PEM-INST-001(塑封微电路选择、筛选及鉴定程序)

NASA/TP—2003–212244PEM-INST-001:InstructionsforPlasticEncapsulatedMicrocircuit(PEM)Selection,Screening,andQualificationPreparedby:Dr.AlexanderTeverovskyandDr.KusumSahuReviewedby:Dr.HenningLeideckerApprovedby:DarrylLakinsNationalAeronauticsandSpaceAdministrationGoddardSpaceFlightCenterGreenbelt,Maryland20771June2003TheNASASTIProgramOffice…inProfileSinceitsfounding,NASAhasbeendedicatedtotheadvancementofaeronauticsandspacescience.TheNASAScientificandTechnicalInformation(STI)ProgramOfficeplaysakeypartinhelpingNASAmaintainthisimportantrole.TheNASASTIProgramOfficeisoperatedbyLangleyResearchCenter,theleadcenterforNASA’sscientificandtechnicalinformation.TheNASASTIProgramOfficeprovidesaccesstotheNASASTIDatabase,thelargestcollectionofaeronauticalandspacescienceSTIintheworld.TheProgramOfficeisalsoNASA’sinstitutionalmechanismfordisseminatingtheresultsofitsresearchanddevelopmentactivities.TheseresultsarepublishedbyNASAintheNASASTIReportSeries,whichincludesthefollowingreporttypes:•TECHNICALPUBLICATION.ReportsofcompletedresearchoramajorsignificantphaseofresearchthatpresenttheresultsofNASAprogramsandincludeextensivedataortheoreticalanalysis.Includescompilationsofsignificantscientificandtechnicaldataandinformationdeemedtobeofcontinuingreferencevalue.NASA’scounterpartofpeer-reviewedformalprofessionalpapersbuthaslessstringentlimitationsonmanuscriptlengthandextentofgraphicpresentations.•TECHNICALMEMORANDUM.Scientificandtechnicalfindingsthatarepreliminaryorofspecializedinterest,e.g.,quickreleasereports,workingpapers,andbibliographiesthatcontainminimalannotation.Doesnotcontainextensiveanalysis.•CONTRACTORREPORT.ScientificandtechnicalfindingsbyNASA-sponsoredcontractorsandgrantees.•CONFERENCEPUBLICATION.Collectedpapersfromscientificandtechnicalconferences,symposia,seminars,orothermeetingssponsoredorcosponsoredbyNASA.•SPECIALPUBLICATION.Scientific,technical,orhistoricalinformationfromNASAprograms,projects,andmission,oftenconcernedwithsubjectshavingsubstantialpublicinterest.•TECHNICALTRANSLATION.English-languagetranslationsofforeignscientificandtechnicalmaterialpertinenttoNASA’smission.SpecializedservicesthatcomplementtheSTIProgramOffice’sdiverseofferingsincludecreatingcustomthesauri,buildingcustomizeddatabases,organizingandpublishingresearchresults.evenprovidingvideos.FormoreinformationabouttheNASASTIProgramOffice,seethefollowing:•AccesstheNASASTIProgramHomePageat•[e-mail]•FaxyourquestiontotheNASAAccessHelpDeskat(301)621-0134•TelephonetheNASAAccessHelpDeskat(301)621-0390•Writeto:NASAAccessHelpDeskNASACenterforAeroSpaceInformation7121StandardDriveHanover,MD21076–1320NASA/TP—2003–212244PEM-INST-001:InstructionsforPlasticEncapsulatedMicrocircuit(PEM)Selection,Screening,andQualificationPreparedby:Dr.AlexanderTeverovskyandDr.KusumSahu,GoddardSpaceFlightCenter,Greenbelt,MDReviewedby:Dr.HenningLeidecker,GoddardSpaceFlightCenter,Greenbelt,MDApprovedby:DarrylLakins,GoddardSpaceFlightCenter,Greenbelt,MDNationalAeronauticsandSpaceAdministrationGoddardSpaceFlightCenterGreenbelt,Maryland20771June2003PEM-INST-001ContentsPage1of44TABLEOFCONTENTSSECTIONPAGETableofContents1ListofTables2ListofFigures2Preface31.NASA/GSFCPEMsPolicy42.ProductAssuranceSystemforPEMs62.1Scope62.2ProductAssuranceSystem(Screening,Qualification,andDPA)62.3AdditionalEvaluations72.4RequirementsforPEMsbyProjectRiskLevels83.RequirementsforScreening94.RequirementsforQualification165.DestructivePhysicalAnalysis(DPA)205.1PurposesofDPAforPEMs205.2DPATestFlow205.3GSFCDPAProcedure225.3.1ExternalVisualExamination225.3.2Radiography225.3.3AcousticMicroscopy(C-SAM)225.3.4PackageLevelCross-Sectioning245.3.5InternalVisualInspection265.3.6BondPullTest275.3.7GlassivationLayerIntegrity285.3.8AssemblyExaminationUsingScanningElectronMicroscope(SEM)275.3.9DieMetallizationExaminationUsingSEM286.EvaluationAnalysis307.DeratingRequirements318.HandlingandStorageRequirements329.InformationFromManufacturers3310.AppendixA:BasisforGSFCPolicyontheUseofPEMs3511.AppendixB:ProductAssuranceMethodology43PEM-INST-001ContentsPage2of44LISTOFTABLESTABLEPAGETable1GSFCPEMRequirements8Table2GSFCScreeningRequirementsforPEMS10Table2ABurn-inandElectricalMeasurementRequirementsforPEMs13Table3GSFCQualificationRequirementsforPEMS18Table4DeratingRequirementsforPEMs31Table5ManufacturerInformation33LISTOFFIGURESFIGUREPAGEFigure1ProductAssuranceSystemforPEMsandItsRelationshipWithReliabilityDuringthePartLifespan7Figure2ATypicalTestFlowforScreeningofPEMs9Figure3ATypicalQualificationTestFlowforPEMs17Figure4ATypicalDPATestFlowforPEMs21Figure5PEMEvaluationProcess42Figure6GSFCProductAssuranceSystemforPEMs44PEM-INST-001PrefacePage3of44PREFACEPotentialusersofplasticencapsulatedmicrocircuits(PEMs)needtoberemindedthatunlikethemilitarysystemofproducingrobusthigh-reliabilitymicrocircuitsthataredesignedtoperformacceptablyinavarietyofharshenvironments,PEMsareprimarilydesignedforuseinbenignenvironmentswhereequipmentiseasilyaccessedforrepairorreplacement.Themet