产品结构说明

單面板(SingleSidedFlex)單面板是最常見的柔性電路板﹐是由一層的銅箔與基材再加上保護膠片所組成﹐其結構可以如下圖所示﹕-(表面處理)(表面處理)SurfaceTreatmentSurfaceTreatment==(1)Coverlay保護膠片==(2)Adhesive膠==(3)CopperFoil銅箔==(4)Adhesive膠==(5)BaseFilm基材==(6)Adhesive/BondingFlim==(7)PIStiffener/PETStiffener/FR4補強膠片/補強板FPCcanbecombinedbydifferentmaterial,theaboveconstructionlayerscanbecombinedasfollowdifferentmaterial:-(柔性電路板是由不同的基材所組成的﹐其材料的組合可以分為以下種類)Remarks:(1)SurfaceTreatment==a)ImmersionGold(ElectrolessGold)無電解金(表面處理)b)ElectrolyticGold電解金c)Tin-leadPlating錫鉛電鍍d)ChemicalTin化錫e)HotAirLevelling水平噴錫f)OSP(Anti-Tarnish)防鏽處理(2)Coverlay==MaterialusedforCoverlaycandividedtoPolyimide(PI)(保護膠片)andPolyester(PET).(保護膠片的基材可以分為PI和PET)PImaterialthicknesscanbeconcludedasbelow:-(PI材料的厚度可以分為以下﹕-)a)1/2milwith15umadhesive1/2milwith25umadhesive1/2milwith35umadhesiveb)1milwith35umadhesive1milwith40umadhesive1milwith50umadhesivec)2milwith25umadhesive2milwith35umadhesive2milwith50umadhesived)3milwith30umadhesivePETmaterialthicknesscanbeconcludedasbelow:-(PET材料的厚度可以分為以下﹕-)a)1milwith24umadhesive補強板(3)CopperFoil&==Normalcopperfoilthicknesscanbeconcludedasbelow:-(銅箔)PImaterialthicknesscanbeconcludedasbelow:-(PI材料的厚度可以分為以下﹕-)(5)BaseFilma)1/2ozRA,1/2milPICCL(基板)b)1/2ozRA,1milPICCLc)1/2ozRA,2milPICCLd)1ozRA,1milPICCLe)1ozRA,1/2milPICCLf)1ozRA,2milPICCLh)2ozRA,1/2milPICCLi)2ozRA,1milPICCLj)2ozRA,2milPICCLk)1/2ozED,1/2milPICCLl)1/2ozED,1milPICCLm)1/2ozED,2milPICCLn)1ozED,1milPICCLo)1ozED,1/2milPICCLp)1ozED,2milPICCLq)2ozED,1/2milPICCLr)2ozED,1milPICCLs)2ozED,2milPICCL(7)PI&PETStiffener==PIstiffenercanbeconcludedasbelow:-(補強膠片)(PI的補強膠片可以分為以下﹕-)a)1milPIb)2milPI3)3milPI4)5milPI5)7milPIPETstiffenercanbeconcludedasbelow:-(PET的補強膠片可以分為以下﹕-)a)2milPETb)3milPETc)4milPETd)5milPETe)7milPETf)8milPETg)10milPETFR4thickness==FR4thicknesscanbeconcludedasbelow:-(補強板)(FR4補強板的厚度可以分為以下﹕-)a)0.05mmm)0.15mmb)0.08mmn)0.16mmc)0.102mmo)0.18mmd)0.2mmp)1.0mme)0.203mmq)1.2mmf)0.3mmr)1.5mmg)0.4mms)1.6mmh)0.5mmi)0.6mmj)0.8mmk)0.11mml)0.13mm雙面板(DoubleSidedFlex)雙面板是含有或不含鍍通孔的雙層電層﹐具有更高的集成度﹐有利于控制電阻。其是由兩層的銅箔與基材組成﹐上下都有保護膠片﹐結構如下圖所示﹕-(表面處理)(表面處理)SurfaceTreatmentSurfaceTreatment==(1)Coverlay保護膠片==(2)Adhesive膠==(3)CopperFoil銅箔==(4)Adhesive膠==(5)BaseFilm基材==(6)Adhesive膠==(7)CopperFoil銅箔PTH==(8)Adhesive膠==(9)Coverlay保護膠片==(10)Adhesive/BondingFlim==(11)PIStiffener/PETStiffenerSurfaceTreatmentSurfaceTreatment/FR4補強膠片/補強板(表面處理)(表面處理)PTHFPCcanbecombinedbydifferentmaterial,theaboveconstructionlayerscanbecombinedasfollowdifferentmaterial:-(柔性電路板是由不同的基材所組成的﹐其材料的組合可以分為以下種類)Remarks:(1)SurfaceTreatment==a)ImmersionGold(ElectrolessGold)無電解金b)ElectrolyticGold電解金c)Tin-leadPlating錫鉛電鍍d)ChemicalTin化錫e)HotAirLevelling水平噴錫f)OSP(Anti-Tarnish)防鏽處理(2)Coverlay==MaterialusedforCoverlaycandividedtoPolyimide(PI)(保護膠片)andPolyester(PET).(保護膠片的基材可以分為PI和PET)PImaterialthicknesscanbeconcludedasbelow:-(PI材料的厚度可以分為以下﹕-)a)1/2milwith15umadhesive1/2milwith25umadhesive1/2milwith35umadhesiveb)1milwith35umadhesive1milwith40umadhesive1milwith50umadhesive(表面處理)c)2milwith25umadhesive2milwith35umadhesive2milwith50umadhesived)3milwith30umadhesivePETmaterialthicknesscanbeconcludedasbelow:-(PET材料的厚度可以分為以下﹕-)a)1milwith24umadhesive(3)CopperFoil&==Normalcopperfoilthicknesscanbeconcludedasbelow:-(銅箔)PImaterialthicknesscanbeconcludedasbelow:-(PI材料的厚度可以分為以下﹕-)(4)BaseFilma)1/2ozRA,1/2milPI,1/2ozCCL(基材)b)1/2ozRA,1milPI,1/2ozCCLc)1/2ozRA,2milPI,1/2ozCCLd)1ozRA,1milPI,1ozCCLe)1ozRA,1/2milPI,1ozCCLf)1ozRA,2milPI,1ozCCLg)1/2ozED,1/2milPI,1/2ozCCLh)1/2ozED,1milPI,1/2ozCCLi)1/2ozED,2milPI,1/2ozCCLj)1ozED,1milPI,1ozCCLk)1ozED,1/2milPI,1ozCCLl)1ozED,2milPI,1ozCCL(5)PI&PETStiffener==PIstiffenercanbeconcludedasbelow:-(補強膠片)(PI的補強膠片可以分為以下﹕-)a)1milPIb)2milPI3)3milPI4)5milPI5)7milPIPETstiffenercanbeconcludedasbelow:-(PET的補強膠片可以分為以下﹕-)a)2milPETb)3milPETc)4milPETd)5milPETe)7milPETf)8milPETg)10milPETFR4thickness==FR4thicknesscanbeconcludedasbelow:-(補強板)(FR4補強板的厚度可以分為以下﹕-)a)0.05mmm)0.15mmb)0.08mmn)0.16mmc)0.102mmo)0.18mmd)0.2mmp)1.0mme)0.203mmq)1.2mmf)0.3mmr)1.5mmg)0.4mms)1.6mmh)0.5mmi)0.6mmj)0.8mmk)0.11mml)0.13mmPIStiffener/PETStiffener雙面貫連板(DualAccessorPre-Punch)雙面板是由一層的銅箔構成但能雙面導銅﹐到底雙面板的功能。(表面處理)(表面處理)SurfaceTreatmentSurfaceTreatment==(1)Coverlay保護膠片==(2)Adhesive膠銅箔==(3)CopperFoil銅箔==(4)Adhesive膠(5)Coverlay保護膠片==(6)Adhesive/BondingFlim==(7)PIStiffener/PETStiffenerSurfaceTreatmentSurfaceTreatment/FR4補強膠片/補強板(表面處理)(表面處理)FPCcanbecombinedbydifferentmaterial,theaboveconstructionlayerscanbecombinedasfollowdifferentmaterial:-(柔性電路板是有不同的基材所組成的﹐其結構層可以分為以下)Remarks:(1)SurfaceTreatment==a)ImmersionGold(ElectrolessGold)無電解金(表面處理)b)ElectrolyticGold電解金c)Tin-leadPlating錫鉛電鍍d)ChemicalTin化錫e)HotAirLevelling水平噴錫f)OSP(Anti-Tarnish)防鏽處理(2)Coverlay==MaterialusedforCoverlaycandividedtoPolyimide(PI)(保護膠片)andPolyester(PET).(保護膠片的基材可以分為PI和PET)PImaterialthicknesscanbeconcludedasbelow:-(PI材料的厚度可以分為以下﹕-)a)1/2milwith15umadhesive1/2milwith25umadhesive1/2milwith35umadhesiveb)1milwith35umadhesive1milwith40umadhesive1milwith50umadhesivec)2milwith25umadhesive2milwith35umadhesive2milwith50umadhesived)3milwith30um