PCB工程问客

CommonQueryI.Boardthickness1.Lay-up2.Mismatchbetweenthelay-upboardthicknesses3.RelaxboardthicknesstoleranceII.CarboninkIII.Cuthickness&Pad1.AddCuclearanceforNPTHorconsider2nd-drill2.Adddummypattern3.Copperclosetoboardedge4.Copperextendingtounitedge5.DeleteNPTHpad6.Distancebetweentwopadslessthan4mil7.Isolatedfiducialmark8.Nospacetoenlargepadstoensure2milannualring9.Padsizeistoosmall10.PTHholewithellipticpad11.RelaxCuthicknessonouterlayer12.RelaxCuthicknessonouterlayerIV.DWG1.LabelinDWGisundefined2.NoDWGwithdimension3.UnitDWGsizeissmallV.Generalcriteria1.Commoncriteria2.E/Tstamp3.Ourlogo4.X-outVI.Goldfinger1.Deletesoldermaskbridgebetweengoldfingers2.Relaxtoleranceforbevelsize3.Relaxbevelingangleordisregardtheremainingthickness4.Spacebetweengoldfingeredgeandoutlineistoonarrow5.SpacebetweentestpadandthetopofgoldfingeristoonarrowVII.Hole1.Blind/buriedhole2.Breakawayholeispartiallyoncopperplane3.Changeoverlappedholeasslot4.Drillingpositionaltolerance5.RelaxtoleranceforNPTH6.RelaxtoleranceforPTH7.Repeatedhole8.Routinghole9.RectangularholeVIII.Impedance1.Calculatedvaluetrendstothelimit2.Matchimpedance3.Referenceplane4.WhichtraceshouldbecontrolledIX.InnercornerRightangleX.Outlinedimension1.Connectiontabfarawayfromunitedge2.MismatchbetweenCAD/CAMdataandDWG3.Missdimension4.Narrowconnectionareabetweenbreakawayholes5.Notoolinghole6.Relaxtoleranceforoutlinedimension7.Uneventolerance8.Uselessdimension9.AddovershootXI.PackingXII.Peelablesoldermask1.Peelablesoldermaskcoveredhole2.Peelablesoldermaskpluggedhole3.Relaxthicknessforpeelablesoldermask4.WithoutthedetaildimensionofpeelablesoldermaskXIII.Silkscreen1.Markinginholeorpad2.Markinginlargesoldersurface3.LegendonstepareaXIV.Slot1.Relaxtolerancefornon-platedslot2.RelaxtoleranceforplatedslotXV.Soldermask1.AddS/MBridgeforSMT2.ChangeS/Mpluggedholetocoveredhole3.Holesizeistoolargetoplug4.Holesizeistoosmalltocover5.Relaxsoldermaskthickness6.S/Mcovergoldfinger7.Soldermaskmaterial8.SpacingistoonarrowtoaddS/MBridgeXVI.SolderthicknessRelaxsolderthicknessXVII.TABWithoutTABononerowofunitsatthecenterXVIII.TgTgvalueisnotspecifiedforHighTgmaterialXIX.Trace1.ConnectionbetweenCugroundsistoothin2.Exposedtracefromsoldermaskopening3.Relaxetchingtolerance4.Self-spacing5.SpacingbetweentwotracesistoonarrowXX.TransferboardSampleapprovalXXI.V-Cut1.DiscontinuousV-Cut2.RelaxV-Cutremainthicknesstolerance3.RelaxV-Cutgrooveangletolerance4.V-Cutremainthicknessistooweak5.V-CutrunacrossBATXXII.WarpageRelaxwarpageI.板厚1.排板结构2.排板结构和板厚要求不一致3.释放板厚公差II.碳油III.铜厚&Pad1.为考虑二次钻孔的NPTH加Cuclearance2.加dummypattern3.铜距板边太近4.铜延伸至单元边5.删除NPTH的PAD6.相邻两PAD距离小于4mil7.独立Fiducialmark8.没有足够的空间来加大PAD以保证2mil焊锡圈9.Pad尺寸太小10.有椭圆PAD的PTH孔11.释放孔壁铜厚12.释放外层铜厚IV.DWG1.图纸标记不明2.没有标注尺寸的图纸3.单元图尺寸太小V.常规Query1.普通标准2.E/T印3.公司logo4.单元报废VI.金手指1.删除金指间的绿油桥2.释放斜边尺寸公差3.释放斜边角度或忽略残留厚度4.金指边离外围太近5.测试PAD离金指顶部太近VII.孔1.盲/埋孔2.折断孔部分在铜面上3.改重孔为槽4.钻孔位置公差5.释放NPTH公差6.释放PTH公差7.重孔8.锣孔9.矩形孔VIII.阻抗1.阻抗计算值偏向上/下限2.匹配阻抗3.阻抗参考面4.哪一条线要求控制阻抗IX.内角内角为直角X.外形尺寸1.相连TAB远离单元边2.CAD/CAM数据与DWG不一致3.缺少尺寸4.折断孔连接区域太窄5.没有工具孔6.释放外形尺寸公差7.孔到孔公差不对称8.无用尺寸9.加OvershootXI.包装要求XII.Peelablesoldermask1.蓝胶盖孔2.蓝胶塞孔3.释放蓝胶厚度4.缺少蓝胶详细尺寸XIII.丝印1.白字入孔/上PAD2.白字上大锡面3.白字部分在铜面上部分在基材上XIV.槽1.释放非电镀槽公差2.释放电镀槽公差XV.绿油1.为SMT加绿油桥2.改绿油塞孔为盖孔3.孔太大不便绿油塞孔4.孔太小不便绿油盖孔5.释放绿油厚度6.绿油盖金指7.绿油材料8.间距太小不便加绿油桥XVI.铅锡厚度释放铅锡厚度XVII.TAB单元间无TABXVIII.Tg高Tg材料的Tg值未指明XIX.导线1.两个Cuground间连接太小2.绿油开窗露线3.释放蚀刻公差4.线路自身间距太小5.线间太窄XX.转板样板转生产板XXI.V-Cut1.跳V-Cut2.释放V-Cut残留厚度公差3.释放V-Cut槽角度公差4.V-Cut残留厚度太小5.V-Cut穿过BATXXII.板曲释放板曲I.Boardthickness1.Lay-upInDWG,customermentionedlayerorderonly,butdidn'tindicatethedielectricthicknessbetweenlayersandCopperthickness.So,wesuggestyoufollowthelay-upshownonattachedfileXX.Pleaseconfirm.2.Mismatchbetweenthelay-upandboardthicknessAccordingtothelay-upspecifiedbycustomer,theoverallboardthicknesswillbeXXXmil,notthecustomernominalrequirementofYYYmil.So,wesuggest:A).Tofollowthelay-upspecifiedbycustomerandchangetheoverallboardthicknesstoYYYmil+/-10%,ORB).Tomodifythelay-upasshownonattachedfileandcontroltheoverallboardthicknesstobeXXXmilpercustomerrequirement.Pleaseclarifywhichitem(AorB)customerpreferred.3.RelaxboardthicknesstoleranceCustomerrequiredcontrollingthefinishedboardthicknesstobeXX%,however,thestandardtoleranceforboardthicknessis+/-10%.Wecanachievetightertolerancebyorderingnon-standardmaterials,however,itwilltakealonglead-timeandahighpricetopurchasethisspecialmaterial.So,wesuggestyourelaxthetolerancefromXX%to+/-10%.Pleaseconfirm.II.CarboninkAccordingtomasterA/W,carboninkwillbeprintedoncontactfinger.Whilethecarbon/carbonisolationspacingistoonarrow:ItemMasterA/WOurcapabilityCarbon/carbonisolationspacing:Xmil14milCarbonwidth:Ymil12mil(min)Cufingerwidth:UmilNILCarbon/Cuoverlapping:Zmil6mil(min)Carbonmisregistration:+/-Xmil+/-5milInordertofacilitateinproduction,wesuggestyoumodifymasterA/Wasbelow:ItemonMasterA/WChangetoCarbon/carbonisolationspacing:XmilCarbonwidth:YmilCufingerwidth:UmilCarbon/Cuoverlapping:ZmilPleaseconfirm.III.Cuthickness&Pad1.AddCuclearanceforNPTHorconsider2nd-drillStraightmatterThenon-platedholelocatedingroundplane