台虹产品代号说明(常规、2LP、无卤素_

TAIFLEX台虹科技常规FCCL成品代號說明NSSIIRR110000552200HHJJYY(1)(2)(3)(4)(5)(6)(7)(8)(9)說明:(1).FlexTec(TAIFLEXFCCL產品名)應用特性分類代號N:Normal(泛用型)X:Flexibility(撓曲折性产品)I:LowIonic(低離子含量高挠曲性产品)A:Advanced(先進型)(2).S:SingleSideD:DoubleSide(3).I:PIfilmE:PETfilm(4).R:RACuE:EDCu(5).膜厚度例:10=1mil=25um,05=1/2mil=12.5um(6).銅箔厚度例:10=1oz=35um,05=1/2oz=18um(7).膠厚度(um)(8).Film種類:H:KaptonA:ApicalT:TaimideP:BOPI(9).Cufoil種類:JY:日曠(BHYRA)JA:日曠(BHARA)JC:日曠(ED)WP:古河(ED)W2:古河(1/3ozED)FF:Fukuda(RA)FZ:Fukuda(ED)OC:Olin(RA)ME:Mitsui/S-HTE(ED)TE:TCF/S-THE(ED)LC:LCYGRLP3(ED)PDFSpritePDFDemoVersionMYPDFDRIVERTAIFLEX台虹科技常规COVERLAY成品代號說明FDD11002255HHLL33(1)(2)(3)(4)(5)(6)說明:(1).FlexBond:(TAIFLEXCoverlay產品名)(2).D:常规挠曲性胶(搭配N、及X型基材使用)I:低離子量的透明柔软型膠(搭配低離子含量高挠曲性产品使用)(3).Film厚度例:10=1mil=25um,05=1/2mil=12.5um(4).膠厚度um(5).PIFilm種類代號:H:KaptonT:TaimideA:ApicalP:BOPI(6).貼合材代號PDFSpritePDFDemoVersionMYPDFDRIVERTAIFLEX台虹科技常规補強板成品代號說明FRR88002255(1)(2)(3)(4)說明:(1).FlexBond:(TAIFLEXCoverlay產品名)(2).R:常规Reinforce(3).複合基材總厚度例:80=8mil=200um(4).膠厚度um例:25=25umPDFSpritePDFDemoVersionMYPDFDRIVERTAIFLEX台虹科技常规複合板成品代號說明MIIAA55002255(1)(2)(3)(4)(5)說明:(1).M:表複合基材(Material)(2).基材類別C:CopperFoil銅箔基材，I:PI基材(3).PIFilm種類代號:H:KaptonHA:ApicalAHN:ApicalNPIT:TaimideP:BOPI(4).複合基材總厚度例:50=5mil=125um(5).膠厚度(um)例:25=25umPDFSpritePDFDemoVersionMYPDFDRIVERTAIFLEX台虹科技常规純膠成品代號說明BSS1100EE(1)(2)(3)說明:(1).BS:BondingSheet(TAIFLEX純膠產品名)(2).膠厚度um例:10=10um(3).貼合材品名代號PDFSpritePDFDemoVersionMYPDFDRIVERTAIFLEX台虹科技无胶基材成品代码说明2LPSR1005JY(1)(2)(3)(4)(5)(6)說明:(1).2LP2LayerCCL代號產品名(2).S:SingleSideD:DoubleSide(3)R:Wroughtcopperfoil(壓延銅箔)E:Depositioncopperfoil(4).PI膜厚度例:10=1mil=25um,05=1/2mil=12.5um(5).銅箔厚度例:10=1oz=35um05=1/2oz=18um(6).Cufoil種類:JY:JE/BHY(RA)JA:日曠(BHARA)JC:JE/JTC(ED)WP:古河(ED)W2:古河(1/3ozED)FF:Fukuda/RCF(RA)FZ:Fukuda/CF-T9FZ-UH(ED)OC:Olin(RA)ME:Mitsui(ED)TE:TCF/(ED)LC:LCY(ED)UP:日本電解USLP-R2PDFSpritePDFDemoVersionMYPDFDRIVERTAIFLEX台虹科技HalogenFree產品FCCL成品編號THHKKSS110000552200JJYY(1)(2)(3)(4)(5)(6)(7)(8)說明:(1)TCCL代號產品名(2)HHalogenfree(3)PIFilm類別:KKaptonfilm；AApicalfilm(kaneka)；TTaimide；PBOPI(4)S:SingleSideD:DoubleSide(5)PI膜厚度例:10=1mil=25um,05=1/2mil=12.5um(6)銅箔厚度例:10=1oz=35um,05=1/2oz=18um(7)膠厚度(um)(8).Cufoil種類:JY:日曠(RA)JC:日曠(ED)FF:Fukuda(RA)FZ:Fukuda(ED)OC:Olin(RA)ME:Mitsui/S-HTE(ED)TE:TCF/S-THE(ED)LC:LCYGRLP3(ED)PDFSpritePDFDemoVersionMYPDFDRIVERTAIFLEX台虹科技HalogenFree產品Coverlay成品編號FHHKK1025L(1)(2)(3)(4)(5)(6)說明:(1).FCoverlay產品名(2).HHalogenfree(3)PIFilm類別:KKaptonfilm；AApicalfilm(kaneka)；TTaimide；PBOPI(4).PIFilm厚度例:10=1mil=25um,05=1/2mil=12.5um(5).膠厚度um(6).貼合材品名代號:PDFSpritePDFDemoVersionMYPDFDRIVERTAIFLEX台虹科技HalogenFree產品BondingSheet(純膠)成品編號BHH1100(1)(2)(3)說明:(1).BBondingSheet(純膠產品名)(2).HHalogenfree(3).膠厚度um例:10=10umPDFSpritePDFDemoVersionMYPDFDRIVERTAIFLEX台虹科技HalogenFree產品Reinforcement(補強板)成品編號RHHAA88002255(1)(2)(3)(4)(5)說明:(1)RReinforcement(補強板產品名)(2)HHalogenfree(3)PIFilm類別:KKaptonfilm；AApicalfilmkaneka)；TTaimide；PBOPI(4)複合基材總厚度例:80=8mil=200um(5).接著劑膠厚度um例:25=25umPDFSpritePDFDemoVersionMYPDFDRIVERTAIFLEX台虹科技HalogenFree產品複合板成品編號MHA5025(1)(2)(3)(4)(5)說明:(1).M:表複合基材(Material)(2).HHalogenfree(3).PIFilm類別:KKaptonfilmAApicalfilm(kaneka)TTaimidePBOPI(4).複合基材總厚度例:50=5mil=125um(5).膠厚度(um)例:25=25umPDFSpritePDFDemoVersionMYPDFDRIVER