PCB印制电路板流程培训教材2(PDF 25)

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VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)200267VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)....VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)BlackOxide(OxideReplacement)(Laying-up/Pressing/InnerDryFilmInnerEtching(DES)InnerBoardCuttingAOIVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)SolderMaskMiddleInspectionPTH/PanelPlating/DryFilmDrillingPatternPlating/Etching/VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)PackingFAHotAirLevellingProfilingComponentMarkFQCVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)InnerDryFilmAOIInnerEtchingBlackOxideLaying-UpPressingorOxideReplacementVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)1515VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)D/FVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)••••VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)/2/2mil3/3mil4.5/4.5mil5.5/5.5mil3/3mil44mil5/5mil6/6milH/Hoz1/1oz2/2oz3/3oz//VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)/)VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ),PTH(Pinkring),PTH.VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)•PINLAM•MASSLAM1.X2.VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)PinLam4Slot4.5prepreq4SLOTSLOTPINVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)(6FoilLaminationCoreLaminationPVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ):Core-lamination,Foil-laminationVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)(CopperFoil),(Prepreg)(Oxidation),VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)•P•P/P•VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)•,,,,•VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)PCB@163.net

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