6[1]PCBA制程工程技术概论与基础_(PEEE)

伟创力校企合作项目培训课程名称：PCBA制程工程技术概论与基础(PE+EE)编写部门：测试工程Name:KhooTeeWanDate:10Jan20102Contents内容PageObjectives目的Page-3Canyouimagineworldwithoutelectronics你能想象世界没有电子的情景吗？Page-4ElectronicsIndustrySectors电子工业部门Page-5ElectronicsIndustryandSMT电子工业和自动粘贴技术Page-6PCBPackagingTypePCB封装方式Page-7WhymixedtechnologyPCBpackaging?为什么有混合的封装方式Page-8SMTandMixedTechnologyAssemblyTypesＳＭＴ和多样的组装技术Page-9GeneralConsiderationsforPCBPackagingＰＣＢ封装考量通择Page-10SurfaceMountTechnology表面粘贴技术Page-13OverviewofSMTProcessSMT制程概述Page-19SolderPrinting锡膏印刷Page-21Pick&PlaceProcess选择和放置零件Page-23Contents3Contents内容PagePostReflowProcess回流焊Page-28WaveSolder波峰焊Page-40WaveSolderandThroughHoleAssemblyProcess波峰焊和插件组装制程Page-44Contents4Bytheendofthismodule,youwillbeableto:•Describeelectronicspackagingandsurfacemounttechnology(SMT)•Comparedifferentassemblytypes•IdentifythedifferentassemblyprocessesformakingthePrintedCircuitBoard(PCB)assembly•IdentifySMTcomponentsObjectives目的到本单元结束时，您将能够：•描述电子产品包装和表面贴装技术（SMT）•比较不同的装配类型•识别不同的装配工艺制造的印制•电路板(PCB）组装SMT元件识别5CanyouimagineaworldwithoutElectronics?你能想象世界没有电子的情景吗？6ElectronicsIndustryComputer&BusinessEquipment•Calculator,PCs,Notebooks,Copiers,Servers,etc.Industrial&MedicalSystems•Controls,Robots,Implants,HearingAids,etc.ConsumerElectronics•VCRs,Camcorders,Audio,Headsets,Games,etc.Automotive•Entertainment,Airbags,ABS,IgnitionControl,etc.Communications•MobilePhones,Pagers,Headsets,LANCards,etc.ElectronicsIndustrySectors电子工业部门计算机和商务设备计算器，电脑，复印机，服务器，等工业和医疗系统控制器。机器人，注入，听力，辅助，等消费电子盒式磁带录像机摄像机音箱耳机游戏，等汽车娱乐安全气囊防抱死制动系统点火控制，等通信电子手机传呼机耳机网卡电子工业7WhatisSurfaceMountTechnology(SMT)?什么是表面贴装技术（SMT）？•Amodernformofcomponentandassemblyprocesstechnology一种现代的元件和组装工艺技术•UsedbyelectronicsindustrytomanufacturePrintedCircuitBoard(PCB)assemblies用于电子工业的印刷电路板（PCB）组装ElectronicsIndustryandSMT电子工业和自动粘贴技术8AlsoreferredtoasInsertionMountTechnology也被称为插入安装技术ElectroniccomponentsareInsertedintoholesinthePCB电子元件插入到PCB的孔里TechnologywhichisaCombinationofSurfaceMountandThroughHoleTechnology这是一种表面贴装和通孔技术的组合ElectroniccomponentsAredirectlyplacedandAttachedtothesurfaceofthePCB.电子元件，直接安置和粘贴到PCB表面PCBAssemblyTypesPCB组装方式9•Unavailabilityofoddshaped,highpower,andspecializedcomponents.奇怪形状，高功率，和一些特殊的元件不能用单一的组装技术。•MoreinvestmentrequiredtosetupafullSMTprocess建立一个全套的SMT制程需要更多的投资。•Inmanycasesitischeapertousethroughholecomponents插件元件在许多情况下是便宜的•THTismorerobustandisnecessaryincertainapplications插件在某些应用中更可靠和必要WhymixedtechnologyPCBassembly?为什么有混合PCB组装技术10SMTandMixedTechnologyAssemblyTypesSMT和混合组装技术类型11ElectricalConsiderations电器考量•PCBassemblydensityPCB组装密度•Powerrequirements电源需求•Powerandsignaldistribution电源和信号分布•Input/Outputrequirements输入输出需要•Noise&Crosstalkbetweentraces,pads,layers,etc.PCB线路之间，焊盘之间,层与层之间的杂讯和共鸣•Hazardousvoltageisolation危险电压的隔绝•Componentselection元件的选择ManufacturingConsiderations生产的考量•Assemblytypeandcomponentmix装配型号和元件的混合•Manufacturingprocesscapability生产制程能力•Boardmaterial板材料•Inter-packageSpacing元件脚间距•Landpatterndesignandfootprintorientation焊环图案设计和器件封装方向•Productvolume产品量GeneralConsiderationsforPCBassemblyPCB组装的一般考量12ThermalConsiderations热考量•Inter-packagespacing元件脚间距•Thermalexpansionmismatch热膨胀系数不匹配•Glasstransitiontemperature玻璃化温度•Processingtemperatures加工温度•Operatingconditions工作条件•Thermalmanagementrequirements热管理要求Costconsiderations成本考量•PCBcostPCB成本•MaterialofthePCB物料成本•NumberoflayersPCBＰＣＢ层数•Tracewidthandspace线路宽度和空间•Viarequirements过孔要求•Specialfinishrequirements特殊表面处理要求•Componentcost元件成本•Assemblyequipmentcost组装成本•Processingcost工艺成本GeneralConsiderationsforPCBAssemblyPCB组装一般考量13MaterialConsiderations物料考量•Materialproperties材料特性•Compatibility兼容性•Applicationrequirements运用需求•Processingrequirements工艺需求•Cost成本•Thermal,electricalandmechanicalperformance/properties热，电气和机械性能/特性OtherConsiderations其他考量•Designfor…设计考量。Manufacture&Assembly制造和组装Test测试Inspection检查Cost成本Procurement采购Service服务Environment环境•Protectionfromenvironmentaldamagecorrosionofcontacts从预防环境损害和接触腐蚀•Connectionfailuresduetoshock,vibrationandflexingofPCBs由于冲击，振动和弯曲的PCB造成的连接失败。•Reliabilityofassembly组装的可靠性•Frictionalwearofconnectors连接器的摩擦磨损•Procurementandleadtime采购和准备时间GeneralConsiderationsforPCBassemblyPCB组装的一般考量14WhySurfaceMountTechnology?为什么有表面粘贴技术•Enablessignificantsizeandweightreduction可显着减少尺寸和重量•Providesimprovementinelectricalperformance改善电气性能•OffersreasonablesolutionforhighpincountICs提供高引脚数集成电路合理的解决方案•Manufacturingassemblyismoreeasilyautomated生产装配更容易自动化•Offersthepotentialforsignificantcostreductions提供了降低成本的巨大潜力SurfaceMountTechnology(SMT)表面粘贴技术(SMT)15SurfaceMountTechnologyPerformance–表面粘贴技术性能•Primemotivationisincreaseddensityandboardareareduction。主要目的是提高板密度和减少面积Smallerdevices(activesandpassives)小体积的主动元件和被动元件DIPsover40pinswereimpractical超过40支脚的插件元件是不切实际的Two-sidedmounting两面粘贴•SMTresultsinabetterproductSMT可以生产出一个更好的产品Samefunctionsforlessspace小的空间可以得到同样的功能Morefunctionsforsamespace同样的空间，跟多的功能Lesselectricalsignaldelays信号延迟少Lessmass,bettervibrationresistance更好的抗震性•InmanycasesSMTwasrequiredtomaketheproductfeasible很多案例中,SMT让产品成为可行SurfaceMountTechnology(SMT)表面粘贴技术(SMT)16•SMT-Amodernformofcomponent&assemblyprocesstechnology,tomanufa