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IntroductiontoFlexibleCircuitMaterialsPresentedby:JonathanC.LimPartII:(~40minutes)簡報大綱•軟性電路板基材之介紹•基材的主要Composition–DielectricSubstrates(絕緣體)–Adhesive(膠質)–Conductor(導體)m簡報大綱(continue)•杜邦產品–壓克力膠系列(ModifiedWAAcrylic)之基材–環亞樹脂膠系列(ModifiedEpoxy)之基材•杜邦料號解說–Pyralux®–Telcam®m軟性電路板之主要基材•CopperCladLaminates(銅箔基材)–Single-SidedC.C.L.(單面銅箔基材)AdhesiveConductorDielectricSubstratem–Double-SidedC.C.L..(雙面銅箔基材)ConductorDielectricSubstrateAdhesive軟性電路板之主要基材m–Adhesive-LessC.C.L..(無膠銅箔基材)DielectricSubstrateConductor軟性電路板之主要基材m•Coverlay(覆蓋膜)軟性電路板之主要基材mDielectricSubstrateAdhesive離型紙AdhesiveKapton•Stiffner(補強材)軟性電路板之主要基材DielectricSubstrateAdhesivem•BondplyDielectricSubstrateAdhesiveAdhesive軟性電路板之主要基材mMylarAdhesiveKaptonAdhesive•SheetAdhesive•PhotoImageableCoverlay(PIC)–DryFilm–Fine-LineApplication•Camera•Automotive•Others軟性電路板之主要基材mDielectricSubstrates•Definition–Abasefilmonwhichtheprintedconductorsarelaid.–Afilmwhichprovideselectricalinsulationbetweenconductors.–Afilmwhichprovidesmechanicalstrengthofthecircuit.m•必備之特性–MechanicalStrength–Flexibility–DimensionalStability–DielectricProperties–ThermalProperties–ChemicalResistance–MoistureAbsorption–CostDielectricSubstratesm•Substrates之種類–Polyimide–Polyester–Fluorocarbon–AramidPaper–CompositeDielectricSubstratesm•Polyimide:–PopularizedbyDuPontunder“Kapton”–AlsoknownasPI–FirstchoiceoffilminmostFPC–Infusibleandflameretardant–HighTg(約260C-280C)–GooddimensionalstabilitySubstratesmSubstrates•Polyester:–PopularizedbyDuPontunder“Mylar”–AlsoknownasPET–Lowestcostdielectricmaterial–Mostlyusedinlow-costconsumerapplication–Goodmechanicalproperties–BadthermalpropertiesmSubstrates•AramidPaper:–SoldunderDuPonttradename“Nomex”–Usedinspecializedapplication–GoodthermalinsulationmaterialmPropertyPolyesterPolyimideFluorocarbonAramidPaperCompositeTensileStrengthExcellentExcellentFairGoodBestFlexibilityExcellentExcellentExcellentGoodFair/GoodDim.StabilityFair/GoodGoodFairGoodFair/GoodDielectricStr.GoodGoodVeryGoodVeryGoodGoodSolderibilityPoorExcellentFairExcellentExcellentC.O.T.(C)105200-230150-180220105-180ThermalExp.LowLowHighModerateLowChem.Resist.GoodGoodExcellentVeryGoodFairMoistureAbsorp.VeryLowHighVeryLowVeryHighLowCostLowHighHighModerateModerateTradeNameMylarKaptonTeflon/TedlarNomexDielectricSubstratesmAdhesive•Definition–Materialthatbondslayerstogether–Thermosetting–ThermoplasticmAdhesive•必備之特性–AdhesionStrength–Flexibility–ChemicalResistance–ThermalResistance–MoistureAbsorption–ElectricalProperties–CostmAdhesive•Adhesive之種類–Polyester–Acrylic–Epoxy–Polyimide–ButyralPhenolicmAdhesive•Polyester:–Usedwherethedielectricisalsopolyester–Usedwherenosolderingisneeded–Typicalapplication:•Instantcamerafilminterconnects•InstrumentclusterconnectioninautomobilesmAdhesive•Acrylic:–Usedindemandingtemperaturerequirementapplication–MostpopularacrylicsystemisPyraluxbyDuPont–ExcellentadhesionmAdhesive•Epoxy:–Widelyusedadhesivesystem–Generallylowercostthanacrylic–Abletostandwavesoldering–Goodinhightemperatureforlongperiodoftime(400to450F)mAdhesive•Polyimide:–Usedinadhesivelesscclandcoverlay–Usedwheredimensionstabilityiscritical–Usedinhightemperatureapplication–HighmoistureabsorptionmAdhesivePolyesterAcrylicEpoxyPolyimideButyralPhenolicTemp.Resist.Chem.Resit.Elec.Prop.AdhesionFlexibilityCostMoistureFairGoodExcellentExcellentExcellentLowFairVeryGoodGoodGoodExcellentVeryGoodGoodGoodGoodGoodGoodExcellentExcellentExcellentGoodGoodGoodGoodGoodGoodModerateFairFairVeryHighPoorFairFairHighModeratePoormConductors/Foil•Majortypesofconductors–Metals–Metalalloys–conductiveinks•Copper(themostcommonlyusedconductorinFPC)–Electrolyticallydepositedcopper(ED)–RolledAnnealedcopper(RA)mConductors/Foil•必備之特性–Current-carryingcapacity–Flexibility–Servicetemperature–Chemicalresistance–Mechanicalstrength–CostmConductors/FoilElectricalPropertiesThermalPropertiesMechanicalPropertiesRelativeCostAluminumCopperGoldNickelSilverExcellentGoodExcellentExcellentExcellentExcellentExcellentExcellentGoodGoodGoodGoodGoodFairFair/GoodFairFairVeryGoodVeryGoodBestm軟板基材製造過程CopperRollKaptonRollCopperCladLaminateHeater1Heater2LiquidAdhesiveAgingmIntroductiontoDuPontProductsmPartIII:(~15minutes)DuPontProductFamily•Pyralux–PyraluxFR–PyraluxLF–PyraluxAP–PyraluxPC•Teclam–TeclamFNC–TeclamDNCPyralux®•FR-series(AcrylicBased)–Copper-CladLaminates•PanelFormPackaging.(24”x36”)•ULApproved.(File#E124294)•VeryGoodFlexureEndurance•Ex.FR9111,FR9110,FR8510,FR8515–Coverlay•RollFormPackaging.(24”x250’)•ULApproved.(File#E124294)•ExcellentDimensionalStability•Ex.FR0110,FR0210mPyralux®•FRcontinue...–SheetAdhesive•RollFormPackaging.(24”x250’)•ULApproved•Ex.FR0100,FR0200–BondPly•RollFormPackaging.(24”x250’)•ULApproved•Ex.FR0111,FR0212mPyralux®•LF-series(AcrylicBased)–MilitarySpecifications–ExcellentFlexureEndurance–VeryGoodforHigh-DensityCircuitry–SameProductOfferingsasFR-series•PC-series(Acrylic,urethane,&imide-based)–DryFilm–PhotoimageableCoverlay–Cameras&AutomotiveApplicationsmPyraluxP/N’sFR9111CuPICu7-Specialconstruction8-1/2oz.C.C.L.9-1ozormoreC.C.L.5-1/2oz.Cu1-1oz.Cu2-2oz.Cu1-1mil