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PCB板专业词汇BbBackplane背板Back-up垫板Baking烘板BallGridArray(BGA)球栅阵列Bareboard裸板BaseCopper底铜Basematerial基材Bevelling斜边BlackOxide黑氧化Blindviahole盲孔Blistering起泡/水泡BoardCutting开料BoardThickness板厚Bottomside底层Breakawaytab打断点Brushing磨刷Build-up积层Bulletpad子弹盘Buriedhole埋孔CcC/M(ComponentMarking)元件字符Carbonink碳油Carrier带板Ceramicsubstrate陶瓷CertificateofCompliance合格证书Chamfer倒角Chemicalcleaning化学清洗Chemicalcorrosion化学腐蚀ChipScalePackage(CSP)晶片比例包装Circuit线路Clearance间距/间隙Color颜色ComponentSide(C/S)元件面Compositelayers复合层ComputerAidedDesign(CAD)电脑辅助设计ComputerAidedManufacturing(CAM)电脑辅助制作ComputerNumerialControl(CNC)数控Conductor导体Conductorwidth/space导体线宽/线隙Contact接点Copperarea铜面积Copperclad铜箔Copperfoil铜箔Copperplating电镀铜Corner角线Cornermark板角记号CornerREG.Hole角位对位孔Cracking裂缝Creasing皱折Criteria规格,标准Crossectionarea切面Cu/SnPlating镀铜锡Currentefficiency电流效率Customer客户CustomerDrillingFile客户钻孔资料CustomerP/N客户产品编号DdD/FRegistrationHole干菲林对位孔D/F(DryFilm)干膜DateCode日期代号Datumhole基准参考孔Daughterboard子板Deburring去毛刺Defect缺陷Definition定义Delamination分层Delay耽搁Delivery交货Densitometer透光度计Density密度Department部门Description说明Designorigin设计原点Desmear去钻污,除胶Dessicant防潮珠Developer显影液,显影机Diamond钻石Diazofilm重氮片Dielectricbreakdown介电击穿Dielectricconstant介电常数DielectricThickness介电层厚度DielectricVoltageTest绝缘测试Dimension尺寸Dimensionalstability尺寸稳定性Direct/indirect直接/间接Distribution发放Documenttype文件种类DocumentationControl文件控制Doublesidedboard双面板Drillbit钻咀Drilling钻孔DrillingRoughness钻孔粗糙度DryFilm干菲林DryFilm-Pattern干膜线路Dynamic动态EeECN(EngineeringChangeNotification)工程更改通知Effectivedate有效期ElectricalTestFixture电测试针床Electromigration漏电Electroconductivepaste导电胶Electroless无电沉Electrolesscopper无电沉铜ElectrolessNi无电沉镍ElectrolessGold/Au无电沉金Engineeringdrawing工程图纸Entek有机涂覆Epoxyglasssubstrate环氧玻璃基板Epoxyresin环氧基树脂Etch蚀刻Etchback凹蚀Etching蚀刻E-TestMarking电测试标记E-Test(ElectricalTest)电测试Exposure曝光Externallayer外层FfFiducialmark基准点Filling填充FilmFabrication菲林制作FinalQC最终检查FinishOverallBoardThickness成品总板厚度Fixture夹具Flammability可燃性FlashGold薄金Flexible易曲的,能变形的Flux助焊剂GgGeneralinformation一般资料Ghostimage重影Glasstransitiontemperature玻璃化湿度GoldFinger(G/F)金手指Goldenboard金板Grid网格Groundplane地线层HhHAL(HotAirLeveling)热风整平HandRout手锣Hardness硬度HeatSealed热密封HeatShrink-warp热收缩Holdingtime停留时间Hole孔Holebreakout破环Holedensity孔的密度HoleDiameter孔径Holelocation孔位HoleLocationChart孔位座标表HolePositionTolerance孔位误差Holesize孔尺寸HotAirLeveling(HAL)热风整平Humidity湿度IiIdentification标识,指标Image影像Imagingtransfer图形转移Impedance阻抗ImpedanceTest阻抗测试Innercopperfoil内层铜箔Inspection检验InsulationresistanceTest绝缘测试InterPlaneSeparation内层分离InterleavePaper隔纸Internallayer内层Internalstress内应力Ioniccleanliness离子清洁度Isolation孤立IsolationResistance绝缘电阻Item项目KkKEYboard按键盘Keyslot槽孔Kraftpaper牛皮纸LlLaminate板材LaminateThickness材料厚度Laminationvoid层间空洞Landlesshole破孔Laserplotter激光绘图机Laserplotting激光绘图Laserviahole激光穿孔Layup层压配本Lay-upInstruction压板指示Legend字符LegendWidth字符宽度Length长度LiftedLands残铜LineWidth线宽Liquid液体Location位置Logicdiagram逻辑图形Logo唛头,标记Lotsize批卡MmMark标记Masterdrawing菲林图形MaterialThickness材料厚度MaterialType材料类型Max.X-out坏板上限Max.BoardThicknessAfterPlating电镀后总板厚度之上限Measling白斑MechDrawingNo.图纸编号Mechanicalcleaning机械清洗Metal金属Method方法MI(ManufacturingInstruction)生产制作指示Microstrip微条线MinConductorCopperThickness最小线路铜厚MinHoleWallCopperThickness最小孔壁铜厚Min.GoldPlatingThickness最小金厚Min.NickelThickness最小镍厚Min.Tin-LeadThickness(AfterHAL)（喷锡后）最小锡厚Min.AnnularRing最小环宽Min.SpacingbetweenLinetoLine线与线之间的最小距离Min.SpacingbetweenLinetoPad线与焊盘之间的最小距离Min.SpacingbetweenPadtoPad焊盘与焊盘之间的最小距离Minimum最小Mirroring镜像Missing缺少ModelNo.产品名称Molded模塑Motherboard主板Moulding模房Mountinghole安装孔Multilayer多层板Multi-layerLaminate多层板材料NnNegative反面的Netlist网络表Network网络Nick缺口No.ofholes孔数No.ofArray/Panel每个拼板套板数No.ofPanelperStack每叠板数No.ofPanel/Sheet每张大料拼板数No.ofPcsPerBag每包数量No.ofUnit/Array每套单元数Normalvalue标准值OoOblong椭圆形的Offset偏移Open/short开路/短路Optimization(design)最佳化(设计)OrganicSolerabilityPeservatives(OSP)有机保护剂Originator原作者Outercopperfoil外层铜箔Outline外形PpPacking包装Packing包装Pad焊盘PanelArea拼板面积PanelPlatedCrack板镀缺口Panelplating整板电镀PanelSize拼板尺寸PanelSizeAfterOuterlayerCutting外层切板后拼板尺寸PanelUtilization拼板利用率Passrate通过率Passivation钝化Pattern线路PatternInspection线路检查Patternplating图形电镀PCB(PrintedCircuitBoard)印制线路板Peckdrilling啄钻Peelstrength剥离强度Peelable可剥性Peelable剥离强度PeelableMask可脱油Peeling剥离Permanent永久性PHvaluePH值Photoplotting图形输出Photoviahole菲林过孔Photographers照片靶标Photoplotler光绘机Physical物理的Pinhole销定孔Pinkring粉红环Pinninghole钻孔管位Pitch间距Placement放置PlatedThoughHole(PTH)沉铜Plating电镀PlatingCrack电镀裂缝Platingline电镀线Platingrack电镀架PlatingVoid电镀针孔PlugHole塞孔Polymer聚合体Porosity孔隙率Positive绝对的Powerplane电源层Prepreg半固化片Primaryside首面Print印刷Probepoint针床测点Process工序Processflow工序流程ProductPlanningDept.生产计划部Production生产板Profile外形Profiling外形加工ProfilingProcess外形加工ProjectNo.产品编号PTHThermalSeressTestPTH热冲击测试PTH(PlatingThroughHole)沉铜Pullaway拉离Punch啤模Punching冲切PunchingMouldDrawing啤模图形QqQAAudit品质审计QA(QuanlityAssurance)品质部QuadPaltPack(QFP)四边扁平林整器件Quality质量Quantity数量RrRawMaterialUtilization原材料利用率Recall回收Rectifier整流器Registermark对位点Registration重合点Remark备注Resin树脂ResinRecession流胶Resist抗蚀剂Resolution分辨率Rigid精密的Rollercoating涂覆Roughening粗化Roundpad圆盘Routing外形加工,铣板SsS/MMateri