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assemblyaidedarchitecturaldesign组装设计自动化activedevices有源器件augerelectronspectroscopy俄歇电子光谱法anylayerinnerviahole任意层内部导通孔AC交流电automaticopticalinspaction自动光学检测系统acceptablequalitylevel可接收质量水平application-specificintegratedcircuit特制（定）集成电路applicationspecificintegratedcircuit专用集成电路automatictestequipment自动测试设备buriedbumpinterconnectiontechnology嵌入凸块互连技术bumpedballgridarray凸块球栅阵列ballgridarray球栅阵列biochemicaloxygendemand生化需氧量quardflatpackwithbumpers带防冲档的QFPbismaleimide-triazineresin双马来酰亚胺三嗪树脂bumpedtapeautomatedbonding有凸块的带载自动安装build-upmultilayerprintedboard积层多层印制板controlledcollapsechipconnection控压芯片连接computer-aideddesign计算机辅助设计digitizing数字化router走（布）线器router布线器computer-aidedengineering计算机辅助工程computer-aidedmanufacturing计算机辅助制造CapDS能力详细说明书computer-aidedtest计算机辅助测试ceramicballgridarray陶瓷球栅阵列computercontrolleddisplay计算机控制显示ceramiccolumngridarray陶瓷柱栅阵列copper-cladlaminate覆铜箔层压板ceramicdualinlinepackage陶瓷双列直插式封装ceramicdual-inline-package陶瓷双列直插式封装chlorofluorocarbon氯氟代烃columngridarray柱栅阵列collimationhalfangle平行光半角chip-in-board插芯片板computerintegratedmanufacturing计算机集成制造chiponboard载芯片板chip-on-board载芯片板（印制板上直装芯片）chemicaloxygendemand化学需氧量chip-on-flexible挠性板上直装芯片chip-on-flex挠性板上直装芯片chip-on-glass玻璃板上直装芯片CAD计算机辅助设计CAE计算机辅助工程CAM计算机辅助制造CCB控压连（焊）接capabilityperformanceindex能力性能指数ceramicpingridarray陶瓷针式网格阵列capabilityperformancelower能力性能下限值capabilityperformanceupper能力性能上限值ceramicquadflatpack陶瓷四边扁平封装ceramicquadflatpackage陶瓷四边扁平封装chipscalepackage芯片级封装capabilitytextboard能力测试板coefficientofthermalexpansion热膨胀系数compositetestpattern综合测试图形capabilitytextsegment能力测试板分块CDS交易详细说明书dimpledballgridarray微凹球栅阵列directchipattaching直接芯片贴装dualinlinepackage双列直插式封装distributednumericalcontrol分布式数字控制dissolvedoxygen溶氧量（溶解氧）deliveredpanel发货拼板destructivephysicalanalysis破坏性分析detailedspecification详细规范double-sidedprintedboard双面印制板electrodepositedcopperfoil电解铜箔electricdesignautomation电子设计自动化engineeringdesignautomation工程设计自动化EnvironmentalManagementSystem环境管理系统electromagneticinterference电磁干扰ElectronProbeMicroAnalysis电子探测微量分析法epoxidewovenglassfabriccopper-cladlaminates环氧玻璃布基覆铜箔板epoxidecellulosepapercopper-cladlaminates环氧纸质覆铜箔板ElectronSpectroscopyforChemicalAnalysis光电子分光法（电子光谱化学分析法）flipchipbonding倒芯片连（焊）接flipchippackage倒芯片封装perfluorinatedethylene-propylenecopolymerfilm聚全氟乙烯丙烯薄膜flexibleflatcable挠性扁平电缆failuredigit失效数（位）filmonframe框架成膜flexibleprintedcircuit挠性印制电路finepitchdevices精细节距器件finepitchtechnology精细节距技术generalspecification一般规格书integratedcircuit集成电路inner-leadbond内引线连（焊）接inner-leadbond内引线连（焊）接IR红外再流焊infraredreflow红外回流焊internationalorganizationforstandardization国际化标准化组织individualtestpattern单独测试图形individualtestspecimen单独试样just-time即时（制造）fatigue-strengthreductionfactor疲劳强度降低系数knowngoodassembly已知好组装件knowngoodassembly确认好的组装knowngoodboard已知好板leadlessceramicchipcarrier无引线陶瓷芯片载体leadedceramicchipcarrier有引线陶瓷芯片载体lowenergyelectrondiffraction低能电子辐射landgridarray焊盘网格阵列leastmaterialconditon最小实体状态large-scaleintegration大规模集成电路metalballgridarray金属球栅阵列multichipmodule多芯片模块ceramicsubstrateversionofmultichipmodule多芯片模块陶瓷基数板multichipmodule-ceramic陶瓷多芯片模块depositionthinfilmsubstrateversionofmultilayermodule多芯片模块薄膜基板multichipmodule-deposited沉积多芯片模块laminatesubstrateversionofmultichipmodule多芯片模块层压基板machinedescriptionformat机器描述格式multi-layeredfilmsubstrate多层膜基板moldedinterconnectiondevice模塑互连设备multilayerprintedboard多层印制板maximummaterialcondition最大材料状态metalorganicchemicalvapordeposition有机金属化学气相沉积metalquadflatpackage金属四边扁平封装MaterialSafetyDataSheet材料完全数据单minimumspanningtree最小生成树numericalcontrol（数学）数控numericalcontrol数控numericalcontrol（机械）数控computernumericalcontrol计算机数值控制oxygenindex氧指数outer-leadbond外引线连接outer-leadbond外引线连（焊）接organicsolderabilityreservatives有机保护剂padarraycarrier焊盘阵列载体printedboard印制板plasticballgridarray塑封球栅阵列printedcircuitboard印制电路板postdesignprocessing设计后处理polyesterfilm聚酯薄膜pingridarray针栅阵列phenoliccellulosepapercopper-cladlaminates酚醛纸质覆铜箔板polyimidefilm聚酰亚胺薄膜plasticleadedchipcarrier塑封有引线芯片载体plasticleadedchipcarriers塑封有引线芯片载体plasticquadflatpakage塑封四边扁平封装periodicreversecurrent周期性反电流polytetrafluoetylene聚四氟乙烯platedthroughhole镀通孔（孔金属化）physicalvapordeposition物理蒸镀printedwiringboard印制线路板quadflatI-leadedpackage四边扁平I-引线封装quadflatJ-leadedpackage四边扁平J-引线封装quadflatnon-leadedpackage四边扁平无引线封装quadflatpack四边扁平封装器件BQFP带防冲挡的四边扁平封装器件rolledannealedcopperfoil压延退火铜箔resincoatedcopperfoil涂树脂铜箔insulatedlayer绝缘层reliabilityindex可靠性指数riskmanagementfactor风险管理系数singal-to-noiseratio信噪比studbumpbonding螺柱形连（焊）接solderballcarrier焊料球载体scannedbeamlaminography断层扫描soldercolumncarrier焊料柱载体singlechipmodule单芯片模块singlechippackage单芯片封装shrinkdualinlinepackage缩小型双列直插式封装soldergridarray焊料网格阵列studgridarray螺柱网格阵列singleinlinememorymodule单列直插式存储模块secondaryionmassspectroscopy二次离子质量分析法singleinlinepackage单列直插式封装surfaceinsulationresistance表面绝缘电阻surfacelaminarcircuit表面层合电路板solidlogictechnology固态逻辑电路技术solderresist、soldermask阻焊剂surfacemountedassemblys表面组装组件surfacemountcomponent表面组装元件surfacemountdevices表面组装器件soldermaskonbarecopper裸铜覆阻焊工艺surfacemounttechnology表面组装技术smalloutlinediode小外形二极管silicononinsulator绝缘体上（的）硅smalloutlineI-leadedpackage小外形I-引脚封装smalloutlinel-leaded