PCB流程-内层制作(PDF 35)

franklu628
6 ℃
2019-01-25

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(GuangZhou)LimitedChaoyang.song@viasystems.com(GuangZhou)LimitedInnerBoardCuttingResistsLamination/RollerCoating/ChemicalCleanBakingInnerMiddleInspectionPEPunchingExposureDES/InnerOxide/Laying-UpPressing(GuangZhou)Limited¾MI48X36,48X4048X42(GuangZhou)Limited¾:1505hrs(GuangZhou)Limited¾/1)2)(GuangZhou)Limited¾1515(GuangZhou)Limited¾DES/Developing(Etching(Stripping((GuangZhou)Limited¾AOIAOI(GuangZhou)LimitedAOI(GuangZhou)LimitedAOI(GuangZhou)Limited¾/¾/(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)Limited//InnerOxide/InnerEtchingMainDefectsProcess(GuangZhou)Limited/-(Open)(GuangZhou)Limited/-(Short)short(GuangZhou)Limited/-(GuangZhou)Limited/AOI/DES9033-PC2008/HCLNaOHDES/(GuangZhou)Limited1milAccuracyPEPunching1/3OZ~3OZBaseCopperFoilInnerEtching7mil10milClearance4L)Clearance(6L)1.5milLayertoLayerRegistration3/3milMinLineWidth/Spacing/InnerImageTransferDataItemProcess(GuangZhou)Limited@163.netOICQ13985548(GuangZhou)Limited-(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)LimitedCore)(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)Limited(Core)(GuangZhou)LimitedDESDES(GuangZhou)LimitedDES(Core)(GuangZhou)LimitedDESCore)(GuangZhou)LimitedDESCore)(GuangZhou)LimitedDESCore)