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Tru-LonPrintedCircuits(Royston)LimitedCapabilityandDesignGuidelinesIssue5DatedMarch2002Page1of7CompanyConfidentialCircuitConstraintsPCBSizesPCBSize:23.00x23.00max(FR4PTH)StandardCustomerSpecific,pleaseenquire.SpecialPCBThickness:0.4,0.6,0.8,1.6,2.4,3.2mmStandardCustomerSpecific,pleaseenquire.SpecialPCBTypesSingleSidedDoubleSidedMultilayer(includingsequentialbuild)&blindviaholesFlexibleFlex-rigid(includingMultilayer)Thicknon-ferrousmetalcladdings(includingCMC&CICandAluminium)PTFE&HybriddielectriccombinationsHybridAntennasystemswithorwithoutfoamcoresormachinedfeatures.MaterialsFR4LaminatethicknessMultilayerCores:2.5,4,5,6,8,10,12,14,16,18,20,24,28–thou(mil)(0.06,0.10,0.13,0.15,0.20,0.25,0.30,0.35,0.40,0.45,0.50,0.60,0.70–mm)PTHMaterial:32,39,47,63–thou(mil)(0.8,1.0,1.2,1.6–mm)Special:95,126–thou(mil)(2.4,3.2–mm)ForthinnerPTHMaterialuseM/Lcore=16thou(mil)(0.4mm)•Variationsonlaminatethicknesscanbelaminatedinhouse.FR4PrepregthicknessOtherBondMediaTypeThicknessDKTS/TPPre-PregTypeBondedThicknessSpeedboardC1.5thou2.59T/SArlon67001.5thou2.35T/P76287.0thou(mil)=0.180mmArlon62501.5thou2.32T/P.1-3.5T/P21132.5thou(mil)=0.063mmRogers30011.0thou2.28T/P10602.2thou(mil)=0.055mmFusionBondingofPTFElayers(e.gRogersRT6002)No-flowpre-preg3.8thouCopperWeightsCopperWeightThicknessCategory5micronStandard_oz9micronStandard1/3oz12micronStandard_oz17.5micronStandard1oz35micronStandard2oz70micronStandard3oz105micronSpecialMixedCoresAvailableSpecialTru-LonPrintedCircuits(Royston)LimitedCapabilityandDesignGuidelinesIssue5DatedMarch2002Page2of7CompanyConfidentialLaminateTypesTypeTgoCDielectricConstantCategoryBeforeBondingAfterBondingFR-41434.53.85StandardMultifunctional1404.53.85StandardMultifunctional(highTg)1854.33.85StandardBTEpoxy180Polyimide(rigid)2604.2SpecialPTFEalternatives2803.43.38StandardFlexPolyimide2203.2StandardPTFE3.6-3.9TechnicalFlexibleMaterialsExtrudedPolyimideDoubleSidedandSingleSidedFlexibleMaterials*BaseThickness1,2,3–thou(mil)StandardModifiedAcrylic/Epoxy/PolyimideAdhesives(25,50,75–micron)&AdhesivelessSystems.CopperWeights0.5-1oz(17.5,35micron)otherweightsavailablesubjecttoContractReview.CoverlayersBaseThickness1,2,3–thou(mil)StandardModifiedAcrylic/Epoxy/PolyimideAdhesive(25,50,75–micron)Systems.*Polyestermaterialsarealsoavailableinsimilardimensionalspecificationsbutnotforplatedthroughhole.PCBFeaturesTrackWidthsandGapsMinimumTrackWidthMinimumGapInnersOutersCategory6thou(mil)=0.15mm6thou(mil)=0.15mmMax1ozMax1ozStandard4thou(mil)=0.10mm4thou(mil)=0.10mmMax1ozMax1ozSpecial3thou(mil)=0.076mm3thou(mil)=0.076mmMax1ozMax1ozSpecial(Tech)TightergapscanbeachievedonaspecialbasissubjecttoContractReview.HoleTypesThickMetalLayersMicroblindviaBlindviaBuriedviaPlatedthroughholeTru-LonPrintedCircuits(Royston)LimitedCapabilityandDesignGuidelinesIssue5DatedMarch2002Page3of7CompanyConfidentialVia/HoleSizesMinimumHoleSizeDrilledMinimumHoleSizePlatedAspectRatioCategory0.40mm0.30mmMax15:1Standard0.20mm0.10mmMax12:1SpecialSpecialVias/HolesHoleTypeDrilledSize(min)PlatedSize(min)CategoryBuriedVia/Hole0.35mm0.25mmStandardBuriedVia/Hole0.25mm0.15mmSpecialBlindVia0.35mm0.25mmStandard*BlindVia0.25mm0.15mmSpecial**AspectRatioofatleast1:1(DrilledwidthtoDepth)mustbemaintainedunlessasequentialbuildisrequired.Toleranceoncontrolleddepthholes+/-0.002”SmallerholescanbeproducedboththroughablatedorblindutilisingourUVYagLasermachine.AnnularRingandFeatureClearancesCross-sectionafterplating.TracktoFeatureClearancesSolderResistandLegendSolderResistSolderResist–ShipleyRonalOPSR5600GDAColour-Green(othercoloursavailable)NominalThickness30microns(min18microns)LegendPhoto-imagableorsilkscreenminresolutionof4thou(mil).Distancetopads4thou.CoreCoreLayer1Layer2Layer3Layer5Layer4Layer612AnnularRing5thouannularringoverdrilledholesize.21Clearance10thouclearanceringoverdrilledholesize.Minimumof4thouclearancebetweenpadandtrack.Minimumof9thouclearancebetweenholeandtrack.Tru-LonPrintedCircuits(Royston)LimitedCapabilityandDesignGuidelinesIssue5DatedMarch2002Page4of7CompanyConfidentialStandardcolour–White/Yellow/Black/Red.Thicknesstypically35micron.PeelMaskNominalThickness12thou(mil),min8thou(mil)-tent4.00mmholemax.SolderResistRegistrationSolderDam(A)Minimum4thou(mil)SolderResistClearanceMinimum3thou(mil)SolderResistRegistration+-3thou(mil)SolderableFinishesandPlatingAllfinishescanbeverifiedbytheapplicationofX-Rayfluorescencemeasurementsinhouse.FinishThicknessCopper(withanti-tarnish)25micron(0.001thou)overbasecopperElectrolessNickel/ImmersionGold3-10micronNickel0.02-0.1micronImmersionGoldPalladium0.1-0.3micronEntek(OSP)0.3micronElectrolessNickel/Palladium/Gold3.0-5.0micronNickel,0.2-0.3micronPalladium,(UniversalFinishsuitedforbothwire0.02-0.05micronGold.bondingandSMTtechnology).HotAirSolderLevel10-15micronTab/DeepHardGold1.0-3.5micronporefreeNickelSulphamate/PureSoftGold3.0/1.0-3.5micronsrespectively.PureGoldovercopper1.0-3.5micronswhenselectivelyplatedSterlingSilver0.2-0.3micronsovercopperElectrolyticSilver4.0microns(designlimitationssubjecttoContractReview)ABTru-LonPrinted
本文标题:PCB工艺及材料介绍(PDF7)英文
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