PCB专业用语2828790738

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PCB专业用语一、综合词汇1、印制电路:printedcircuit2、印制线路:printedwiring3、印制板:printedboard4、印制板电路:printedcircuitboard(pcb)5、印制线路板:printedwiringboard(pwb)6、印制元件:printedcomponent7、印制接点:printedcontact8、印制板装配:printedboardassembly9、板:board10、单面印制板:single-sidedprintedboard(ssb)11、双面印制板:double-sidedprintedboard(dsb)12、多层印制板:mulitlayerprintedboard(mlb)13、多层印制电路板:mulitlayerprintedcircuitboard14、多层印制线路板:mulitlayerpritedwiringboard15、刚性印制板:rigidprintedboard16、刚性单面印制板:rigidsingle-sidedprintedborad17、刚性双面印制板:rigiddouble-sidedprintedborad6、聚酯树脂:polyesterresin7、聚酰亚胺树脂:polyimideresin8、双马来酰亚胺三嗪树脂:bismaleimide-triazineresin9、丙烯酸树脂:acrylicresin10、三聚氰胺甲醛树脂:melamineformaldehyderesin11、多官能环氧树脂:polyfunctionalepoxyresin12、溴化环氧树脂:brominatedepoxyresin13、环氧酚醛:epoxynovolac14、氟树脂:fluroresin15、硅树脂:siliconeresin16、硅烷:silane17、聚合物:polymer18、无定形聚合物:amorphouspolymer19、结晶现象:crystallinepolamer20、双晶现象:dimorphism21、共聚物:copolymer22、合成树脂:synthetic23、热固性树脂:thermosettingresin24、热塑性树脂:thermoplasticresin25、感光性树脂:photosensitiveresin26、环氧当量:weightperepoxyequivalent(wpe)27、环氧值:epoxyvalue28、双氰胺:dicyandiamide29、粘结剂:binder30、胶粘剂:adesive31、固化剂:curingagent32、阻燃剂:flameretardant33、遮光剂:opaquer34、增塑剂:plasticizers35、不饱和聚酯:unsatuiatedpolyester36、聚酯薄膜:polyester37、聚酰亚胺薄膜:polyimidefilm(pi)38、聚四氟乙烯:polytetrafluoetylene(ptfe)39、聚全氟乙烯丙烯薄膜:perfluorinatedethylene-propylenecopolymerfilm(fep)18、刚性多层印制板:rigidmultilayerprintedboard19、挠性多层印制板:flexiblemultilayerprintedboard20、挠性印制板:flexibleprintedboard21、挠性单面印制板:flexiblesingle-sidedprintedboard22、挠性双面印制板:flexibledouble-sidedprintedboard23、挠性印制电路:flexibleprintedcircuit(fpc)24、挠性印制线路:flexibleprintedwiring25、刚性印制板:flex-rigidprintedboard,rigid-flexprintedboard26、刚性双面印制板:flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted27、刚性多层印制板:flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard28、齐平印制板:flushprintedboard29、金属芯印制板:metalcoreprintedboard30、金属基印制板:metalbaseprintedboard31、多重布线印制板:mulit-wiringprintedboard40、增强材料:reinforcingmaterial41、玻璃纤维:glassfiber42、e玻璃纤维:e-glassfibre43、d玻璃纤维:d-glassfibre44、s玻璃纤维:s-glassfibre45、玻璃布:glassfabric46、非织布:non-wovenfabric47、玻璃纤维垫:glassmats48、纱线:yarn49、单丝:filament50、绞股:strand51、纬纱:weftyarn52、经纱:warpyarn53、但尼尔:denier54、经向:warp-wise55、纬向:weft-wise,filling-wise56、织物经纬密度:threadcount57、织物组织:weavestructure58、平纹组织:plainstructure59、坏布:greyfabric60、稀松织物:wovenscrim61、弓纬:bowofweave62、断经:endmissing63、缺纬:mis-picks64、纬斜:bias65、折痕:crease66、云织:waviness67、鱼眼:fisheye68、毛圈长:featherlength69、厚薄段:mark70、裂缝:split71、捻度:twistofyarn72、浸润剂含量:sizecontent73、浸润剂残留量:sizeresidue74、处理剂含量:finishlevel75、浸润剂:size76、偶联剂:couplintagent77、处理织物:finishedfabric78、聚酰胺纤维:polyarmidefiber79、聚酯纤维非织布:non-wovenpolyesterfabric80、浸渍绝缘纵纸:impregnatinginsulationpaper81、聚芳酰胺纤维纸:aromaticpolya32、陶瓷印制板:ceramicsubstrateprintedboard33、导电胶印制板:electroconductivepasteprintedboard34、模塑电路板:moldedcircuitboard35、模压印制板:stampedprintedwiringboard36、顺序层压多层印制板:sequentially-laminatedmulitlayer37、散线印制板:discretewiringboard38、微线印制板:microwireboard39、积层印制板:buile-upprintedboard40、积层多层印制板:build-upmulitlayerprintedboard(bum)41、积层挠印制板:build-upflexibleprintedboard42、表面层合电路板:surfacelaminarcircuit(slc)43、埋入凸块连印制板:b2itprintedboard44、多层膜基板:multi-layeredfilmsubstrate(mfs)45、层间全内导通多层印制板:alivhmultilayerprintedboard46、载芯片板:chiponboard(cob)47、埋电阻板:buriedresistanceboard48、母板:motherboardmidepaper82、断裂长:breakinglength83、吸水高度:heightofcapillaryrise84、湿强度保留率:wetstrengthretention85、白度:whitenness86、陶瓷:ceramics87、导电箔:conductivefoil88、铜箔:copperfoil89、电解铜箔:electrodepositedcopperfoil(edcopperfoil)90、压延铜箔:rolledcopperfoil91、退火铜箔:annealedcopperfoil92、压延退火铜箔:rolledannealedcopperfoil(racopperfoil)93、薄铜箔:thincopperfoil94、涂胶铜箔:adhesivecoatedfoil95、涂胶脂铜箔:resincoatedcopperfoil(rcc)96、复合金属箔:compositemetallicmaterial97、载体箔:carrierfoil98、殷瓦:invar99、箔(剖面)轮廓:foilprofile100、光面:shinyside101、粗糙面:matteside102、处理面:treatedside103、防锈处理:stainproofing104、双面处理铜箔:doubletreatedfoil四、设计1、原理图:shematicdiagram2、逻辑图:logicdiagram3、印制线路布设:printedwirelayout4、布设总图:masterdrawing5、可制造性设计:design-for-manufacturability6、计算机辅助设计:computer-aideddesign.(cad)7、计算机辅助制造:computer-aidedmanufacturing.(cam)8、计算机集成制造:computerintegratmanufacturing.(cim)9、计算机辅助工程:computer-aidede49、子板:daughterboard50、背板:backplane51、裸板:bareboard52、键盘板夹心板:copper-invar-copperboard53、动态挠性板:dynamicflexboard54、静态挠性板:staticflexboard55、可断拼板:break-awayplanel56、电缆:cable57、挠性扁平电缆:flexibleflatcable(ffc)58、薄膜开关:membraneswitch59、混合电路:hybridcircuit60、厚膜:thickfilm61、厚膜电路:thickfilmcircuit62、薄膜:thinfilm63、薄膜混合电路:thinfilmhybridcircuit64、互连:interconnection65、导线:conductortraceline66、齐平导线:flushconductor67、传输线:transmissionline68、跨交:crossover69、板边插头:edge-boardcontact70、增强板:stiffener71、基底:substrate72、基板面:realestate73、导线面:conductorside74、元件面:componentsidengineering.(cae)10、计算机辅助测试:computer-aidedtest.(cat)11、电子设计自动化:electricdesignautomation.(eda)12、工程设计自动化:engineeringdesignautomaton.(eda2)13、组装设计自动化:assemblyaidedarchitecturaldesign.(aaad)14、计算机辅助制图:computeraideddrawing15、计算机控制显示:computercontrolleddisplay.(ccd)16、布局:placement17、布线:routing18、布图设计:layout19、重布:rerouting20、模拟:simulation21、逻辑模拟:logicsimu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