PCB_Dictor

電路板電路板((PCBPCB))字彙整理字彙整理教教育育訓訓練練教教材材僅僅供供內內部部使使用用嚴嚴禁禁翻翻印印(2000.06.07)(2000.06.07)PCB字典流程圖PCBMfg.FLOWCHART流程圖PCBMfg.FLOWCHARTUPDATED:1999,09,01多層板內層流程(INNERLAYERPRODUCT)多次埋孔MultipleBuriedVia徐振連JOHNNYHSU顧客(CUSTOMER)工程製前(FRONT-ENDDEP.)裁板(LAMINATESHEAR)內層乾膜(INNERLAYERIMAGE)預疊板及疊板(LAY-UP)通孔電鍍(P.T.H.)液態防焊(LIQUIDS/M)外觀檢查(VISUALINSPECTION)成型(FINALSHAPING)業務(SALESDEPARTMENT)生產管理(P&MCONTROL)蝕銅(I/LETCHING)鑽孔(PTHDRILLING)壓合(LAMINATION)外層乾膜(OUTERLAYERIMAGE)二次銅及錫鉛電鍍(PATTERNPLATING)蝕銅(O/LETCHING)檢查(INSPECTION)噴錫(HOTAIRLEVELING)電測(ELECTRICALTEST)出貨前檢查(O.Q.C.)包裝出貨(PACKING&SHIPPING)曝光(EXPOSURE)壓膜(LAMINATION)前處理(PRELIMINARYTREATMENT)顯影(DEVELOPIG)蝕銅(ETCHING)去膜(STRIPPING)黑化處理(BLACKOXIDE)烘烤(BAKING)預疊板及疊板(LAY-UP)壓合(LAMINATION)後處理(POSTTREATMENT)曝光(EXPOSURE)壓膜(LAMINATION)二次銅電鍍(PATTERNPLATING)錫鉛電鍍(T/LPLATING)去膜(STRIPPING)蝕銅(ETCHING)剝錫鉛(T/LSTRIPPING)塗佈印刷(S/MCOATING)預乾燥(PRE-CURE)曝光(EXPOSURE)顯影(DEVELOPING)後烘烤(POSTCURE)MLB全板電鍍(PANELPLATING)銅面防氧化處理O.S.P(EntekCu106A)外層製作(OUTER-LAYER)TENTINGPROCESS鍍金手指(G/FPLATING)鍍化學鎳金(E-lessNi/Au)ForO.S.P.選擇性鍍鎳鍍金(SELECTIVEGOLD)印文字(SCREENLEGEND)網版製作(STENCIL)圖面(DRAWING)工作底片(WORKINGA/W)製作規範(RUNCARD)程式帶(PROGRAM)鑽孔,成型機(D.N.C.)底片(MASTERA/W)磁片,磁帶(DISK,M/T)藍圖(DRAWING)資料傳送(MODEM,FTP)AOI檢查(AOIINSPECTION)除膠渣(DESMER)通孔電鍍(E-LESSCU)DOUBLESIDE前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)前處理(PRELIMINARYTREATMENT)全面鍍鎳金(S/GPLATING)雷射鑽孔(LASERABLATION)BlindedVia埋孔鑽孔(I.V.H.DRILLING)埋孔鑽孔(I.V.H.DRILLING)埋孔電鍍(I.V.H.PLATING)埋孔電鍍(I.V.H.PLATING)埋孔(Buriedvia)P1/136*ProcessModule說明:A.下料(CutLamination)a-1裁板(SheetsCutting)a-2原物料發料(Panel)(ShearmaterialtoSize)B.鑽孔(Drilling)b-1內鑽(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射鑽孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔鑽孔(Blind&BuriedHoleDrilling)C.乾膜製程(PhotoProcess(D/F))c-1前處理(Pretreatment)c-2壓膜(DryFilmLamination)c-3曝光(Exposure)c-4顯影(Developing)c-5蝕銅(Etching)c-6去膜(Stripping)c-7初檢(Touch-up)c-8化學前處理,化學研磨(ChemicalMilling)c-9選擇性浸金壓膜(SelectiveGoldDryFilmLamination)c-10顯影(Developing)c-11去膜(Stripping)D.壓合Laminationd-1黑化(BlackOxideTreatment)d-2微蝕(Microetching)Developing,Etching&Stripping(DES)d-3鉚釘組合(eyelet)d-4疊板(Layup)d-5壓合(Lamination)d-6後處理(PostTreatment)d-7黑氧化(BlackOxideRemoval)d-8銑靶(spotface)d-9去溢膠(resinflushremoval)E.減銅(CopperReduction)e-1薄化銅(CopperReduction)F.電鍍(HorizontalElectrolyticPlating)f-1水平電鍍(HorizontalElectro-Plating)(PanelPlating)f-2錫鉛電鍍(Tin-LeadPlating)(PatternPlating)f-3低於1mil(Lessthan1milThickness)f-4高於1mil(Morethan1milThickness)f-5砂帶研磨(BeltSanding)f-6剝錫鉛(Tin-LeadStripping)f-7微切片(Microsection)G.塞孔(PlugHole)g-1印刷(InkPrint)g-2預烤(Precure)g-3表面刷磨(Scrub)g-4後烘烤(Postcure)H.防焊(綠漆):(SolderMask)h-1C面印刷(PrintingTopSide)h-2S面印刷(PrintingBottomSide)h-3靜電噴塗(SprayCoating)h-4前處理(Pretreatment)h-5預烤(Precure)h-6曝光(Exposure)h-7顯影(Develop)h-8後烘烤(Postcure)h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend)h-11噴砂(Pumice)(WetBlasting)h-12印可剝離防焊(PeelableSolderMask)I.鍍金Goldplatingi-1金手指鍍鎳金(GoldFinger)i-2電鍍軟金(SoftNi/AuPlating)i-3浸鎳金(ImmersionNi/Au)(ElectrolessNi/Au)J.噴錫(HotAirSolderLeveling)j-1水平噴錫(HorizontalHotAirSolderLeveling)j-2垂直噴錫(VerticalHotAirSolderLeveling)j-3超級焊錫(SuperSolder)j-4.印焊錫突點(SolderBump)K.成型(Profile)(Form)k-1撈型(N/CRouting)(Milling)k-2模具沖(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜邊(BevelingofG/F)L.短斷路測試(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光學檢查(AOIInspection)l-2VRS目檢(Verified&Repaired)l-3汎用型治具測試(UniversalTester)l-4專用治具測試(DedicatedTester)l-5飛針測試(FlyingProbe)M.終檢(FinalVisualInspection)m-1壓板翹(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包裝及出貨(Packing&shipping)m-4目檢(VisualInspection)m-5清洗及烘烤(FinalClean&Baking)m-6護銅劑(ENTEKCu-106A)(OSP)m-7離子殘餘量測試(IonicContaminationTest)(CleanlinessTest)m-8冷熱衝擊試驗(ThermalcyclingTesting)m-9焊錫性試驗(SolderabilityTesting)N.雷射鑽孔(LaserAblation)N-1雷射鑽Tooling孔(LaserablationToolingHole)N-2雷射曝光對位孔(LaserAblationRegistrationHole)N-3雷射Mask製作(LaserMask)N-4雷射鑽孔(LaserAblation)N-5AOI檢查及VRS(AOIInspection&Verified&Repaired)N-6BlaserAOI(afterDesmearandMicroetching)N-7除膠渣(Desmear)N-8微蝕(Microetching)A/W(artwork)底片Ablation燒溶(laser),切除abrade粗化abrasionresistance耐磨性absorption吸收ACC(accept)允收acceleratedcorrosiontest加速腐蝕acceleratedtest加速試驗acceleration速化反應accelerator加速劑acceptable允收activator活化液activeworkinprocess實際在製品adhesion附著力adhesivemethod黏著法airinclusion氣泡airknife風刀amorphouschange不定形的改變amount總量amylnitrite硝基戊烷analyzer分析儀anneal回火annularring環狀墊圈;孔環anodeslime(sludge)陽極泥anodizing陽極處理AOI(automaticopticalinspection)自動光學檢測applicabledocuments引用之文件AQLsampling允收水準抽樣aqueousphotoresist液態光阻aspectratio縱橫比(厚寬比)Asreceived到貨時backlighting背光back-up墊板bankedworkinprocess預留在製品basematerial基材baselineperformance基準績效batch批betabackscattering貝他射線照射法beveling切斜邊;斜邊biaxialdeformation二方向之變形black-oxide黑化blankcontroller空白對照組blankpanel空板blanking挖空blip彈開blister氣泡;起泡blistering氣泡blowhole吹孔board-thicknesserror板厚錯誤bondingplies黏結層bow;bowing板彎breakout從平環內破出bridging搭橋;橋接BTO(BuildToOrder)接單生產burning燒焦burr毛邊(毛頭)camcorder一體型攝錄放機carbide碳化物carlsonpin定位梢carrier載運劑catalyzing催化catholicsputtering陰極濺射法caulplate隔板;鋼板calibrationsystemrequirements校驗系統之各種要求centerbeammethod中心光束法centralprojection集中式投射線cer