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*ProcessModule说明:A.下料(CutLamination)a-1裁板(SheetsCutting)a-2原物料发料(Panel)(ShearmaterialtoSize)B.钻孔(Drilling)b-1内钻(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射钻孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔钻孔(Blind&BuriedHoleDrilling)C.乾膜制程(PhotoProcess(D/F))c-1前处理(Pretreatment)c-2压膜(DryFilmLamination)c-3曝光(Exposure)c-4显影(Developing)c-5蚀铜(Etching)c-6去膜(Stripping)c-7初检(Touch-up)c-8化学前处理,化学研磨(ChemicalMilling)c-9选择性浸金压膜(SelectiveGoldDryFilmLamination)c-10显影(Developing)c-11去膜(Stripping)D.压合Laminationd-1黑化(BlackOxideTreatment)d-2微蚀(Microetching)d-3铆钉组合(eyelet)d-4叠板(Layup)d-5压合(Lamination)d-6后处理(PostTreatment)d-7黑氧化(BlackOxideRemoval)d-8铣靶(spotface)d-9去溢胶(resinflushremoval)E.减铜(CopperReduction)e-1薄化铜(CopperReduction)F.电镀(HorizontalElectrolyticPlating)f-1水平电镀(HorizontalElectro-Plating)(PanelPlating)f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)f-3低於1mil(Lessthan1milThickness)f-4高於1mil(Morethan1milThickness)f-5砂带研磨(BeltSanding)f-6剥锡铅(Tin-LeadStripping)f-7微切片(Microsection)G.塞孔(PlugHole)g-1印刷(InkPrint)g-2预烤(Precure)g-3表面刷磨(Scrub)g-4后烘烤(Postcure)H.防焊(绿漆):(SolderMask)h-1C面印刷(PrintingTopSide)h-2S面印刷(PrintingBottomSide)h-3静电喷涂(SprayCoating)h-4前处理(Pretreatment)h-5预烤(Precure)h-6曝光(Exposure)h-7显影(Develop)h-8后烘烤(Postcure)h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend)h-11喷砂(Pumice)(WetBlasting)h-12印可剥离防焊(PeelableSolderMask)I.镀金Goldplatingi-1金手指镀镍金(GoldFinger)i-2电镀软金(SoftNi/AuPlating)i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)J.喷锡(HotAirSolderLeveling)j-1水平喷锡(HorizontalHotAirSolderLeveling)j-2垂直喷锡(VerticalHotAirSolderLeveling)j-3超级焊锡(SuperSolder)j-4.印焊锡突点(SolderBump)K.成型(Profile)(Form)k-1捞型(N/CRouting)(Milling)k-2模具冲(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜边(BevelingofG/F)L.短断路测试(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光学检查(AOIInspection)l-2VRS目检(Verified&Repaired)l-3泛用型治具测试(UniversalTester)l-4专用治具测试(DedicatedTester)l-5飞针测试(FlyingProbe)M.终检(FinalVisualInspection)m-1压板翘(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包装及出货(Packing&shipping)AbieticAcid松脂酸.AbrasionResistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).AcImpedance交流阻抗.AcceleratedTest(Aging)加速老化(试验).Acceleration速化反应.Accelerator加速剂,速化剂.Acceptability,Acceptance允收性,允收.AccessHole露出孔,穿露孔.Accuracy准确度.AcidNumber(AcidValue)酸值.AcousticMicroscope(AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).ActinicLight(orIntensity,orRadiation)有效光.Activation活化.Activator活化剂.ActiveCarbon活性炭.ActiveParts(Devices)主动零件.Acutance解像锐利度.AdditionAgent添加剂.AdditiveProcess加成法.Adhesion附着力.AdhesionPromotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.AirInclusion气泡夹杂.AirKnife风刀.Algorithm算法.AliphaticSolvent脂肪族溶剂.AluminiumNitride(AlN)氮化铝.AmbientTamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.AnalogCircuit/AnalogSignal模拟电路/模拟讯号.AnchoringSpurs着力爪.AngleofContack接触角.AngleofAttack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal韧化(退火).AnnularRing孔环.Anode阳极.AnodeSludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-FoamingAgent消泡剂.Anti-pitAgent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(AcceptableQualityLevel)允收品质水准.AramidFiber聚醯胺纤维.ArcResistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.AspectRatio纵横比.Assembly组装装配.A-stageA阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****BackLight(BackLighting)背光法.BackTaper反锥斜角.Backpanels,Backplanes支撑板.Back-up垫板.BalancedTransmissionLines平衡式传输线.BallGridArray球脚数组(封装).Bandability弯曲性.BankingAgent护岸剂.BareChipAssembly裸体芯片组装.Barrel孔壁,滚镀.BaseMaterial基材.BasicGrid基本方格.Batch批.Baume波美度(凡液体比重比水重则Be=145-(145÷Sp.Gr)凡液体比重比水轻则Be=140÷(Sp.Gr-130)*Sp.Gr为比重即同体绩物质对纯水1g/cm的比值).Beamlead光芒式的平行密集引脚.Bed-of-NailTesting针床测试.BellowsConact弹片式接触.BetaRayBackscatter贝他射线反弹散射.Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-LevelStencil]双阶式钢板.Binder粘结剂.Bits头(DrillBits).BlackOxide黑氧化层.Blanking冲空断开.Bleack漂洗.Bleeding溢流.BlindViaHole肓通孔.Blister局部性分层或起泡.BlockDiagram电路系统块图.Blockout封纲.Blotting干印.BlottingPaper吸水纸.BlowHole吹孔.BluePlaque蓝纹(锡面钝化层).BlurEdge(Circle)模糊边带(圈).BombSight弹标.BondStrength结合强度.Bondability结合性.BondingLayer结合层接着层.BondingSheet(Layer)接合片.BondingWire结合线.Bow,Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条).在425℃~870℃下进行熔接的方式).BreakPoint显像点.Break-awayPanel可断开板.BreakdownVoltage崩溃电压.Break-out破出.Bridging搭桥.BrightDip光泽浸渍处理.Brightener光泽剂.BrownOxide棕氧化.BrushPlating刷镀.B-stageB阶段.BuildUpProcess增层法制程.Build-up堆积.Bulge鼓起.Bump突块.BumpingProcess凸块制程.Buoyancy浮力.BuriedViaHole埋导孔.Burn-in高温加速老化试验.Burning烧焦.Burr毛头.BusBar汇电杆.ButterCoat外表树脂层.*****C*****C4ChipJointC4芯片焊接.Cable电缆.CAD计算机辅助设计.CalenderedFabric轧平式纲布.CapLamination帽式压合法.Capacitance电容.CapacitiveCoupling电容耦合.CapillaryAction毛细作用.Carbide碳化物.CarbonArcLamp碳弧灯.CarbonTreatment,Active活化炭处理.Card卡板.CardCages/CardRacks电路板构装箱.CarlsonPin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.CatalyzedBoard,CatalyzedSubstrate催化板材.Catalyzing催化.Cathode阴极.Cation阴向离子,阳离子.CaulPlate隔板.Cavitation空泡化半真空.Center-to-CenterSpacing中心间距.Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.CharacteristicImpedance特性阻抗.Chase纲框.CheckList检查清单.Chelate螯合.ChemicalMilling化学研磨.ChemicalResistance抗化性.Chemisorption化学吸附.Chip芯片(粒).ChipInterconnection芯片互连.ChiponBoard芯片粘着板.ChipOnGlass晶玻接装(COG).Chisel钻针的尖部.ChlorinatedSolvent含氯溶剂,