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MSP430G2x53MSP430G2x13–APRIL2011–REVISEDJANUARY2012混混合合信信号号微微控控制制器器1特特性性•低低电电源源电电压压范范围围：：1.8V至至3.6V•通通用用串串行行通通信信接接口口(USCI)•超超低低功功耗耗–支支持持自自动动波波特特率率检检测测的的增增强强型型通通用用异异步步收收发发器器(UART)–运运行行模模式式：：230μA（（在在1MHz频频率率和和2.2V电电压压条条件件下下））–IrDA编编码码器器和和解解码码器器–待待机机模模式式：：0.5μA–同同步步SPI–关关闭闭模模式式（（RAM保保持持））：：0.1μA–I2C™•5种种节节能能模模式式•用用于于模模拟拟信信号号比比较较功功能能或或者者斜斜率率模模数数(A/D)转转换换的的片片载载比比较较器器•可可在在不不到到1μs的的时时间间里里超超快快速速地地从从待待机机模模式式唤唤醒醒•带带内内部部基基准准、、采采样样与与保保持持以以及及自自动动扫扫描描功功能能的的10•16位位精精简简指指令令集集(RISC)架架构构，，62.5ns指指令令周周期期时时位位200-ksps模模数数(A/D)转转换换器器（（见见表表1））间间•欠欠压压检检测测器器•基基本本时时钟钟模模块块配配置置•串串行行板板上上编编程程，，–具具有有四四种种校校准准频频率率并并高高达达16MHz的的内内部部频频率率无无需需外外部部编编程程电电压压，，–内内部部超超低低功功耗耗低低频频(LF)振振荡荡器器利利用用安安全全熔熔丝丝(SecurityFuse)实实现现可可编编程程代代码码保保–32kHz晶晶体体护护–外外部部数数字字时时钟钟源源•具具有有两两线线制制(Spy-Bi-Wire)接接口口的的片片上上仿仿真真逻逻辑辑电电•两两个个16位位Timer_A，，分分别别具具有有三三个个捕捕获获/比比较较寄寄存存路路器器•系系列列成成员员汇汇总总于于表表1•多多达达24个个支支持持触触摸摸感感测测的的I/O引引脚脚•封封装装选选项项–薄薄型型小小外外形形尺尺寸寸封封装装(TSSOP)：：20引引脚脚、、28引引脚脚–塑塑料料双双列列直直插插式式封封装装(PDIP)：：20引引脚脚–四四方方扁扁平平无无引引线线封封装装(QFN)：：32引引脚脚•如如需需了了解解完完整整的的模模块块说说明明，，请请查查阅阅《《MSP430x2xx系系列列产产品品用用户户指指南南》》（（文文献献编编号号））说说明明德州仪器(TI)的MSP430系列超低功率微控制器包含几个器件，这些器件特有针对多种应用的不同的外设集。这种架构与5种低功耗模式相组合，专为在便携式测量应用中延长电池的使用寿命而优化。该器件具有一个强大的16位RISCCPU、16位寄存器和有助于获得最大编码效率的常数发生器。数字控制振荡器(DCO)可在不到1µs的时间里完成从低功耗模式至运行模式的唤醒。MSP430G2x13和MSP430G2x53系列是超低功耗混合信号微控制器，具有内置的16位定时器、多达24个支持触摸感测的I/O引脚、一个通用型模拟比较器以及采用通用串行通信接口的内置通信能力。此外，MSP430G2x53系列成员还具有一个10位模数(A/D)转换器。有关配置的详情请见表1。典型应用包括低成本传感器系统，此类系统负责捕获模拟信号、将之转换为数字值、随后对数据进行处理以进行显示或传送至主机系统。1Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet.PRODUCTIONDATAinformationiscurrentasofpublicationdate.版权©2011–2012,TexasInstrumentsIncorporatedProductsconformtospecificationsperthetermsoftheTexasInstrumentsstandardwarranty.ProductionprocessingdoesnotEnglishDataSheet:SLAS735necessarilyincludetestingofallparameters.MSP430G2x53MSP430G2x13ZHCS178E–APRIL2011–REVISEDJANUARY2012提提供供的的选选项项(1)(2)嵌嵌入入式式引引导导加加仿仿真真模模闪闪存存RAMCOMP_A+10通通道道USCI器器件件载载器器Timer_A时时钟钟I/O封封装装类类型型块块(KB)(B)通通道道ADCA0/B0(BSL)(EEM)32引脚MSP430G2553IRHB3224QFN封装28引脚MSP430G2553IPW2824TSSOP封LF，装11165122xTA3881DCO，20引脚VLOMSP430G2553IPW2016TSSOP封装20引脚MSP430G2553IN2016PDIP封装32引脚MSP430G2453IRHB3224QFN封装28引脚MSP430G2453IPW2824TSSOP封LF，装1185122xTA3881DCO，20引脚VLOMSP430G2453IPW2016TSSOP封装20引脚MSP430G2453IN2016PDIP封装32引脚MSP430G2353IRHB3224QFN封装28引脚MSP430G2353IPW2824TSSOP封LF，装1142562xTA3881DCO，20引脚VLOMSP430G2353IPW2016TSSOP封装20引脚MSP430G2353IN2016PDIP封装32引脚MSP430G2253IRHB3224QFN封装28引脚MSP430G2253IPW2824TSSOP封LF，装1122562xTA3881DCO，20引脚VLOMSP430G2253IPW2016TSSOP封装20引脚MSP430G2253IN2016PDIP封装32引脚MSP430G2153IRHB3224QFN封装28引脚MSP430G2153IPW2824TSSOP封LF，装1112562xTA3881DCO，20引脚VLOMSP430G2153IPW2016TSSOP封装20引脚MSP430G2153IN2016PDIP封装(1)要获得最新的封装和订购信息，请见本文档末端的封装选项，或者访问德州仪器(TI)的网站。(2)封装图样、热数据和符号可登录获取。2版权©2011–2012,TexasInstrumentsIncorporatedMSP430G2x53MSP430G2x13–APRIL2011–REVISEDJANUARY2012表表1.提提供供的的选选项项(1)(2)(接接下下页页)嵌嵌入入式式引引导导加加仿仿真真模模闪闪存存RAMCOMP_A+10通通道道USCI器器件件载载器器Timer_A时时钟钟I/O封封装装类类型型块块(KB)(B)通通道道ADCA0/B0(BSL)(EEM)32引脚MSP430G2513IRHB3224QFN封装28引脚MSP430G2513IPW2824TSSOP封LF，装11165122xTA38-1DCO，20引脚VLOMSP430G2513IPW2016TSSOP封装20引脚MSP430G2513IN2016PDIP封装32引脚MSP430G2413IRHB3224QFN封装28引脚MSP430G2413IPW2824TSSOP封LF，装1185122xTA38-1DCO，20引脚VLOMSP430G2413IPW2016TSSOP封装20引脚MSP430G2413IN2016PDIP封装32引脚MSP430G2313IRHB3224QFN封装28引脚MSP430G2313IPW2824TSSOP封LF，装1142562xTA38-1DCO，20引脚VLOMSP430G2313IPW2016TSSOP封装20引脚MSP430G2313IN2016PDIP封装32引脚MSP430G2213IRHB3224QFN封装28引脚MSP430G2213IPW2824TSSOP封LF，装1122562xTA38-1DCO，20引脚VLOMSP430G2213IPW2016TSSOP封装20引脚MSP430G2213IN2016PDIP封装32引脚MSP430G2113IRHB3224QFN封装28引脚MSP430G2113IPW2824TSSOP封LF，装1112562xTA38-1DCO，20引脚VLOMSP430G2113IPW2016TSSOP封装20引脚MSP430G2113IN2016PDIP封装Copyright©2011–2012,TexasInstrumentsIncorporated3N20PW20(TOPVIEW)1DVCC2P1.0/TA0CLK/ACLK/A0/CA0345P1.3/ADC10CLK/CAOUT/VREF-/VEREF-/A3/CA3678P2.0/TA1.09P2.1/TA1.110P2.2/TA1.111P2.3/TA1.012P2.4/TA1.213P2.5/TA1.2141516RST/NMI/SBWTDIO17TEST/SBWTCK18XOUT/P2.719XIN/P2.6/TA0.120DVSSP1.6/TA0.1/CA6/TDI/TCLKUCB0SOMI/UCB0SCL/A6/P1.7/CAOUT/A7/CA7/TDO/TDI/UCB0SIMO/UCB0SDAP1.1/TA0.0/A1/CA1/UCA0RXD/UCA0SOMIP1.2/TA0.1/A2/CA2/UCA0TXD/PUCA0SIMOP1.4/SMCLK/CA4/TCK/VREF+/VEREF+/A4/UCB0STE/UCA0CLKP1.5/TA0.0/A5/CA5/TMS/UCB0CLK/UCA0STEPW28(TOPVIEW)1DVCC2P1.0/TA0CLK/ACLK/A0/CA0345P1.3/ADC10CLK/CAOUT/VREF-/VEREF-/A3/CA3678P3.0/TA0.29P3.1/TA1.010P2.0/TA1.019P3.5/TA0.120P3.6/TA0.221P3.7/TA1CLK/CAOUT222324RST/NMI/SBWTDIO25TEST/SBWTCK26XOUT/P2.727XIN/P2.6/TA0.128DVSSP1.6/TA0.1/CA6/TDI/TCLKUCB0SOMI/UCB0SCL/A6/P1.7/CAOUT/A7/CA7/TDO/TDI/UCB0SIMO/UCB0SDAP1.1/TA0.0/A1/CA1/UCA0RXD/UCA0SOMIP1.2/TA0.1/A2/CA2/UCA0TXD/PUCA0SIMOP1.4/SMCLK/CA4/TCK/VREF+/VEREF+/A4/UCB0STE/UCA0CLKP1.5/TA0.0/A5/CA5/TMS/UCB0CLK/UCA0STE1112P2.2/TA1.113P3.2/TA1.114P3.3/TA1.215P3.4/TA0.016P2.3/TA1.017P2.4/TA1.218P2.5/TA1.2P2.1/TA1.1MSP430G2x53MSP430G2x13ZHCS178E–APRIL2011–REVISEDJANUARY2012器器件件引引出出脚脚配配置