BOM模板

深圳市瑞虹达电气有限公司SHENZHENRHDELECTRONICSCO.,LTD.REV.DATEITEM客户编码RHDDQ编码中文名称规格型号品牌/供应商供应商编码用量位号备注1M1021313006M1021313006贴片电阻22Ω±1%-0805厚生M10213130061.0000R24《通用工艺规范》2M1021313021M1021313021贴片电阻1K±1%-0805厚生M10213130211.0000R50《通用工艺规范》3M1021313025M1021313025贴片电阻3K±1%-0805厚生M10213130251.0000R44《通用工艺规范》4M1021313030M1021313030贴片电阻5.11K±1%-0805厚生M10213130301.0000R53《通用工艺规范》5M1021313037M1021313037贴片电阻10K±1%-0805厚生M10213130371.0000R46《通用工艺规范》6M1021313042M1021313042贴片电阻24K±1%-0805厚生M10213130421.0000R54《通用工艺规范》7M1021313065M1021313065贴片电阻33K±1%-0805厚生M10213130651.0000R52《通用工艺规范》8M103D316014M103D316014贴片电容102-0805-±10%厚生M103D3160141.0000R56《通用工艺规范》9M103D316015M103D316015贴片电容103-0805-±10%厚生M103D3160152.0000R48,51《通用工艺规范》10M103D316016M103D316016贴片电容104-0805-±10%厚生M103D3160161.0000R55《通用工艺规范》11M1081210007M1081210007贴片稳压二极管15V-1206威华特M10812100071.0000D47《通用工艺规范》12M1081100002M1081100002贴片二极管IN4007-DO-214A威华特M10811000022.0000D3,4《通用工艺规范》13M1012000021M1012000021贴片集成电路UC3844B-SOP8威华特M10120000211.0000U5《通用工艺规范》14M1024214013M1024214013精密金膜电阻1/4w-100Ω±1%卧式千志M10242140131.0000R26《通用工艺规范》15M1024214017M1024214017精密金膜电阻1/4w-390Ω±1%卧式千志M10242140171.0000R34《通用工艺规范》16M1024214020M1024214020精密金膜电阻1/4w-1K±1%卧式千志M10242140201.0000R35《通用工艺规范》17M1024214024M1024214024精密金膜电阻1/4w-2K±1%卧式千志M10242140241.0000R25《通用工艺规范》18M1024214027M1024214027精密金膜电阻1/4w-3.3K±1%卧式千志M10242140271.0000R29《通用工艺规范》19M1024214031M1024214031精密金膜电阻1/4w-5.1K±1%卧式千志M10242140314.0000R27,31,33,37J《通用工艺规范》20M1024214035M1024214035精密金膜电阻1/4w-10K±1%卧式千志M10242140354.0000R11,39,40,41《通用工艺规范》21M1024214039M1024214039精密金膜电阻1/4w-20K±1%卧式千志M10242140392.0000R2,38《通用工艺规范》22M1024214045M1024214045精密金膜电阻1/4w-36K±1%卧式千志M10242140452.0000R3,15《通用工艺规范》23M1024214048M1024214048精密金膜电阻1/4w-51K±1%卧式千志M10242140485.0000R12,30,36,28,42《通用工艺规范》24M1024214054M1024214054精密金膜电阻1/4w-150K±1%卧式千志M10242140542.0000R13,14《通用工艺规范》25M1024214053M1024214053精密金膜电阻1/4w-100K±1%卧式千志M10242140532.0000R17,18《通用工艺规范》文件编号RHDDQ-QP-05-04物料代码Q1020000013BBOM编号BOM000033描述BG11004ZB2020/4/18核定：审核：制作：打印：RHDDQ-QP-05-04BILLOFMATERIAL第1页，共5页深圳市瑞虹达电气有限公司SHENZHENRHDELECTRONICSCO.,LTD.REV.DATEITEM客户编码RHDDQ编码中文名称规格型号品牌/供应商供应商编码用量位号备注文件编号RHDDQ-QP-05-04物料代码Q1020000013BBOM编号BOM000033描述BG11004ZB2020/4/18BILLOFMATERIAL26M1024214055M1024214055精密金膜电阻1/4w-200K±1%卧式千志M10242140551.0000R16《通用工艺规范》27M1024329017M1024329017氧化膜电阻3W-68Ω±5%卧式M10243290171.0000R20《通用工艺规范》28M1024329007M1024329007氧化膜电阻3W-1Ω±5%卧式M10243290071.0000R49《通用工艺规范》29M1024329032M1024329032氧化膜电阻3W-47K±5%卧式M10243290324.0000R9,10,57,58《通用工艺规范》30M1024329036M1024329036氧化膜电阻3W-150K±5%卧式M10243290362.0000RC7,R21RC7电阻架高焊接，引线整形，离PCB板高度8mm《通用工艺规范》31M1023819002M1023819002分流器电阻5W-0.1Ω±1%卧式M10238190021.0000R8《通用工艺规范》32M1024529014M1024529014水泥电阻RX27-5W-470Ω±5%立式M10245290141.0000R1（与K1继电器空隙打黄胶固定，电阻贴平PCB板焊接）《通用工艺规范》33M103H256004M103H256004CBB电容104-63V（100V）M103H2560049.0000C29,31,34,36,38,39,42,43.50《通用工艺规范》34M103H256006M103H256006CBB电容105-63V（100V）M103H2560061.0000C35《通用工艺规范》35M103H256011M103H256011CBB电容105-400VM103H2560111.0000C12《通用工艺规范》36M103H256012M103H256012CBB电容225-400VM103H2560122.0000C8,49《通用工艺规范》37M103H126001M103H126001电解电容1μF-50V-±20%-85℃-Φ5-普通红宝石M103H1260012.0000C40,41《通用工艺规范》38M103H126054M103H126054电解电容10μF-50V-±20%-105℃-Φ5-普通红宝石M103H1260542.0000C13,19《通用工艺规范》39M103I124047M103I124047电解电容47μF-25V-±10%-85℃-Φ5-普通红宝石M103I1240471.0000C54《通用工艺规范》40M103H124013M103H124013电解电容100μF-25V-±20%-85℃-Φ5-普通红宝石M103H1240131.0000C7《通用工艺规范》41M103H124021M103H124021电解电容1000μF-25V-±20%-85℃-Φ10-普通红宝石M103H1240211.0000C32（电容高度不能超过20mm)《通用工艺规范》42M103H124017M103H124017电解电容220μF-25V-±20%-85℃-Φ6.3-普通红宝石M103H1240172.0000C11,21（电容高度不能超过20mm)《通用工艺规范》43M103H226026M103H226026电解电容100μF-400V-±20%-85℃-Φ18-普通红宝石M103H2260264.0000C18,20,47,53电容打黄胶固定《通用工艺规范》44M103H126028M103H126028电解电容470μF-400V-±20%-85℃-Φ35-普通红宝石M103H1260282.0000C5,6电容打黄胶固定《通用工艺规范》45M1030276021M1030276021高压电容222-3KV-TDK威尔达M10302760214.0000C24,22,23,55《通用工艺规范》46M1030276018M1030276018高压电容471-3KV-TDK威尔达M10302760182.0000C9,10《通用工艺规范》47M103H286002M103H286002X2电容474-275VM103H2860022.0000C1,2《通用工艺规范》48M1030266002M1030266002安规电容Y2-472-400VM10302660023.0000C3,C4，一个焊接在R3的丝印端和D47贴片二级管正极间（管脚要套热缩管），注意焊点工艺。《通用工艺规范》49M1082700008M1082700008整流桥BR3510W(8mm)-HYIRM10827000081.0000D1-4贴平PCB板焊接《通用工艺规范》50M1082700011M1082700011整流桥GBJ1010-HYIRM10827000111.0000D11-12《通用工艺规范》核定：审核：制作：打印：RHDDQ-QP-05-04第2页，共5页深圳市瑞虹达电气有限公司SHENZHENRHDELECTRONICSCO.,LTD.REV.DATEITEM客户编码RHDDQ编码中文名称规格型号品牌/供应商供应商编码用量位号备注文件编号RHDDQ-QP-05-04物料代码Q1020000013BBOM编号BOM000033描述BG11004ZB2020/4/18BILLOFMATERIAL51M1082400001M1082400001整流二极管IN4007PaijitM10824000013.0000D5,20,21元件脚及焊点高度不高于1.5mm《通用工艺规范》52M1082300001M1082300001开关二极管1N4148STM10823000012.0000D23,25《通用工艺规范》53M1082600029M1082600029快恢复二极管1.5KE250AM10826000291.0000D22A《通用工艺规范》54M1082210008M1082210008稳压二极管1/2W-5.1VSTM10822100081.0000D6《通用工艺规范》55M1082600008M1082600008快恢复二极管DSEP12-12A赛格M10826000084.0000D7,8,9,10注意防静电措施《通用工艺规范》56M1082600004M1082600004快恢复二极管UF2010赛格M10826000045.0000D13,14,15,16,26《通用工艺规范》57M1082400004M1082400004整流二极管MUR1100PaijitM10824000041.0000D17《通用工艺规范》58M1082600013M1