PCB生产流程(深圳市英创立电子有限公司)

ABPELECTRONICSLIMITEDPCB生产流程分享制作:JustinYi审核:MikeZhengABPELECTRONICSLIMITEDUsageABPELECTRONICSLIMITEDProcess裁板钻孔PTH外层SESAOI外层钻靶孔压膜O/LSES棕黑化I/LDES电镀外层压合冲孔I/LAOI防焊化金ABPELECTRONICSLIMITED文字成型测试终检成仓ABPELECTRONICSLIMITED叠构（Stackup)铜箔厚度介层厚度材料ABPELECTRONICSLIMITEDABPELECTRONICSLIMITEDMinL/W&SpacingABPELECTRONICSLIMITED裁板ABPELECTRONICSLIMITED压膜ABPELECTRONICSLIMITEDI/LDESABPELECTRONICSLIMITED冲孔ABPELECTRONICSLIMITEDI/LAOIABPELECTRONICSLIMITED棕黑化ABPELECTRONICSLIMITED外层压合ABPELECTRONICSLIMITED钻靶孔ABPELECTRONICSLIMITEDPTHABPELECTRONICSLIMITED钻孔ABPELECTRONICSLIMITED外层ABPELECTRONICSLIMITED电镀ABPELECTRONICSLIMITED外层SESABPELECTRONICSLIMITEDSESAOIABPELECTRONICSLIMITED防焊前处理丝网印刷预烤，烘烤曝光显影ABPELECTRONICSLIMITED化金ABPELECTRONICSLIMITED文字ABPELECTRONICSLIMITED成型ABPELECTRONICSLIMITEDETABPELECTRONICSLIMITEDFQCABPELECTRONICSLIMITEDABPELECTRONICSLIMITEDTheEnd