inc.GPGPGoalSemiconductorGSGSGSITechnologyGSITechnologyGSITechnologyGSVGSVGSVHarrisSemiconductorHARHARHewlett-PackardCom