施耐德低压系统学习资料

1SLIC­LVDI training –Chen Xiliang–2009 June2SLIC­LVDI training –Chen Xiliang–2009 June3SLIC­LVDI training –Chen Xiliang–2009 June4SLIC­LVDI training –Chen Xiliang–2009 June(UPS)EPS0.25s1.5s15s5SLIC­LVDI training –Chen Xiliang–2009 June36, 42, 220/380, 380/660V36, 42, 230/400, 400/690V6, 12, 24, 36, 48, 127, 220, 380V6, 12, 24, 36, 48, 130, 230, 400V6SLIC­LVDI training –Chen Xiliang–2009 JuneLNLNL1NL2PENPE7SLIC­LVDI training –Chen Xiliang–2009 JuneL1L2L3N (PEN)L1L2L3L1L2L3L1L2L3L1L2L3N (PEN)8SLIC­LVDI training –Chen Xiliang–2009 June9SLIC­LVDI training –Chen Xiliang–2009 June10SLIC­LVDI training –Chen Xiliang–2009 June11SLIC­LVDI training –Chen Xiliang–2009 June12SLIC­LVDI training –Chen Xiliang–2009 JuneIEC 60364§312.2TTL1L2L3NTNoTNS(S:)L1L2L3NPEoTNC(C:PEN)L1L2L3PENITL1L2L313SLIC­LVDI training –Chen Xiliang–2009 June:TTIT::LV/LV14SLIC­LVDI training –Chen Xiliang–2009 June(MLVS)(MCC)()PGLGGD15SLIC­LVDI training –Chen Xiliang–2009 June()16SLIC­LVDI training –Chen Xiliang–2009 JuneIEC 60439­1GB 7251­1997)IEC 60439­1IEC 60439­1“”:17SLIC­LVDI training –Chen Xiliang–2009 June12a2bIEC 60439­118SLIC­LVDI training –Chen Xiliang–2009 June3a3bIEC 60439­119SLIC­LVDI training –Chen Xiliang–2009 June4a4bIEC 60439­120SLIC­LVDI training –Chen Xiliang–2009 June21SLIC­LVDI training –Chen Xiliang–2009 JuneI­LINE IIKSKB/KDP22SLIC­LVDI training –Chen Xiliang–2009 June:IT1SLIC­LVD3 training –Chen Xiliang–2009 June2SLIC­LVD3 training –Chen Xiliang–2009 June::IEC 60364 (GB16895)()3SLIC­LVD3 training –Chen Xiliang–2009 June(ACB)GB14048.2 (idtIEC 60947­2)MasterpactMT, MTE400A6300A,Icu= Ics= Icw150 kA4SLIC­LVD3 training –Chen Xiliang–2009 June(MCCB)GB14048.2 (idtIEC 60947­2)Compact  NSX, NSE16A630AIcu= Ics150 kA5SLIC­LVD3 training –Chen Xiliang–2009 June(MCB)GB10963 (idtIEC 60898)C120, C651A125A ,Icn25 kA,6SLIC­LVD3 training –Chen Xiliang–2009 JuneA:IcwB:Icw7SLIC­LVD3 training –Chen Xiliang–2009 JuneUeInIrQIrImIcw:Icw: In2500A,  Icw12In5kAIn2500A,  Icw30KA8SLIC­LVD3 training –Chen Xiliang–2009 JuneIcu:. Test=O­COIcs:. Test=O­CO­CO(Icm)9SLIC­LVD3 training –Chen Xiliang–2009 June10SLIC­LVD3 training –Chen Xiliang–2009 June11SLIC­LVD3 training –Chen Xiliang–2009 June::12SLIC­LVD3 training –Chen Xiliang–2009 JuneIr= k x InIr­kInt= k1 x Irk1=1.05)1In63A2In63AIt = k2 x Ir(k2=1.3)IrIntIt1hI  IntI13SLIC­LVD3 training –Chen Xiliang–2009 JuneMCBMCCBImImntImtk1*Irk2*IrMic­15% /TMD ­20%Mic+15% /TMD+20%ImImnt/ ImtImntImImtItime14SLIC­LVD3 training –Chen Xiliang–2009 JuneNSX100250TM80D/100D15SLIC­LVD3 training –Chen Xiliang–2009 JuneC65N, C16SLIC­LVD3 training –Chen Xiliang–2009 JuneCTCTCT17SLIC­LVD3 training –Chen Xiliang–2009 JuneMasterpactMTMicrologic5.0,6.0,7.018SLIC­LVD3 training –Chen Xiliang–2009 JuneNSX100250MIC2.2 25019SLIC­LVD3 training –Chen Xiliang–2009 JuneReflex20SLIC­LVD3 training –Chen Xiliang–2009 JuneIr:()Im:()Ii :Icu:t (s)lrlmIcuI (A)t (s)lrlmIcuI (A)li21SLIC­LVD3 training –Chen Xiliang–2009 June(1) IEC60 89820In(M­G = 10~14In)(2)IEC: (IEC 60898)IEC60947­222SLIC­LVD3 training –Chen Xiliang–2009 June=­g :­a :=­IEC 60269:()g =()a =(5In):()gGgMaMnnnIEC 60269223SLIC­LVD3 training –Chen Xiliang–2009 JunegGgM­aM­InfIfItt4lnx lnI24SLIC­LVD3 training –Chen Xiliang–2009 JuneIEC 60947­2IEC 60947­4IEC 60947­3M25SLIC­LVD3 training –Chen Xiliang–2009 JuneLR2­DLC1/LP1­DGV2­ME/RS26SLIC­LVD3 training –Chen Xiliang–2009 JuneMIC MMA(TeSysU)aM27SLIC­LVD3 training –Chen Xiliang–2009 June(aM) +(MA) ++tsIbIqI1~10s20~30mstsIbIq1~10s20~30msI28SLIC­LVD3 training –Chen Xiliang–2009 JuneInAC­12.5 InAC­26 InAC­36 InAC­429SLIC­LVD3 training –Chen Xiliang–2009 JuneIEC1010A203030SLIC­LVD3 training –Chen Xiliang–2009 June1:2231SLIC­LVD3 training –Chen Xiliang–2009 June1:2:232SLIC­LVD3 training –Chen Xiliang–2009 June33SLIC­LVD3 training –Chen Xiliang–2009 June34SLIC­LVD3 training –Chen Xiliang–2009 June35SLIC­LVD3 training –Chen Xiliang–2009 June: 1000: 10­100: 536SLIC­LVD3 training –Chen Xiliang–2009 June37SLIC­LVD3 training –Chen Xiliang–2009 June][)1(-+≥nBqMsdIIKI][)1('-+≥nBqMiIIKIIqM6~7I‘qMIqM2IB(n­1)K1.238SLIC­LVD3 training –Chen Xiliang–2009 JuneIb:Id:1.3 IsdId1.3 IiId1.3 IgIdIrIbMicrologic39SLIC­LVD3 training –Chen Xiliang–2009 Junetr= 0.5~24 stsd= tsd+ttg= tg+tt=0.1~0.2sI2t = on / offI2t = on / offMicrologic40SLIC­LVD3 training –Chen Xiliang–2009 JuneMIC5.0,IbIrIztr= 0.5~16 s1.3 IsdIdtsd= 0~0.4 s ( I2t = on / off )1.3 IiIdNSX41SLIC­LVD3 training –Chen Xiliang–2009 JuneNSXIbIrIz1.3 ImId42SLIC­LVD3 training –Chen Xiliang–2009 JuneIb=1804AIk3=27 kAId=15 kA;MT25H1+ MIC5.0ASCB10­1250, 10/0.4kV,Uk=6%Ik3=27kAId=15kA43SLIC­LVD3 training –Chen Xiliang–2009 June44SLIC­LVD3 training –Chen Xiliang–2009 June1SLIC­LVDI training –Chen Xiliang–2009 June2SLIC­LVDI training –Chen Xiliang–2009 JuneIEC60364­434.2IEC60364­533.2, Ics(Icu)IscIcm()(TN­IT)()I2tK2S23SLIC­LVDI training –Chen Xiliang–2009 JuneIcu(Ics)IscmaxIcuIcsIscmax4SLIC­LVDI training –Chen Xiliang–2009 June5sStS( mm2)Isc( A )t( s )KIscK5SLIC­LVDI training –Chen Xiliang–2009 June/ŸŸŸŸnqqqnqqqqnqqqSscUsc(%)Isc